Patents by Inventor Shingo Eguchi

Shingo Eguchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200243626
    Abstract: A flexible input/output device and an input/output device having high resistance to repeated bending are provided. The input/output device includes a first flexible substrate, a first insulating layer over the first substrate, a first transistor over the first insulating layer, a light-emitting element over and electrically connected to the first transistor and including an EL layer between first and second electrodes, a first bonding layer over the light-emitting element, a sensing element and a second transistor over the first bonding layer and electrically connected to each other, a second insulating layer over the sensing element and the second transistor, and a second flexible substrate over the second insulating layer. In the input/output device, B/A is greater than or equal to 0.7 and less than or equal to 1.7, where A is a thickness between the EL layer and the first insulating layer and B is a thickness between the EL layer and the second insulating layer.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shingo EGUCHI, Shunpei YAMAZAKI
  • Patent number: 10636692
    Abstract: To improve peelability, yield in a peeling step, and yield in manufacturing a flexible device. A peeling method is employed which includes a first step of forming a peeling layer containing tungsten over a support substrate; a second step of forming, over the peeling layer, a layer to be peeled formed of a stack including a first layer containing silicon oxynitride and a second layer containing silicon nitride in this order and forming an oxide layer containing tungsten oxide between the peeling layer and the layer to be peeled; a third step of forming a compound containing tungsten and nitrogen in the oxide layer by heat treatment; and a fourth step of peeling the peeling layer from the layer to be peeled at the oxide layer.
    Type: Grant
    Filed: March 1, 2018
    Date of Patent: April 28, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Seiji Yasumoto, Masataka Sato, Shingo Eguchi, Kunihiko Suzuki
  • Patent number: 10622426
    Abstract: A flexible input/output device and an input/output device having high resistance to repeated bending are provided. The input/output device includes a first flexible substrate, a first insulating layer over the first substrate, a first transistor over the first insulating layer, a light-emitting element over and electrically connected to the first transistor and including an EL layer between first and second electrodes, a first bonding layer over the light-emitting element, a sensing element and a second transistor over the first bonding layer and electrically connected to each other, a second insulating layer over the sensing element and the second transistor, and a second flexible substrate over the second insulating layer. In the input/output device, B/A is greater than or equal to 0.7 and less than or equal to 1.7, where A is a thickness between the EL layer and the first insulating layer and B is a thickness between the EL layer and the second insulating layer.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: April 14, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shingo Eguchi, Shunpei Yamazaki
  • Patent number: 10621800
    Abstract: At least one embodiment may provide a remote server that can determine occurrence of an abnormal condition in a power transmission system without using a threshold value in advance. There may be provided a remote server that receives operating and non-operating information of a working unit, information on a working date, information on a traveling speed, and information on a load factor of an engine, respectively from a combine harvester. The remote server calculates for each predetermined period an average of the engine load factor while the traveling speed is at or above a predetermined traveling speed with all working units in non-operation. If the average during a predetermined period is in a status of a predetermined difference from the average up to the predetermined period, the remote server determines that a moving power transmission mechanism of a traveling system of the combine harvester is in an abnormal condition.
    Type: Grant
    Filed: August 12, 2014
    Date of Patent: April 14, 2020
    Assignee: YANMAR CO., LTD.
    Inventors: Takeshi Ouchida, Shingo Eguchi
  • Patent number: 10583641
    Abstract: A yield in the step of bonding two members together is improved. A bonding apparatus includes a stage capable of supporting a first member having a sheet-like shape, a fixing mechanism capable of fixing one end portion of a second member having a sheet-like shape so that the second member overlaps with the first member, and a pressurizing mechanism capable of moving from a side of the one end portion of the second member to a side of the other end portion and spreading a bonding layer under pressure between the first member and the second member. The first member and the second member are bonded to each other.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: March 10, 2020
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Masakatsu Ohno, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo, Hisao Ikeda, Kohei Yokoyama, Hiroki Adachi, Satoru Idojiri
  • Publication number: 20200035949
    Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
    Type: Application
    Filed: August 9, 2019
    Publication date: January 30, 2020
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei YAMAZAKI, Shingo EGUCHI
  • Patent number: 10474228
    Abstract: The display system for remote control of a working machine includes a plurality of camera units and an image processing device, both provided on or in a working machine, and a display device and a remote control device, both provided in the remote control side. The display device detects movement of the head of an operator and transmits the detected movement of the head of the operator to the remote control device. The remote control device transmits, to the image processing device over wireless communications, the movement of the head of the operator transmitted from the display device. The image processing device adjusts, for transmission to the display device, parts of left-eye and right-eye panoramic images according to the movement of the head of the operator transmitted from the remote control device.
    Type: Grant
    Filed: November 17, 2014
    Date of Patent: November 12, 2019
    Assignee: YANMAR CO., LTD.
    Inventors: Marta Niccolini, Antonio Alba, Shingo Eguchi, Junya Kusuno, Paolo Tripicchio, Emanuele Ruffaldi, Carlo A. Avizzano, Paolo S. Gasparello
  • Publication number: 20190339800
    Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.
    Type: Application
    Filed: July 22, 2019
    Publication date: November 7, 2019
    Inventors: Yasuhiro JINBO, Shingo EGUCHI, Hisao IKEDA, Tetsuji ISHITANI, Taisuke KAMADA
  • Publication number: 20190326538
    Abstract: An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.
    Type: Application
    Filed: July 1, 2019
    Publication date: October 24, 2019
    Inventors: Shingo EGUCHI, Yoshiaki OIKAWA, Kenichi OKAZAKI, Hotaka MARUYAMA
  • Patent number: 10442172
    Abstract: A processing apparatus of a stack is provided. The stack includes two substrates attached to each other with a gap provided between their end portions. The processing apparatus includes a fixing mechanism that fixes part of the stack, a plurality of adsorption jigs that fix an outer peripheral edge of one of the substrates of the stack, and a wedge-shaped jig that is inserted into a corner of the stack. The plurality of adsorption jigs include a mechanism that allows the adsorption jigs to move separately in a vertical direction and a horizontal direction. The processing apparatus further includes a sensor sensing a position of the gap between the end portion in the stack. A tip of the wedge-shaped jig moves along a chamfer formed on an end surface of the stack. The wedge-shaped jig is inserted into the gap between the end portions in the stack.
    Type: Grant
    Filed: June 1, 2017
    Date of Patent: October 15, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Kayo Kumakura, Tomoya Aoyama, Akihiro Chida, Kohei Yokoyama, Masakatsu Ohno, Satoru Idojiri, Hisao Ikeda, Hiroki Adachi, Yoshiharu Hirakata, Shingo Eguchi, Yasuhiro Jinbo
  • Patent number: 10429999
    Abstract: To provide a novel display panel that is highly convenient or reliable. To provide a novel input and output device that is highly convenient or reliable. To provide a novel data processing device that is highly convenient or reliable. To provide a method for manufacturing a novel display panel that is highly convenient or reliable. The display panel includes a pixel, a third conductive film electrically connected to the pixel, an insulating film including an opening portion overlapping with the third conductive film, and an electrode including a first region in contact with the third conductive film and a second region functioning as a contact point.
    Type: Grant
    Filed: December 14, 2016
    Date of Patent: October 1, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yasuhiro Jinbo, Shingo Eguchi, Hisao Ikeda, Tetsuji Ishitani, Taisuke Kamada
  • Patent number: 10418586
    Abstract: It is an object to provide a flexible light-emitting device with high reliability in a simple way. Further, it is an object to provide an electronic device or a lighting device each mounted with the light-emitting device. A light-emitting device with high reliability can be obtained with the use of a light-emitting device having the following structure: an element portion including a light-emitting element is interposed between a substrate having flexibility and a light-transmitting property with respect to visible light and a metal substrate; and insulating layers provided over and under the element portion are in contact with each other in the outer periphery of the element portion to seal the element portion. Further, by mounting an electronic device or a lighting device with a light-emitting device having such a structure, an electronic device or a lighting device with high reliability can be obtained.
    Type: Grant
    Filed: September 8, 2017
    Date of Patent: September 17, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Kaoru Hatano, Masahiro Katayama, Shingo Eguchi, Yoshiaki Oikawa, Ami Nakamura
  • Patent number: 10381599
    Abstract: A highly reliable light-emitting device is provided. Damage to an element due to externally applied physical power is suppressed. Alternatively, in a process of pressure-bonding of an FPC, damage to a resin and a wiring which are in contact with a flexible substrate due to heat is suppressed. A neutral plane at which stress-strain is not generated when a flexible light-emitting device including an organic EL element is deformed, is positioned in the vicinity of a transistor and the organic EL element. Alternatively, the hardness of the outermost surface of a light-emitting device is high. Alternatively, a substrate having a coefficient of thermal expansion of 10 ppm/K or lower is used as a substrate that overlaps with a terminal portion connected to an FPC.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: August 13, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Shingo Eguchi
  • Patent number: 10374184
    Abstract: An object of the invention is to improve the reliability of a light-emitting device. Another object of the invention is to provide flexibility to a light-emitting device having a thin film transistor using an oxide semiconductor film. A light-emitting device has, over one flexible substrate, a driving circuit portion including a thin film transistor for a driving circuit and a pixel portion including a thin film transistor for a pixel. The thin film transistor for a driving circuit and the thin film transistor for a pixel are inverted staggered thin film transistors including an oxide semiconductor layer which is in contact with a part of an oxide insulating layer.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: August 6, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shingo Eguchi, Yoshiaki Oikawa, Kenichi Okazaki, Hotaka Maruyama
  • Patent number: 10361258
    Abstract: Thinned and highly reliable light emitting elements are provided. Further, light emitting devices in which light emitting elements are formed over flexible substrates are manufactured with high yield. One light emitting device includes a flexible substrate, a light emitting element faulted over the flexible substrate, and a resin film covering the light emitting element, and in the light emitting element, an insulating layer serving as a partition has a convex portion and the convex portion is embedded in the resin film, that is, the resin film covers an entire surface of the insulating layer and an entire surface of the second electrode, whereby the light emitting element can be thinned and highly reliable. In addition, a light emitting device can be manufactured with high yield in a manufacturing process thereof.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: July 23, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Masahiro Katayama, Shingo Eguchi, Yoshiaki Oikawa, Ami Nakamura, Satoshi Seo, Kaoru Hatano
  • Patent number: 10351464
    Abstract: A method for manufacturing glass, including the steps of heat-melting a raw material for producing glass by using a melting furnace having a plurality of gas flow paths while the raw material is levitated from the melting furnace by a gas ejected from the gas flow paths, and performing cooling so as to produce glass, wherein the melting furnace includes a recess portion, at least one first gas flow path configured to eject the gas in the vertical direction into the recess portion, a plurality of second gas flow paths configured to eject the gas in the direction toward the center axis of the melting furnace into the recess portion, the raw material is heat-melted while the raw material is levitated by the gas ejected from the first gas flow path and the gas ejected from the second gas flow paths, and the molten raw material is cooled.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: July 16, 2019
    Assignee: Canon Kabushiki Kaisha
    Inventor: Shingo Eguchi
  • Publication number: 20190189856
    Abstract: An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
    Type: Application
    Filed: February 7, 2019
    Publication date: June 20, 2019
    Applicant: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshiaki OIKAWA, Shingo Eguchi, Mitsuo Mashiyama, Masatoshi Kataniwa, Hironobu Shoji, Masataka Nakada, Satoshi Seo
  • Publication number: 20190179196
    Abstract: A semiconductor device including a large display portion with improved portability is provided. The display device includes a first display panel, a second display panel, and an adhesive layer. The area of the second display panel is larger than the area of the first display panel. The first display panel includes a first substrate, a second substrate, and a reflective liquid crystal element and a first transistor each positioned between the first substrate and the second substrate. The second display panel includes a first resin layer having flexibility, a second resin layer having flexibility, and a light-emitting element and a second transistor each positioned between the first resin layer and the second resin layer. The liquid crystal element has a function of reflecting light toward the second substrate side. The light-emitting element has a function of emitting light toward the second resin layer side.
    Type: Application
    Filed: August 3, 2017
    Publication date: June 13, 2019
    Inventors: Shingo EGUCHI, Hideaki KUWABARA, Kazune YOKOMIZO
  • Patent number: 10276826
    Abstract: A lightweight flexible light-emitting device that is less likely to be broken is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, an element layer, a first bonding layer, and a second bonding layer. The element layer includes a light-emitting element. The element layer is provided between the first flexible substrate and the second flexible substrate. The first bonding layer is provided between the first flexible substrate and the element layer. The second bonding layer is provided between the second flexible substrate and the element layer. The first and second bonding layers are in contact with each other on the outer side of an end portion of the element layer. The first and second flexible substrates are in contact with each other on the outer side of the end portions of the element layer, the first bonding layer, and the second bonding layer.
    Type: Grant
    Filed: January 4, 2018
    Date of Patent: April 30, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Shunpei Yamazaki, Yasuhiro Jinbo, Shingo Eguchi
  • Patent number: 10205062
    Abstract: An object is to provide a highly reliable light emitting device which is thin and is not damaged by external local pressure. Further, another object is to manufacture a light emitting device with a high yield by preventing defects of a shape and characteristics due to external stress in a manufacture process. A light emitting element is sealed between a first structure body in which a fibrous body is impregnated with an organic resin and a second structure body in which a fibrous body is impregnated with an organic resin, whereby a highly reliable light emitting device which is thin and has intensity can be provided. Further, a light emitting device can be manufactured with a high yield by preventing defects of a shape and characteristics in a manufacture process.
    Type: Grant
    Filed: September 4, 2018
    Date of Patent: February 12, 2019
    Assignee: Semiconductor Energy Laboratory Co., Ltd.
    Inventors: Yoshiaki Oikawa, Shingo Eguchi, Mitsuo Mashiyama, Masatoshi Kataniwa, Hironobu Shoji, Masataka Nakada, Satoshi Seo