Patents by Inventor Shingo Itoh
Shingo Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10297857Abstract: A lithium-ion battery with high safety is provided. A lithium-ion battery 20 includes an electrode group 6, an electrolyte, and a battery container 5 that contains the electrode group 6 and the electrolyte. The electrode group 6 is formed by stacking a positive electrode and a negative electrode via a separator. The positive electrode contains a composite oxide of lithium, nickel, manganese, and cobalt as a main positive active material. The negative electrode contains amorphous carbon as a main negative active material. The lithium-ion battery 20 has a discharge capacity of 20 Ah or more. The ratio (the value of Y/X) of a volume Y occupied by the electrolyte to a volume X of a void space in the battery container 5 is 0.65 or more.Type: GrantFiled: November 18, 2015Date of Patent: May 21, 2019Assignee: HITACHI CHEMICAL COMPANY, LTDInventors: Shingo Itoh, Manabu Ochida, Takanori Kajimoto, Youhei Itoh, Tadashi Yoshiura
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Patent number: 9993903Abstract: A workpiece supply device is provided that is capable of supplying a workpiece to be machined next in a supplying area of the workpiece outside a machining area while the machining area is closed to control scattering of cutting fluid from the machining area during the machining of the workpiece. A machine tool includes a machining room of the workpiece, a loader room, a dividing wall having an opening part, a main spindle, a workpiece supply device, a delivery device, and an ejection device. The workpiece supply device includes a workpiece holder, a movement mechanism, a cover member, and a coil spring. The coil spring biases the cover member to close the opening part by the cover member such that the workpiece holder holds the workpiece in the loader room during the machining of the workpiece in the machining room.Type: GrantFiled: September 10, 2015Date of Patent: June 12, 2018Assignees: CITIZEN WATCH CO., LTD., CITIZEN MACHINERY CO., LTD.Inventor: Shingo Itoh
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Publication number: 20170331145Abstract: A lithium-ion battery with high safety is provided. A lithium-ion battery 20 includes an electrode group 6, an electrolyte, and a battery container 5 that contains the electrode group 6 and the electrolyte. The electrode group 6 is formed by stacking a positive electrode and a negative electrode via a separator. The positive electrode contains a composite oxide of lithium, nickel, manganese, and cobalt as a main positive active material. The negative electrode contains amorphous carbon as a main negative active material. The lithium-ion battery 20 has a discharge capacity of 20 Ah or more. The ratio (the value of Y/X) of a volume Y occupied by the electrolyte to a volume X of a void space in the battery container 5 is 0.65 or more.Type: ApplicationFiled: November 18, 2015Publication date: November 16, 2017Inventors: Shingo ITOH, Manabu OCHIDA, Takanori KAJIMOTO, Youhei ITOH, Tadashi YOSHIURA
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Publication number: 20170312873Abstract: A workpiece supply device is provided that is capable of supplying a workpiece to be machined next in a supplying area of the workpiece outside a machining area while the machining area is closed to control scattering of cutting fluid from the machining area during the machining of the workpiece. A machine tool includes a machining room of the workpiece, a loader room, a dividing wall having an opening part, a main spindle, a workpiece supply device, a delivery device, and an ejection device. The workpiece supply device includes a workpiece holder, a movement mechanism, a cover member, and a coil spring. The coil spring biases the cover member to close the opening part by the cover member such that the workpiece holder holds the workpiece in the loader room during the machining of the workpiece in the machining room.Type: ApplicationFiled: September 10, 2015Publication date: November 2, 2017Applicants: CITIZEN WATCH CO., LTD., CITIZEN MACHINERY CO., LTD.Inventor: Shingo ITOH
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Patent number: 9567694Abstract: To provide elastic fabric that has comfortable wear and fit even in thin and light fabric by using a high-powered polyurethane elastic fiber that has at least 1.5 times the active force and recovery per unit fineness at the time of 100 to 200% elongation compared to conventional polyurethane elastic fiber. Resolution means an elastic fabric comprising a polyurethane elastic fiber made of a polyol, with a molecular weight between 450 and 1600 with a ratio of weight average molecular weight to number average molecular weight of at least 1.8, an organic diisocyanate compound, and a diamine compound.Type: GrantFiled: May 24, 2012Date of Patent: February 14, 2017Assignee: Toray Opelontex Co., Ltd.Inventors: Shingo Itoh, Toshihiro Tanaka, Hong Liu
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Patent number: 9230892Abstract: A semiconductor device includes a semiconductor element that is mounted on a substrate, an electrode pad that contains aluminum as a main component and is provided in the semiconductor element, a copper wire that contains copper as a main component and connects a connection terminal provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. When the semiconductor device is heated at 200° C. for 16 hours in the atmosphere, a barrier layer containing any metal selected from palladium and platinum is farmed at a junction between the copper wire and the electrode pad.Type: GrantFiled: March 12, 2013Date of Patent: January 5, 2016Assignee: SUMITOMO BAKELITE CO., LTD.Inventor: Shingo Itoh
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Patent number: 9209997Abstract: A communication apparatus includes: a capability-information generating section which generates a first capability information including a first receivable-period information in relation to a first receivable period; a first transmission section which transmits the first capability information to the communication-destination device via the IP network; a first receiving section which receives a first data transmitted from the communication-destination device via the IP network during the first receivable period; a storage section in which a second data to be transmitted to the communication-destination device is stored; a second receiving section which receives a second capability information including a second receivable-period information in relation to a second receivable period; and a second transmission section which transmits a second data stored in the storage section to the communication-destination device during the second receivable period based on the second capability information.Type: GrantFiled: March 23, 2012Date of Patent: December 8, 2015Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventor: Shingo Itoh
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Patent number: 9197781Abstract: A processor performs acquiring counterpart information corresponding to destination of transmission data; acquiring a re-execution command for controlling a reader to repeatedly perform reading of an original document; acquiring a transmission command for transmitting the transmission data; in response to acquisition of the transmission command, controlling a communicator to transmit the transmission data in accordance with the counterpart information; in response to not to acquire the transmission command, storing the transmission data in a storage unit; and acquiring an addition execution command for performing reading of an original document of a data portion that is added to the stored transmission data. In response to acquisition of the transmission command after the addition execution command is acquired, the communicator is controlled to transmit new transmission data in accordance with the counterpart information.Type: GrantFiled: February 19, 2014Date of Patent: November 24, 2015Assignee: BROTHER KOGYO KABUSHIKI KAISHAInventor: Shingo Itoh
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Patent number: 9147645Abstract: There is provided a semiconductor device having excellent moisture resistance and high temperature storage properties. The semiconductor device includes a lead frame that has a die pad and an inner lead, as a substrate, a semiconductor element that is mounted on the die pad, an electrode pad that is provided in the semiconductor element, a copper wire that connects the inner lead provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. A region of the electrode pad disposed within a range of at least equal to or less than 3 ?m from a junction surface with the copper wire in a depth direction includes a metal, which is less likely to be ionized than aluminum, as a main component, and a content of sulfur in the copper wire is equal to or more than 15 ppm and equal to or less than 100 ppm with respect to a total amount of the copper wire.Type: GrantFiled: March 12, 2013Date of Patent: September 29, 2015Assignee: SUMITOMO BAKELITE CO., LTD.Inventor: Shingo Itoh
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Publication number: 20150054146Abstract: A semiconductor device of the present invention includes a semiconductor element having an electrode pad; a substrate over which the semiconductor element is mounted and which has an electrical bonding part; and a bonding wire electrically connecting the electrode pad to the electrical bonding part, wherein a main metal component of the electrode pad is the same as or different from a main metal component of the bonding wire, and when the main metal component of the electrode pad is different from the main metal component of the bonding wire, a rate of interdiffusion of the main metal component of the bonding wire and the main metal component of the electrode pad at a junction of the bonding wire and the electrode pad under a post-curing temperature of an encapsulating resin is lower than that of interdiffusion of gold (Au) and aluminum (Al) at a junction of aluminum (Al) and gold (Au) under the post-curing temperature.Type: ApplicationFiled: September 30, 2014Publication date: February 26, 2015Applicant: SUMITOMO BAKELITE CO., LTD.Inventor: Shingo Itoh
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Patent number: 8962754Abstract: A nonaqueous electrolyte and a lithium ion battery with reduced temporal variations in battery characteristics from initial values are provided. A mixed solution is prepared by dissolving a lithium salt such as LiPF6 in a nonaqueous solvent such as ethylene carbonate. Allylboronate ester and siloxane are mixed with the mixed solution. The content of the allylboronate ester is 1 wt % or less. The content of the siloxane is 2 wt % or less. 2-Allyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane is used as the allylboronate ester. At least one kind selected from hexamethyldisiloxane and 1,3-divinyltetramethyldisiloxane is used as the siloxane.Type: GrantFiled: May 8, 2012Date of Patent: February 24, 2015Assignee: Shin-Kobe Electric Machinery Co., Ltd.Inventors: Hiroshi Haruna, Shingo Itoh
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Patent number: 8963344Abstract: An epoxy resin composition for semiconductor encapsulation of the present invention contains an epoxy resin (A) and a curing agent (B) and is used to encapsulate a copper wire (4) and a semiconductor element (1) connected to this copper wire (4). This epoxy resin composition is such that when a cured product of the epoxy resin composition is heated for 10 hours at 200° C., the amount of generation of a first corrosive gas that is a sulfur compound having corrosiveness to the copper wire (4) is less than or equal to 70 ppm.Type: GrantFiled: November 29, 2010Date of Patent: February 24, 2015Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Shingo Itoh, Shinichi Zenbutsu
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Publication number: 20150028465Abstract: A semiconductor device includes a semiconductor element that is mounted on a substrate, an electrode pad that contains aluminum as a main component and is provided in the semiconductor element, a copper wire that contains copper as a main component and connects a connection terminal provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. When the semiconductor device is heated at 200° C. for 16 hours in the atmosphere, a barrier layer containing any metal selected from palladium and platinum is farmed at a junction between the copper wire and the electrode pad.Type: ApplicationFiled: March 12, 2013Publication date: January 29, 2015Inventor: Shingo Itoh
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Publication number: 20150021752Abstract: There is provided a semiconductor device having excellent moisture resistance and high temperature storage properties. The semiconductor device includes a lead frame that has a die pad and an inner lead, as a substrate, a semiconductor element that is mounted on the die pad, an electrode pad that is provided in the semiconductor element, a copper wire that connects the inner lead provided on the substrate and the electrode pad, and an encapsulant resin that encapsulates the semiconductor element and the copper wire. A region of the electrode pad disposed within a range of at least equal to or less than 3 ?m from a junction surface with the copper wire in a depth direction includes a metal, which is less likely to be ionized than aluminum, as a main component, and a content of sulfur in the copper wire is equal to or more than 15 ppm and equal to or less than 100 ppm with respect to a total amount of the copper wire.Type: ApplicationFiled: March 12, 2013Publication date: January 22, 2015Inventor: Shingo Itoh
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Publication number: 20140233074Abstract: A processor performs acquiring counterpart information corresponding to destination of transmission data; acquiring a re-execution command for controlling a reader to repeatedly perform reading of an original document; acquiring a transmission command for transmitting the transmission data; in response to acquisition of the transmission command, controlling a communicator to transmit the transmission data in accordance with the counterpart information; in response to not to acquire the transmission command, storing the transmission data in a storage unit; and acquiring an addition execution command for performing reading of an original document of a data portion that is added to the stored transmission data. In response to acquisition of the transmission command after the addition execution command is acquired, the communicator is controlled to transmit new transmission data in accordance with the counterpart information.Type: ApplicationFiled: February 19, 2014Publication date: August 21, 2014Applicant: BROTHER KOGYO KABUSHIKI KAISHAInventor: Shingo ITOH
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Patent number: 8797610Abstract: A processing apparatus includes a photosensor, a processing unit and a control unit. The control unit detects a light receiving signal output from the photosensor during a first light emission period and obtains a first detection result, and makes first determination based on the first detection result by determining whether the processing unit can execute a function. The control unit detects the light receiving signal after a waiting period and obtains a second detection result. The control unit makes second determination based on the second detection result by determining whether the processing unit can execute the function. The control unit makes the second determination in a second mode that requires small consumption power, and according to determination in the second determination in the second mode that the processing unit can execute the function, the control unit keeps the second mode and makes the first determination.Type: GrantFiled: November 29, 2011Date of Patent: August 5, 2014Assignee: Brother Kogyo Kabushiki KaishaInventors: Hironori Hirata, Toru Tsuzuki, Shingo Itoh
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Patent number: 8766420Abstract: A semiconductor device is configured that two or more semiconductor elements are stacked and mount on a lead frame, the aforementioned lead frame is electrically joined to the semiconductor element with a wire, and the semiconductor element, the wire and an electric junction are encapsulated with a cured product of an epoxy resin composition for encapsulating semiconductor device, and that the epoxy resin composition for encapsulating semiconductor device contains (A) an epoxy resin; (B) a curing agent; and (C) an inorganic filler, and that the (C) inorganic filler contains particles having particle diameter of equal to or smaller than two-thirds of a thinnest filled thickness at a rate of equal to or higher than 99.9% by mass.Type: GrantFiled: August 27, 2010Date of Patent: July 1, 2014Assignee: Sumitomo Bakelite Co., Ltd.Inventor: Shingo Itoh
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Publication number: 20140087170Abstract: To provide elastic fabric that has comfortable wear and fit even in thin and light fabric by using a high-powered polyurethane elastic fiber that has at least 1.5 times the active force and recovery per unit fineness at the time of 100 to 200% elongation compared to conventional polyurethane elastic fiber. Resolution means an elastic fabric comprising a polyurethane elastic fiber made of a polyol, with a molecular weight between 450 and 1600 with a ratio of weight average molecular weight to number average molecular weight of at least 1.8, an organic diisocyanate compound, and a diamine compound.Type: ApplicationFiled: May 24, 2012Publication date: March 27, 2014Applicant: Toray Opelontex Co., Ltd.Inventors: Shingo Itoh, Toshihiro Tanaka, Hong Liu
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Publication number: 20140079987Abstract: A nonaqueous electrolyte and a lithium ion battery with reduced temporal variations in battery characteristics from initial values are provided. A mixed solution is prepared by dissolving a lithium salt such as LiPF6 in a nonaqueous solvent such as ethylene carbonate. Allylboronate ester and siloxane are mixed with the mixed solution. The content of the allylboronate ester is 1 wt % or less. The content of the siloxane is 2 wt % or less. 2-Allyl-4,4,5,5-tetramethyl-1,3,2-dioxaborolane is used as the allylboronate ester. At least one kind selected from hexamethyldisiloxane and 1,3-divinyltetramethyldisiloxane is used as the siloxane.Type: ApplicationFiled: May 8, 2012Publication date: March 20, 2014Applicant: Shin-Kobe Electric Machinery Co., Ltd.Inventors: Hiroshi Haruna, Shingo Itoh
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Publication number: 20140035115Abstract: A semiconductor device includes any one of a lead frame having a die pad portion and a circuit board, one or more semiconductor elements, a copper wire, an encapsulating member. The one or more semiconductor elements are mounted on any one of the die pad portion of the lead frame and the circuit board. The copper wire electrically connects electrical joints provided on any one of the lead frame and the circuit board to an electrode pad provided on the semiconductor element. The encapsulating member encapsulates the semiconductor element and the copper wire. The electrode pad provided on the semiconductor element is formed from palladium. The copper wire has a copper purity of 99.99% by mass or more and an elemental sulfur content of 5 ppm by mass or less.Type: ApplicationFiled: October 2, 2013Publication date: February 6, 2014Applicant: SUMITOMO BAKELITE CO., LTD.Inventors: Shin-ichi ZENBUTSU, Shingo ITOH