Abstract: An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.

Abstract: In an embodiment, there is provided a method of operating an electrostatic chuck of a plasma processing apparatus. The electrostatic chuck has a base, a dielectric layer formed on the base, and a chuck main body mounted on the dielectric layer. In the method, a temperature difference between the temperature of the base and the temperature of the chuck main body is reduced in a state in which the chuck main body is attracted to the dielectric layer with a relatively small electrostatic attractive force. In a case where the temperature difference between the temperature of the base and the temperature of the chuck main body becomes equal to or less than a predetermined value, the chuck main body is fixed to the base via the dielectric layer by a relatively large electrostatic attractive force.

Abstract: A processing apparatus includes a chamber main body; a stage having therein a first passage for coolant and a space communicating with the first passage; a first pipeline having a first end portion inserted into the space to be connected to the first passage and a second end portion connected to a coolant supply mechanism; and a first sealing member provided at a gap between a wall surface confining the space and the first end portion. A second passage having one end and the other end is formed within the stage. The one end of the second passage is connected to the gap. The first sealing member is contacted with the wall surface at a side of the first passage with respect to the second passage. The processing apparatus comprises a second pipeline connected to the other end thereof; and a detecting device connected to the second pipeline.

Abstract: A temperature control method includes cooling an upper electrode and increasing a temperature of the upper electrode. A path having an inlet and an outlet is formed within the upper electrode. The upper electrode constitutes an evaporator. A compressor, a condenser and an expansion valve are connected in sequence between the outlet and the inlet of the path. A flow dividing valve is connected between an output of the compressor and the inlet to bypass the condenser and the expansion valve. In the cooling of the upper electrode, a coolant is supplied into the path via the compressor, the condenser and the expansion valve. In the increasing of the temperature of the upper electrode, the flow dividing valve is opened and the upper electrode is heated.

Abstract: A temperature control method includes cooling an upper electrode and increasing a temperature of the upper electrode. A path having an inlet and an outlet is formed within the upper electrode. The upper electrode constitutes an evaporator. A compressor, a condenser and an expansion valve are connected in sequence between the outlet and the inlet of the path. A flow dividing valve is connected between an output of the compressor and the inlet to bypass the condenser and the expansion valve. In the cooling of the upper electrode, a coolant is supplied into the path via the compressor, the condenser and the expansion valve. In the increasing of the temperature of the upper electrode, the flow dividing valve is opened and the upper electrode is heated.

Abstract: A heat exchange unit is disposed inside the loading table and exchanges heat using a refrigerant. A supply line is disposed between an output terminal of the condenser and an input terminal of the heat exchange unit and sends the refrigerant to the heat exchange unit. An expansion valve is disposed in the supply line. A vapor line is disposed between an output terminal of the compressor and an output terminal of the expansion valve. A flow dividing valve is disposed in the vapor line. A measurement device measures the temperature of the loading table. The control unit adjusts the heat input to the loading table and an opening degree of each of the expansion valve and the flow dividing valve based on the temperature of the loading table measured by the measurement device.

Abstract: A temperature adjustment method according to one exemplary embodiment is a temperature adjustment method of adjusting a temperature of a loading table on which a workpiece is loaded using a refrigerant. The step of increasing the temperature of the loading table includes a step of adjusting the temperature of the loading table to a first temperature by opening an expansion valve between an output terminal of a condenser and an input terminal of a heat exchange unit and adjusting an opening degree of the expansion valve, and a step of adjusting the temperature of the loading table to a second temperature by opening the expansion valve, inputting heat to the loading table, opening a flow dividing valve between an output terminal of a compressor and the input terminal of the heat exchange unit, and adjusting an opening degree of the flow dividing valve.

Abstract: The step of removing the reaction product includes a step of loading a dummy wafer on the loading table, a step of increasing the temperature of the loading table, and a step of removing the reaction product after increasing the temperature of the loading table. In the step of increasing the temperature of the loading table, the temperature of the loading table is increased by opening an expansion valve between an output terminal of a condenser and an input terminal of the heat exchange unit, inputting heat to the loading table, opening a flow dividing valve between an output terminal of a compressor and the input terminal of the heat exchange unit, and adjusting an opening degree of the flow dividing valve.

Abstract: A cooling system configured to circulate a coolant under a placing surface of a placing table includes a heat exchange unit within the placing table and configured to perform a heat exchange by the coolant via the placing surface; a chiller unit connected to the heat exchange unit. The heat exchange unit comprises a reservoir chamber configured to store the coolant; and an evaporation chamber configured to evaporate the coolant stored in the reservoir chamber. The reservoir chamber is connected to the chiller unit and communicates with the evaporation chamber. The evaporation chamber is connected to the chiller unit, extended along the placing surface and includes discharge holes. The discharge holes are arranged such that the coolant is discharged toward a heat transfer wall as a placing surface-side inner wall of the evaporation chamber. The discharge holes are dispersed within the placing surface.

Abstract: A mounting table includes an electrostatic chuck having a mounting surface and a backside opposite to the mounting surface, a first through hole being formed in the mounting table; a base joined to the backside of the electrostatic chuck and having a second through hole in communication with the first through hole; a lifter pin which is received in a pin hole formed by the first through hole and the second through hole, the lifter pin being movable up and down to protrude beyond and retract below the mounting surface. An upper end portion of the lifter pin has a shape in which a diameter decreases toward a lower end of the lifter pin to correspond to a shape of the upper end portion of the pin hole. The upper end portion of the lifter pin is in surface contact with the upper end portion of the pin hole.

Abstract: A processing apparatus includes a chamber main body; a stage having therein a first passage for coolant and a space communicating with the first passage; a first pipeline having a first end portion inserted into the space to be connected to the first passage and a second end portion connected to a coolant supply mechanism; and a first sealing member provided at a gap between a wall surface confining the space and the first end portion. A second passage having one end and the other end is formed within the stage. The one end of the second passage is connected to the gap. The first sealing member is contacted with the wall surface at a side of the first passage with respect to the second passage. The processing apparatus comprises a second pipeline connected to the other end thereof; and a detecting device connected to the second pipeline.

Abstract: In an embodiment, there is provided a method of operating an electrostatic chuck of a plasma processing apparatus. The electrostatic chuck has a base, a dielectric layer formed on the base, and a chuck main body mounted on the dielectric layer. In the method, a temperature difference between the temperature of the base and the temperature of the chuck main body is reduced in a state in which the chuck main body is attracted to the dielectric layer with a relatively small electrostatic attractive force. In a case where the temperature difference between the temperature of the base and the temperature of the chuck main body becomes equal to or less than a predetermined value, the chuck main body is fixed to the base via the dielectric layer by a relatively large electrostatic attractive force.

Abstract: An electrostatic chuck of an embodiment includes a base, a dielectric layer, and a chuck main body. The dielectric layer is provided on the base, and is fixed to the base. The chuck main body is mounted on the dielectric layer. The chuck main body has a ceramic main body, a first electrode, a second electrode, and a third electrode. The ceramic main body has a substrate mounting region. The first electrode is provided in the substrate mounting region. The second electrode and the third electrode form a bipolar electrode. The second electrode and the third electrode are provided in the ceramic main body, and are provided between the first electrode and the dielectric layer.

Abstract: In a processing apparatus, a cooling table in which a coolant is flown includes first to third regions, and a path group of the coolant. The first region is provided at a center portion of the cooling table. The second region is provided to surround the first region. The third region is provided to surround the first and the second regions. The path group includes first to third paths. The first path to the third path are provided in the first region to the third region, respectively. A pipeline system of the coolant includes a first valve group and a second valve group. The first path and the second path, and the second path and the third path are connected via the first valve group. The chiller unit and the path group are connected via the second valve group.

Abstract: A cooling table includes a first portion, a second portion, a first path, a second path and a third path. An electrostatic chuck is provided on the first portion, and the first portion is provided on the second portion. The first path is provided within the first portion, and the second path is provided within the second portion. The third path is connected to the first path and the second path. A chiller unit is connected to the first path and the second path. The first path is extended within the first portion along the electrostatic chuck, and the second path is extended within the second portion along the electrostatic chuck. A coolant outputted from the chiller unit passes through the first path, the third path and the second path in sequence, and then is inputted to the chiller unit.

Abstract: A speaker system includes: a first speaker unit having a predetermined directivity angle in the horizontal direction; and a pair of second speaker units which are disposed opposite to each other with the first speaker unit sandwiched between them when viewed in the vertical direction and which have a directivity angle in the horizontal direction greater than the directivity angle of the first speaker unit, wherein distances from the center of the first speaker unit to the centers of the pair of second speaker units are equal to each other, and the first speaker unit and the pair of second speaker units are disposed so as to face toward the same direction.

Abstract: A mounting table includes an electrostatic chuck having a mounting surface and a backside opposite to the mounting surface, a first through hole being formed in the mounting table; a base joined to the backside of the electrostatic chuck and having a second through hole in communication with the first through hole; a lifter pin which is received in a pin hole formed by the first through hole and the second through hole, the lifter pin being movable up and down to protrude beyond and retract below the mounting surface. An upper end portion of the lifter pin has a shape in which a diameter decreases toward a lower end of the lifter pin to correspond to a shape of the upper end portion of the pin hole. The upper end portion of the lifter pin is in surface contact with the upper end portion of the pin hole.

Abstract: A TV stand supports a TV with a downfiring audio speaker. To reflect the sound from the speaker ninety degrees so the sound propagates away from the plane of the TV toward a viewer, the stand has a top portion with a flat or curved surface which is canted downwardly from rear to front.

Abstract: A speaker system includes: a first speaker unit having a predetermined directivity angle in the horizontal direction; and a pair of second speaker units which are disposed opposite to each other with the first speaker unit sandwiched between them when viewed in the vertical direction and which have a directivity angle in the horizontal direction greater than the directivity angle of the first speaker unit, wherein distances from the center of the first speaker unit to the centers of the pair of second speaker units are equal to each other, and the first speaker unit and the pair of second speaker units are disposed so as to face toward the same direction.