Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A flexible printed circuit board includes: an electrically insulating layer having a first surface and a second surface opposite to the first surface; a first wiring disposed on the first surface; a second wiring disposed on the second surface; and an electrically conductive layer. The first wiring includes a first land. The second wiring includes a second land. The first wiring includes a first layer disposed on the first surface and a second layer disposed on the first layer. The second wiring includes a third layer disposed on the second surface and a fourth layer disposed on the third layer. The first land and the second land overlap each other in a plan view. The electrically insulating layer is provided with a through hole extending through the electrically insulating layer in a thickness direction and overlapping the first land and the second land at least partially in the plan view.

Abstract: A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 µm to 2.0 µm. The wiring lines have an average height of 40 µm to 120 µm. The wiring lines have an average spacing of 1 µm to 30 µm.

Abstract: Provided is a liquid ejection head comprising a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A liquid ejection head includes an ejection orifice forming surface provided with an ejection orifice from which a liquid is ejected. The ejection orifice forming surface includes a first region in a vicinity of the ejection orifice, a second region that is further spaced apart from the ejection orifice than the first region and protrudes from the first region in a liquid ejection direction and a third region that connects the first region and the second region. When a contact angle of pure water in the first region is a first contact angle ?1 and a contact angle of pure water in the third region is a third contact angle ?3, ?1 is larger than ?3 by 10 degrees or more.

Abstract: A liquid ejection head includes a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Abstract: A liquid ejection head includes an ejection orifice forming surface provided with an ejection orifice from which a liquid is ejected. The ejection orifice forming surface includes a first region in a vicinity of the ejection orifice, a second region that is further spaced apart from the ejection orifice than the first region and protrudes from the first region in a liquid ejection direction and a third region that connects the first region and the second region. ?1 is larger than ?3 by 10 degrees or more, when a contact angle of pure water in the first region is a first contact angle ?1 and a contact angle of pure water in the third region is a third contact angle ?3.

Abstract: There is provided a transfer method for transferring a member formed on a film held on a frame jig to an object including: attaching the member formed on the film to the object in a first direction; and delaminating the film from the object in a second direction intersecting with the first direction, wherein a rigidity of the frame jig in the first direction is higher than that of the frame jig in the second direction.

Abstract: Provided is a liquid ejection head comprising a base plate and at least two device chips in which ejection ports for ejecting a liquid are formed and which are disposed on the base plate. At least one first reference mark is provided on the base plate. A second reference mark is provided on each of the device chips. At least one space is formed between adjacent ones of the device chips. The second reference marks and the first reference mark present in the space are disposed on an array axis along which the device chips are arrayed.

Abstract: A method for manufacturing a liquid ejection head including providing a negative first photosensitive resin layer on the substrate, forming a pattern of the flow path by selectively exposing the first photosensitive resin layer, providing a negative second photosensitive resin layer on the first photosensitive resin layer, providing a negative third photosensitive resin layer on the second photosensitive resin layer, forming a pattern of the ejection port by selectively exposing the second and third photosensitive resin layers, developing the first, second, and third photosensitive resin layers, irradiating an activation energy line on at least the third photosensitive resin layer after the developing, and heat curing the first, second, and third photosensitive resin layers after the irradiating of the activation energy line.

Abstract: A liquid ejection head substrate includes an electrode pad for receiving driving power for liquid ejection from an outside, the electrode pad including at least a conductor layer and a layer of gold. A portion of the conductor layer has an opening region, and an upper layer portion in a laminating direction above the conductor layer including the opening region has at least the layer of gold. An external connection portion connected to the outside is provided on top of the layer of gold corresponding to the opening region of the conductor layer.

Abstract: Provided is a film formation method including the steps of: forming a resist film on an object to be applied, forming a layer of a protecting material removable by a first dissolving liquid on the upper surface of the resist film, removing the resist film from a region not having, on the upper surface thereof, the layer of the protecting material by side rinsing with a second dissolving liquid capable of dissolving the resist film therein, and removing the protecting material remaining on the upper surface of the resist film by the first dissolving liquid.

Abstract: A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.

Abstract: A method for imparting water repellency to a surface of a member includes a step in which a material including a compound containing a fluorine atom is deposited on a surface of a photosensitive resin layer in order to form a member including a material layer; a first exposure step in which the member is exposed to an amount of light with an exposure apparatus in order to form a latent image in the member; a development step in which the member including the latent image is developed; and a second exposure step in which the member is exposed to an amount of light with an exposure apparatus subsequent to the development step.

Abstract: To manufacture a liquid ejection head, a film having a lower surface free energy than a surface free energy of a substrate is first formed on an inner face of a liquid supply port. Next, a dry film to be a flow path forming member is attached to cover the surface of the substrate, and then a member to be an ejection orifice forming member is provided on the surface of the dry film.

Abstract: Provided is a film formation method including the steps of: forming a resist film on an object to be applied, forming a layer of a protecting material removable by a first dissolving liquid on the upper surface of the resist film, removing the resist film from a region not having, on the upper surface thereof, the layer of the protecting material by side rinsing with a second dissolving liquid capable of dissolving the resist film therein, and removing the protecting material remaining on the upper surface of the resist film by the first dissolving liquid.

Abstract: There is provided a transfer method for transferring a member formed on a film held on a frame jig to an object including: attaching the member formed on the film to the object in a first direction; and delaminating the film from the object in a second direction intersecting with the first direction, wherein a rigidity of the frame jig in the first direction is higher than that of the frame jig in the second direction.