Abstract: In forming a damascene interconnect made of a copper-containing metal on a barrier metal film made of a tantalum-containing metal, erosion is prevented during chemical mechanical polishing of the copper-containing metal film, by using a polishing slurry comprising at least an alkanolamine represented by general formula (1):

Abstract: The present invention relates to a slurry used for chemical mechanical polishing of a substrate having a copper-containing film at the surface, which slurry contains an abrasive, an oxidizing agent, and an adhesion-inhibitor preventing adhesion of a polishing product to a polishing pad. With the polishing slurry of the present invention, even when the copper-containing metal film to be polished has a large thickness or a large area and therefore the amount of the copper-containing metal to be polished is large, adhesion of polishing product to a polishing pad is suppressed and CMP can be completed satisfactorily in a single polishing operation without discontinuation.

Abstract: In chemical mechanical polishing of a copper metal film, contamination of a polishing pad may be prevented by using a slurry for chemical mechanical polishing consisting of &thgr;-alumina which mainly comprises secondary particles made of aggregated primary particles as polishing grains.

Abstract: A compact image formation apparatus forms an image on an image support, discharges the image support supporting an image to an outside of the apparatus and facilitates jam removal. The image formation apparatus has all operation portions for performing operations from the outside of the image formation apparatus located on three operation faces including a top face, a front, and either a left side face or a right side face of the image formation apparatus. A rear face and the other of the left side face or right side face of the image formation apparatus are set to be non-operation faces.