Patents by Inventor Shin To

Shin To has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10473479
    Abstract: An electronic device is provided and includes a camera configured to obtain an image, and a location information sensor configured to obtain (or sense) a current location of the electronic device. The electronic device further includes a direction information sensor configured to obtain (or sense) direction information about a direction in which the camera obtains the image and a memory configured to store information about the current location. A processor configured to operatively connect with the location information sensor, the direction information sensor, and the memory, may be further configured to obtain map information corresponding to the current location and arrange and display an orientation of the obtained map information with an orientation corresponding to the direction information. The processor may be configured to output the obtained map information together with a live video obtained by the camera.
    Type: Grant
    Filed: December 19, 2016
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Seung Yeon Chung, Jong Kyun Shin, Pragam Rathore, Ki Hyoung Son, Dong Oh Lee, Kyu Hyung Choi, Won Sik Lee, Hyun Yeul Lee
  • Patent number: 10475784
    Abstract: A semiconductor structure is provided. A substrate has a first conductivity type. A first well and a second well are formed in the substrate. The first well has a second conductivity type. The second well has the first conductivity type. A doped region is formed in the first well and has the second conductivity type. A gate structure is disposed over the substrate and overlaps a portion of the first well and a portion of the second well. An insulating layer is disposed over the substrate and is spaced apart from the gate structure. A conducting wire is disposed on the insulating layer and includes a first input terminal and a first output terminal. The first input terminal is configured to receive an input voltage. The first output terminal is electrically connected to the doped region.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: November 12, 2019
    Assignee: VANGUARD INTERNATIONAL SEMICONDUCTOR CORPORATION
    Inventors: Yu-Hao Ho, Shin-Cheng Lin, Wen-Hsin Lin, Cheng-Tsung Wu
  • Patent number: 10473880
    Abstract: A lens assembly includes a lens including an optical portion refracting light and a flange portion extended along a periphery of at least a portion of the optical portion, and a lens barrel accommodating the lens. The lens includes a first D-cut portion on one side surface of the flange portion spaced apart from the lens barrel and a second D-cut portion on another side surface of the flange portion spaced apart from the lens barrel, wherein the first D-cut portion and the second D-cut portion each include first inclined surfaces, and the first inclined surfaces are spaced apart from respective ends of the first D-cut portion and the second D-cut portion by a predetermined interval.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: November 12, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dong Shin Yang, Jong Gill Lee, Hwan Soo Park, Ju Sung Park, Sot Eum Seo
  • Patent number: 10475772
    Abstract: A three-dimensional (3D) integrated circuit (IC) die is provided. In some embodiments, a first IC die comprises a first semiconductor substrate, a first interconnect structure over the first semiconductor substrate, and a first hybrid bond (HB) structure over the first interconnect structure. The first HB structure comprises a HB link layer and a HB contact layer extending from the HB link layer to the first interconnect structure. A second IC die is over the first IC die, and comprises a second semiconductor substrate, a second HB structure, and a second interconnect structure between the second semiconductor substrate and the second HB structure. The second HB structure contacts the first HB structure. A seal-ring structure is in the first and second IC dies. Further, the seal-ring structure extends from the first semiconductor substrate to the second semiconductor substrate, and is defined in part by the HB contact layer.
    Type: Grant
    Filed: December 11, 2018
    Date of Patent: November 12, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yi-Shin Chu, Kuan-Chieh Huang, Pao-Tung Chen, Shuang-Ji Tsai, Yi-Hao Chen, Feng-Kuei Chang
  • Patent number: 10477680
    Abstract: The present invention relates to an ink composition for light sintering, a wiring board using the same, and a method of fabricating the wiring board. The present invention aims to provide formation of a wiring pattern without damage to thin and soft wiring boards such as a flexible printed circuit board. The present invention provides an ink composition for light sintering including copper oxide nanoparticles having copper oxide films, a reducing agent for reducing copper oxidized by light irradiation to form copper nanoparticles, a dispersing agent, a binder, and a solvent.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: November 12, 2019
    Assignee: Korea Electronics Technology Institute
    Inventors: Yoonjin Kim, Jinwoo Cho, Kwonwoo Shin, Yonggon Seo, Yeonwon Kim, Sanghyeon Jang, Namje Jo
  • Patent number: 10476308
    Abstract: A magnetic resonance wireless power transmission device capable of adjusting resonance frequency is disclosed. A wireless power transmission device according to an embodiment of the present invention comprises: a power amplifier for amplifying a wireless power signal using a driving frequency signal; a resonator for configuring a resonance tank and wirelessly transmitting, through magnetic resonance, the wireless power signal output from the power amplifier using a resonance frequency of the resonance tank; and a resonance control unit for controlling a duty ratio using a frequency applied to the resonator or a frequency signal generated by the resonator and adjusting the resonance frequency of the resonator.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: November 12, 2019
    Assignee: MAPS, Inc.
    Inventors: Jong-Tae Hwang, Hyun-Ick Shin, Dong-Su Lee, Jong-Hoon Lee, Sang-O Jeon, Ik-Gyoo Song, Dae-Ho Kim, Joon Rhee
  • Patent number: 10470640
    Abstract: Disclosed herein is a dishwasher including a main body provided with an open hole and a washing tub; a door configured to open or close the open hole; a door opening/closing member configured to open or close the open hole; an air curtain disposed in the main body, to operate a fan such that ambient air is sucked and the sucked air is discharged; a detector configured to detect information of the fan; and a controller configured to diagnose the failure of the fan based on the detected information of the fan, to control an operation of the door opening/closing member such that the door is opened at a predetermined open time and an open time of the door is delayed when the fan is a failure state, and to control an operation of the fan when the fan is a normal state during a drying operation.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Chan Ryu, Mi Ra Kim, Woo-Jin Shin
  • Patent number: 10475769
    Abstract: The present disclosure provides a semiconductor package, including a first semiconductor die layer having an active surface, a conductive contact electrically coupled to the active surface, a sidewall of the conductive contact being surrounded by an insulating layer, and a solder bump connected to the conductive contact. A seed layer is between the sidewall of the conductive contact and the insulating layer. The present disclosure provides a method for manufacturing a semiconductor package, the method including providing a carrier, forming an insulating layer over the carrier, debonding the carrier from the insulating layer, and exposing the conductive contact from the insulating layer by an etching operation.
    Type: Grant
    Filed: August 17, 2016
    Date of Patent: November 12, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Feng-Cheng Hsu, Jui-Pin Hung, Shin-Puu Jeng
  • Patent number: 10476037
    Abstract: Disclosed is a flexible display apparatus. The flexible display apparatus includes a display part, a first adhesive film, an optical film, a second adhesive film, and a window film sequentially stacked, and the second adhesive film has a water-vapor permeability of about 200 g/m2·24 hr or less, and the first adhesive film has a lower restoration force than the second adhesive film, as calculated by the Equation B set forth herein.
    Type: Grant
    Filed: April 19, 2017
    Date of Patent: November 12, 2019
    Assignees: Samsung SDI Co., Ltd., Samsung Electronics Co., Ltd.
    Inventors: Sung Hyun Mun, Byeong Do Kwak, Ji Won Kang, Il Jin Kim, Ji Ho Kim, Hyung Rang Moon, Seon Hee Shin, Gwang Hwan Lee, Jin Young Lee, Ik Hwan Cho, Jae Hyun Han, In Chul Hwang
  • Patent number: 10476449
    Abstract: A switched capacitor circuit includes a first main sampler circuit, a second main sampler circuit, a first replica sampler circuit, and a second replica sampler circuit. The first main sampler circuit samples a first input of a differential input, and generates a first output corresponding to the sampled first input based on a first reference voltage. The second main sampler circuit samples a second input of the differential input, and generates a second output corresponding to the sampled second input based on a second reference voltage. The first replica sampler circuit receives the first input, and holds the received first input based on the second reference voltage. The second replica sampler circuit receives the second input, and holds the received second input based on the first reference voltage.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Woo Kim, Sun-Jae Park, Eun Seok Shin, Seunghoon Lee
  • Patent number: 10471416
    Abstract: A method for oligomerizing an olefin comprising performing a multimerization reaction of an olefin in the presence of an oligomerization catalyst system comprising a ligand compound, a transition metal compound and a co-catalyst, and controlling a reaction temperature during the multimerization reaction in a range of 30 to 150° C., such that a product of the multimerization reaction comprising 1-hexene and 1-octene has a predetermined value of a weight ratio of 1-hexene and 1-octene selected from a range of 1:0.5 to 1:7.
    Type: Grant
    Filed: February 2, 2016
    Date of Patent: November 12, 2019
    Assignee: LG CHEM, LTD.
    Inventors: Seul Ki Im, Yong Ho Lee, Eun Ji Shin, Jin Young Park, Seok Pil Sa, Ki Soo Lee
  • Patent number: 10477284
    Abstract: Disclosed is a watermark embedding method. The method includes receiving an original image, generating a watermark image based on the selected watermark pattern, generating an alpha blended stego image by alpha blending the original image and the watermark image, and providing the alpha blended stego image, in which the watermark image is generated by considering at least one of allowable pixel value range and alpha value ? range of the watermark pattern applied to a first pixel of the original image, wherein the at least one of allowable pixel value range and alpha value ? range are determined by the difference of pixel value of the first pixel between the original image and the stego image by embedding the watermark pattern to the first pixel.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: November 12, 2019
    Assignee: MARKANY INC.
    Inventors: So Won Kim, Tai Yoon Lee, Min Soo Park, Ji Seop Moon, Dong Hwan Shin
  • Patent number: 10474282
    Abstract: An electronic device is provided. The electronic device includes a housing having a first face, a second face that faces a direction opposite to the first face, and a side face that encloses at least a portion of a space between the first face and the second face, a touch sensing circuit disposed within the housing, a communication circuit disposed within the housing, a transparent substrate that forms at least a portion of the first face, the second face, and the side face of the housing, at least one display disposed within the housing along at least a portion of the transparent substrate, a first conductive pattern disposed between the transparent substrate and the at least one display or inside the at least one display, and electrically connected with the touch sensing circuit, and a second conductive pattern disposed between the transparent substrate and the first conductive pattern, and electrically connected with the wireless communication circuit.
    Type: Grant
    Filed: March 14, 2017
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Sik Park, Jae-Young Shin, Seunggil Jeon, Chongyoon Chung, Dohyung Ha, Byoung-Uk Yoon, Hyun-Ju Hong
  • Patent number: 10472418
    Abstract: A use of prevention or treatment of lung cancer including an antibody specifically recognizing CD66c in lung cancer or its antigen-binding fragment and a chemotherapeutic agent is provided.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: November 12, 2019
    Assignee: Dinona
    Inventors: Kwon Pyo Hong, Mi Hyang Shin, Sangsoon Yoon, Gil Yong Ji, Yoo Ri Moon
  • Patent number: 10473716
    Abstract: A leakage current measurement circuit is provided. The leakage current measurement circuit includes a leakage generation circuit and a detection circuit. The leakage generation circuit generates a leakage current from a start time point and generates a leakage voltage signal having a voltage level that changes from an initial voltage based on the leakage current. The detection circuit generates a detection signal having an activation time, the detection signal being generated from the start time point to a detection time point, and the detection time point corresponding to when the voltage level of the leakage voltage signal reaches a target voltage.
    Type: Grant
    Filed: January 2, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ghil-Geun Oh, Yeon-Joong Shin, Da-Rae Jung
  • Patent number: 10471514
    Abstract: Provided is an efficient method for producing nickel powder from a solution containing a nickel ammine complex, the method including adding seed crystals to a solution containing a nickel ammine complex and subjecting the resulting mixture to hydrogen reduction under high temperatures and high pressures to produce nickel powder, which makes it possible to maintain the quality of the nickel powder produced and reduce the amount of the seed crystals used. The method for producing nickel powder is characterized by adding seed crystals and a dispersant having an anionic functional group to the solution containing a nickel ammine complex to form a mixture slurry, and subjecting the mixture slurry to pressurized hydrogen reduction treatment by blowing hydrogen into the mixture slurry in a high temperature and high pressure atmosphere to cause a reduction reaction, thereby reducing the nickel ammine complex in the mixture slurry to obtain nickel powder.
    Type: Grant
    Filed: February 9, 2015
    Date of Patent: November 12, 2019
    Assignees: KOCHI UNIVERSITY, NATIONAL UNIVERSITY CORPORATION, Sumitomo Metal Mining Co., Ltd.
    Inventors: Kazumichi Yanagisawa, Junhao Zhang, Osamu Ikeda, Hideki Ohara, Tomoaki Yoneyama, Yohei Kudo, Shin-ichi Heguri
  • Patent number: 10473241
    Abstract: The load flanks in the male threaded portion of the pin and the load flanks in the female threaded portion of the box have a flank angle of less than 0 degrees. The female threaded portion is divided into, in order from near the seal surface, an incomplete thread section and a complete thread section. In the female threaded portion, over the entire area including the two thread sections, roots collectively define a single tapered periphery. The incomplete thread section has a length of at least three times the thread pitch and has a thread height lower than a thread height of the complete thread section. The shoulder surfaces are in contact with each other, the seal surfaces are in contact with each other, and in the incomplete thread section, clearances are provided between the roots of the male threaded portion and the crests of the female threaded portion.
    Type: Grant
    Filed: January 9, 2015
    Date of Patent: November 12, 2019
    Assignees: NIPPON STEEL CORPORATION, VALLOUREC OIL AND GAS FRANCE
    Inventors: Keita Inose, Fumio Ota, Shin Ugai, Masaaki Sugino
  • Patent number: 10474286
    Abstract: Embodiments described herein is able to provide a touch display device, an active pen, a touch system, a touch circuit, and a pen recognition method capable of efficiently providing a display function, a touch-sensing function, and a pen-touch-sensing function.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: November 12, 2019
    Assignee: LG Display Co., Ltd.
    Inventors: SangHyuck Bae, BuYeol Lee, SeungRok Shin, CheolSe Kim, DeukSu Lee, Hyunwoo Jang, Jaeseung Kim, YoungGyu Kim, Hyunsuk Cho
  • Patent number: 10476013
    Abstract: An electronic apparatus includes a display panel having a display element and being configured to be folded or unfolded about a folding axis extending in a first direction, a window member disposed on the display panel, a first optical member disposed between the display panel and the window member, and a plurality of adhesive members disposed between the display panel and the window member. The adhesive members include a first adhesive member disposed on a surface of the display panel and having a first thickness and a second adhesive member disposed on a surface of the first optical member. The first thickness exceeds about 20% of a thickness of an adhesive member having a maximum thickness of the plurality of adhesive members, and the second thickness is smaller than about 125 micrometers.
    Type: Grant
    Filed: February 27, 2019
    Date of Patent: November 12, 2019
    Assignee: Samsung Display Co., Ltd.
    Inventors: Jaiku Shin, Hansun Ryou, Mansik Myeong, Soyoun Jung, Sungchul Choi
  • Patent number: D866500
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: November 12, 2019
    Assignee: LG Electronics Inc.
    Inventors: Jihoon Shin, Youngho Kim