Patents by Inventor Shingo Eguchi
Shingo Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10903453Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.Type: GrantFiled: August 9, 2019Date of Patent: January 26, 2021Inventors: Shunpei Yamazaki, Shingo Eguchi
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Publication number: 20200403028Abstract: One embodiment of the present invention is a display device including a first insulating layer, a second insulating layer, a first transistor, a second transistor, a first light-emitting diode, a second light-emitting diode, and a color conversion layer. The first insulating layer is over the first transistor and the second transistor. The first light-emitting diode and the second light-emitting diode are over the first insulating layer. The color conversion layer is over the second light-emitting diode. The color conversion layer is configured to convert light emitted from the second light-emitting diode into a light having a longer wavelength. The first transistor and the second transistor each include a metal oxide layer and a gate electrode. The metal oxide layer includes a channel formation region. A top surface of the gate electrode is level or substantially level with a top surface of the second insulating layer.Type: ApplicationFiled: June 9, 2020Publication date: December 24, 2020Inventors: Koji KUSUNOKI, Shingo EGUCHI, Takayuki IKEDA
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Publication number: 20200395576Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.Type: ApplicationFiled: September 1, 2020Publication date: December 17, 2020Applicant: Semiconductor Engery Laboratory Co., Ltd.Inventors: Shunpei Yamazaki, Shingo Eguchi
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Publication number: 20200388790Abstract: A novel functional panel that is highly convenient, useful, or reliable is provided. The functional panel includes a pixel including a microlens array and a light-emitting device. The light-emitting device emits first light. The microlens array collects the first light. The microlens array includes a plurality of microlenses. The microlenses have a cross section having a shape with which they can be arranged with a filling factor higher than that of a circle on a plane parallel to the light-emitting device. The microlenses have a curved surface on a plane orthogonal to the plane parallel to the light-emitting device. The convex side of the curved surface faces the light-emitting device.Type: ApplicationFiled: May 28, 2020Publication date: December 10, 2020Inventors: Shunpei YAMAZAKI, Shingo EGUCHI, Koji KUSUNOKI
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Publication number: 20200365827Abstract: A novel display panel that is highly convenient or reliable is provided. The display panel includes a first region, a second region, and a display region; the second region includes part of the display region; the second region is provided with a first component; the second region can be bent with the first component facing outward; the first component includes a first elastic body and a second elastic body; the second elastic body includes an end portion part or the whole of which is covered with the first elastic body; and the second elastic body has a higher elastic modulus than the first elastic body.Type: ApplicationFiled: November 19, 2018Publication date: November 19, 2020Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei YAMAZAKI, Hiroki ADACHI, Shingo EGUCHI
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Publication number: 20200363676Abstract: A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer aide.Type: ApplicationFiled: July 14, 2020Publication date: November 19, 2020Inventors: Shingo EGUCHI, Hideaki KUWABARA, Kazune YOKOMIZO
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Publication number: 20200357863Abstract: Display unevenness in a display panel is suppressed. A display panel with a high aperture ratio of a pixel is provided. The display panel includes a first pixel electrode, a second pixel electrode, a third pixel electrode, a first light-emitting layer, a second light-emitting layer, a third light-emitting layer, a first common layer, a second common layer, a common electrode, and an auxiliary wiring. The first common layer is positioned over the first pixel electrode and the second pixel electrode. The first common layer has a portion overlapping with the first light-emitting layer and a portion overlapping with the second light-emitting layer. The second common layer is positioned over the third pixel electrode. The second common layer has a portion overlapping with the third light-emitting layer.Type: ApplicationFiled: November 19, 2018Publication date: November 12, 2020Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Daiki NAKAMURA, Shingo EGUCHI, Tomoya AOYAMA, Nozomu SUGISAWA, Junya MARUYAMA, Kazuhiko FUJITA, Masataka SATO, Susumu KAWASHIMA
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Patent number: 10816841Abstract: A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side.Type: GrantFiled: August 3, 2017Date of Patent: October 27, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shingo Eguchi, Hideaki Kuwabara, Kazune Yokomizo
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Publication number: 20200243371Abstract: To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.Type: ApplicationFiled: April 16, 2020Publication date: July 30, 2020Inventors: Seiji YASUMOTO, Masataka SATO, Shingo EGUCHI, Kunihiko SUZUKI
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Publication number: 20200243626Abstract: A flexible input/output device and an input/output device having high resistance to repeated bending are provided. The input/output device includes a first flexible substrate, a first insulating layer over the first substrate, a first transistor over the first insulating layer, a light-emitting element over and electrically connected to the first transistor and including an EL layer between first and second electrodes, a first bonding layer over the light-emitting element, a sensing element and a second transistor over the first bonding layer and electrically connected to each other, a second insulating layer over the sensing element and the second transistor, and a second flexible substrate over the second insulating layer. In the input/output device, B/A is greater than or equal to 0.7 and less than or equal to 1.7, where A is a thickness between the EL layer and the first insulating layer and B is a thickness between the EL layer and the second insulating layer.Type: ApplicationFiled: April 10, 2020Publication date: July 30, 2020Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shingo EGUCHI, Shunpei YAMAZAKI
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Patent number: 10636692Abstract: To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.Type: GrantFiled: March 1, 2018Date of Patent: April 28, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Seiji Yasumoto, Masataka Sato, Shingo Eguchi, Kunihiko Suzuki
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Patent number: 10622426Abstract: A flexible input/output device and an input/output device having high resistance to repeated bending are provided. The input/output device includes a first flexible substrate, a first insulating layer over the first substrate, a first transistor over the first insulating layer, a light-emitting element over and electrically connected to the first transistor and including an EL layer between first and second electrodes, a first bonding layer over the light-emitting element, a sensing element and a second transistor over the first bonding layer and electrically connected to each other, a second insulating layer over the sensing element and the second transistor, and a second flexible substrate over the second insulating layer. In the input/output device, B/A is greater than or equal to 0.7 and less than or equal to 1.7, where A is a thickness between the EL layer and the first insulating layer and B is a thickness between the EL layer and the second insulating layer.Type: GrantFiled: January 4, 2018Date of Patent: April 14, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shingo Eguchi, Shunpei Yamazaki
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Patent number: 10621800Abstract: At least one embodiment may provide a remote server that can determine occurrence of an abnormal condition in a power transmission system without using a threshold value in advance. There may be provided a remote server that receives operating and non-operating information of a working unit, information on a working date, information on a traveling speed, and information on a load factor of an engine, respectively from a combine harvester. The remote server calculates for each predetermined period an average of the engine load factor while the traveling speed is at or above a predetermined traveling speed with all working units in non-operation. If the average during a predetermined period is in a status of a predetermined difference from the average up to the predetermined period, the remote server determines that a moving power transmission mechanism of a traveling system of the combine harvester is in an abnormal condition.Type: GrantFiled: August 12, 2014Date of Patent: April 14, 2020Assignee: YANMAR CO., LTD.Inventors: Takeshi Ouchida, Shingo Eguchi
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Patent number: 10583641Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.Type: GrantFiled: November 6, 2017Date of Patent: March 10, 2020Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Masakatsu Ohno, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo, Hisao Ikeda, Kohei Yokoyama, Hiroki Adachi, Satoru Idojiri
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Publication number: 20200035949Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.Type: ApplicationFiled: August 9, 2019Publication date: January 30, 2020Applicant: Semiconductor Energy Laboratory Co., Ltd.Inventors: Shunpei YAMAZAKI, Shingo EGUCHI
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Patent number: 10474228Abstract: The display system for remote control of a working machine includes a plurality of camera units and an image processing device, both provided on or in a working machine, and a display device and a remote control device, both provided in the remote control side. The display device detects movement of the head of an operator and transmits the detected movement of the head of the operator to the remote control device. The remote control device transmits, to the image processing device over wireless communications, the movement of the head of the operator transmitted from the display device. The image processing device adjusts, for transmission to the display device, parts of left-eye and right-eye panoramic images according to the movement of the head of the operator transmitted from the remote control device.Type: GrantFiled: November 17, 2014Date of Patent: November 12, 2019Assignee: YANMAR CO., LTD.Inventors: Marta Niccolini, Antonio Alba, Shingo Eguchi, Junya Kusuno, Paolo Tripicchio, Emanuele Ruffaldi, Carlo A. Avizzano, Paolo S. Gasparello
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Publication number: 20190339800Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.Type: ApplicationFiled: July 22, 2019Publication date: November 7, 2019Inventors: Yasuhiro JINBO, Shingo EGUCHI, Hisao IKEDA, Tetsuji ISHITANI, Taisuke KAMADA
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Publication number: 20190326538Abstract: An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.Type: ApplicationFiled: July 1, 2019Publication date: October 24, 2019Inventors: Shingo EGUCHI, Yoshiaki OIKAWA, Kenichi OKAZAKI, Hotaka MARUYAMA
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Patent number: 10442172Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.Type: GrantFiled: June 1, 2017Date of Patent: October 15, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Kayo Kumakura, Tomoya Aoyama, Akihiro Chida, Kohei Yokoyama, Masakatsu Ohno, Satoru Idojiri, Hisao Ikeda, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo
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Patent number: 10429999Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.Type: GrantFiled: December 14, 2016Date of Patent: October 1, 2019Assignee: Semiconductor Energy Laboratory Co., Ltd.Inventors: Yasuhiro Jinbo, Shingo Eguchi, Hisao Ikeda, Tetsuji Ishitani, Taisuke Kamada