Patents by Inventor Shing-Chao Chen

Shing-Chao Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • RDL-first packaging process
    Patent number: 9425178
    Abstract: A method includes forming a first plurality of Redistribution Lines (RDLs) over a carrier, and bonding a device die to the first plurality of RDLs through flip-chip bonding. The device die and the first plurality of RDLs are over the carrier. The device die is molded in a molding material. After the molding, the carrier is detached from the first plurality of RDLs. The method further includes forming solder balls to electrically couple to the first plurality of RDLs, wherein the solder balls and the device die are on opposite sides of the first plurality of RDLs.
    Type: Grant
    Filed: July 8, 2014
    Date of Patent: August 23, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Wei Lin, Shing-Chao Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu
  • Die Bonder and Methods of Using the Same
    Publication number: 20160190088
    Abstract: A method includes bringing into contact respective first sides of a plurality of dies and a die attach film on a major surface of a carrier wafer, and simultaneously heating portions of the die attach film contacting the plurality of dies in order to simultaneously bond the plurality of dies to the die attach film.
    Type: Application
    Filed: April 14, 2015
    Publication date: June 30, 2016
    Inventors: Chen-Hua Yu, Shing-Chao Chen, Chung-Shi Liu, Ming-Da Cheng
  • RDL-FIRST PACKAGING PROCESS
    Publication number: 20160013172
    Abstract: A method includes forming a first plurality of Redistribution Lines (RDLs) over a carrier, and bonding a device die to the first plurality of RDLs through flip-chip bonding. The device die and the first plurality of RDLs are over the carrier. The device die is molded in a molding material. After the molding, the carrier is detached from the first plurality of RDLs. The method further includes forming solder balls to electrically couple to the first plurality of RDLs, wherein the solder balls and the device die are on opposite sides of the first plurality of RDLs.
    Type: Application
    Filed: July 8, 2014
    Publication date: January 14, 2016
    Inventors: Chih-Wei Lin, Shing-Chao Chen, Meng-Tse Chen, Ming-Da Cheng, Chung-Shi Liu