Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

Abstract: A circuit carrier structure includes an inner circuit structure, at least one first circuit layer, and at least one heat dissipating structure. The inner circuit structure has a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface of the inner circuit structure. The heat dissipating structure is disposed in the first circuit layer. The heat dissipating structure includes a first heat dissipating pattern, a second heat dissipating pattern and an interlayer metal layer. The first heat dissipating pattern is embedded in the corresponding first circuit layer. The second heat dissipating pattern is disposed on the first heat dissipating pattern. The interlayer metal layer is disposed between the first heat dissipating pattern and the second heat dissipating pattern. A manufacturing method of the circuit carrier structure is also provided.

Abstract: A circuit carrier structure includes an inner circuit structure, at least one first circuit layer, and at least one heat dissipating structure. The inner circuit structure has a first surface and a second surface opposite to the first surface. The first circuit layer is disposed on the first surface of the inner circuit structure. The heat dissipating structure is disposed in the first circuit layer. The heat dissipating structure includes a first heat dissipating pattern, a second heat dissipating pattern and an interlayer metal layer. The first heat dissipating pattern is embedded in the corresponding first circuit layer. The second heat dissipating pattern is disposed on the first heat dissipating pattern. The interlayer metal layer is disposed between the first heat dissipating pattern and the second heat dissipating pattern. A manufacturing method of the circuit carrier structure is also provided.

Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

Abstract: Technologies for wireless network devices with surface-link antenna systems mounted on exterior surfaces of buildings are described. One wireless network device includes a housing with a circuit board and a first antenna port. A processor, a first antenna, a first wireless local area network (WLAN) radio, and a second WLAN radio are disposed on the circuit board. The first WLAN radio communicates with a radio of a client device using the first antenna over a first line-of-sight (LOS) or non-LOS wireless link (e.g., 2.4 GHz) inside the building. The second WLAN radio communicates with a radio of a second wireless network device using the second antenna over a second LOS wireless link (e.g., 5 GHz) that is external to the building. The first antenna is located inside the building and the second antenna is located along an exterior surface of the building.

Abstract: Technologies directed to a wireless network device with a single hardware architecture that supports multiple devices roles through software configuration are described. One wireless network device includes a housing with an RF connector and a circuit board with a first radio coupled to an internal antenna and a second radio coupled to an external antenna via the RF connector. The second antenna is mounted on an exterior surface of the building and coupled to the RF connector via an RF cable. The wireless network device establishes a first wireless link between the first radio and a radio of a second device via the first antenna and a second wireless link between the second radio and a radio of a third device via the second antenna. The second device can be a second wireless network device that is programmed to operate as a gateway, the gateway being mounted outside of the building.

Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

Abstract: This document describes techniques and systems that enable a range extender device. The techniques and systems include a user device that includes a housing with an audio sensor, a heat sink assembly, a circuit board assembly, and a speaker assembly positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally-cylindrical vertical wall via rounded corners. The heat sink assembly includes a heat sink and one or more antennas positioned proximate to an inner surface of the vertical wall. The circuit board assembly is positioned within the housing and proximate to the heat sink assembly, and the speaker assembly is positioned within the housing and connected to the circuit board assembly. Also, a light ring assembly is connected to a bottom exterior surface of the bottom housing member.

Abstract: This document describes an access point device and associated systems and methods. The techniques and systems include an access point device that includes a housing with an antenna carrier, a circuit board assembly, a heat sink, and a heat shield positioned within the housing. The housing includes a top housing member connected to a bottom housing member. The top housing member includes a concave-down top-end portion connected to a generally cylindrical vertical wall via rounded corners. The antenna carrier supports multiple antennas positioned proximate to an inner surface of the vertical wall. The heat sink is positioned between the antenna carrier and the circuit board assembly. The circuit board assembly is positioned between the heat shield and the heat sink, and the heat shield is positioned between the circuit board assembly and the bottom housing member.

Abstract: Disclosed embodiments relate to computing devices simultaneously pairing with multiple near-field communication (NFC) devices. In one example, a system includes a processor and a touchscreen having a top layer logically partitioned into N zones overlaying a three-dimensional antenna having multiple layers together including at least N NFC antennae, and wherein the processor is configured to: map each of the N zones to one or more closest NFC antennae, display a user interface on the top layer, and when each of two or more NFC devices touches a respective touchscreen zone, select an NFC antenna to establish a peer-to-peer connection with the NFC device, read NFC tag data from the NFC device, and pass the NFC tag data to the application.

Abstract: Technologies directed to a wireless device with a Radio Frequency (RF) Decibel-Scaled Wireless Interference Detector that provides accurate energy readings of a channel through decibel-scaled output voltage are described. One method of the wireless device includes receiving a first RF signal via an antenna and converting the first RF signal to a multiple samples using a sampling rate, each sample including a digital value of a decibel-scaled output voltage. The method converts each of the samples to an energy value using a voltage-to-energy lookup table and determines a congestion level of a channel using the energy values.

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

Abstract: An access point includes an access point body and a circuit board supported by the access point body and optionally configured to provide a residential gateway to a network. The circuit board includes a plurality of multi-dipole antennas connected to the circuit board and arranged around a longitudinal axis defined by the circuit board. The access point also includes a reflector disposed on the circuit board and a directional antenna connected to the circuit board and arranged adjacent to the reflector.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The boot system includes the intelligent robot and a mobile device. The intelligent robot includes an activating module, a wireless communication module and an image capturing device. The central processing unit is electrically connected to the activating module, the wireless communication module and the image capturing module. The mobile device includes an input interface, a first memory and a display. The input interface includes a username frame and a password frame. The username frame is configured to receive a username. The password frame is configured to receive a password. When the username and the password received by the input interface is compliant with the username and the password of the mobile device, the display indicates a verification code. The verification code includes a login username and a login password for establishing wireless network communication.

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

Abstract: Disclosed is a boot system and boot method for an intelligent robot. The intelligent robot includes a central processing unit, an activating module, a memory and a wireless communication module. The central processing unit is electrically connected to the activating module, the memory and the wireless communication module. When the username and password stored in the memory is not compliant with the username and password of a wireless network, the intelligent robot enters a hotspot mode as a hotspot. A mobile device connects to the intelligent robot through the hotspot. The wireless communication module receives a login username and a login password from the mobile device. The intelligent robot connects to the wireless network for establishing the wireless network connection by the login username and the login password for entering a login mode.

Abstract: Technologies for wireless network devices with surface-link antenna systems mounted on exterior surfaces of buildings are described. One wireless network device includes a housing with a circuit board and a first antenna port. A processor, a first antenna, a first wireless local area network (WLAN) radio, and a second WLAN radio are disposed on the circuit board. The first WLAN radio communicates with a radio of a client device using the first antenna over a first line-of-sight (LOS) or non-LOS wireless link (e.g., 2.4 GHz) inside the building. The second WLAN radio communicates with a radio of a second wireless network device using the second antenna over a second LOS wireless link (e.g., 5 GHz) that is external to the building. The first antenna is located inside the building and the second antenna is located along an exterior surface of the building.

Abstract: A circuit board is disposed on a substrate and includes a dielectric layer and a circuit layer. The dielectric layer is disposed on the substrate. The circuit layer is embedded in the dielectric layer and has plural traces. Each of the traces has a first top surface and a first bottom surface which are opposite to each other, and the first bottom surface faces toward the substrate. The first top surface is exposed from the dielectric layer, and an area of a vertical projection of the first top surface on the substrate is smaller than an area of a vertical projection of the first bottom surface on the substrate.

Abstract: This application is directed to a speaker device having a rounded enclosure. The rounded enclosure includes two housing elements that are coupled to each other and have a substantially continuous transition. The rounded enclosure has a circular cross section defined by a first radius. A first housing element includes and extends past the circular cross section, and a second housing element has a second maximum radius that is smaller than the first radius. A speaker unit and a circuit board are arranged within the rounded enclosure. The circuit board is electrically coupled to the speaker unit. At least a portion of the first housing element includes perforations configured to enable transmission of sound generated by the speaker unit out of the speaker device. The second housing element has a power connector that is electrically coupled to the circuit board and is configured to receive power from an external power supply.

Abstract: This application is directed to a compact voice-activated electronic device with speakers and electronic components and a dual waveguide/heatsink structure configured to direct sound from the speakers to the outside of the device and to dissipate to the outside of the device heat from the electronic components.