Abstract: A method of manufacturing an ink jet head which discharges ink, comprising: a step of preparing a silicon substrate; a step of forming a membrane having a layer in which a plurality of holes are disposed to constitute a filter mask, and a layer with which a first surface is coated in such a manner that the first surface is not exposed from the plurality of holes on the first surface of the substrate; a step of forming a close contact enhancing layer on the membrane formed on the substrate; a step of forming a channel constituting member on the close contact enhancing layer to constitute a plurality of discharge ports and a plurality of ink channels communicating with the plurality of discharge ports; a step of forming an ink supply port communicating with the plurality of ink channels in the silicon substrate by anisotropic etching from a second surface facing the first surface of the substrate; and a step of forming a filter in a portion of the close contact enhancing layer positioned in an opening of the in

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: A method for precisely manufacturing a liquid supply orifice of an ink-jet recording head, even if a masking material includes pinholes which may affect the forming of the ink supply orifice, is provided. The substrate face provided with a mask used for forming the ink supply orifice has an area covered with the mask for anisotropic etching, the area consisting of a part provided with OSF layers and a part not provided with the OSF layers which are determined by considering the amount of a side etching.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink jet head includes a substrate having a flow path construction member constructing a plurality of discharge ports for discharging ink and a plurality of ink flow paths corresponding thereto, and a plurality of energy generating elements corresponding to the plurality of discharge ports. The substrate has an ink supply port for supplying ink to the ink flow paths. The ink supply port includes a first liquid chamber disposed on a plane on which the energy generating elements are formed, and having a grooves with island-shaped columns left, and a second liquid chamber disposed on the opposed plane, and having a plurality of through holes partitioned at positions corresponding to the island-shaped columns. In the ink jet head, the island-shaped columns and a partition wall for the through holes are left as a beam construction section, thereby improving a mechanical strength of a semiconductor substrate.

Abstract: In a method for producing an ink-jet recording head, a plurality of through-holes is formed in a heat storage layer formed on one surface of a silicon substrate, subsequently, heating elements are formed, and a protective layer is formed on the substrate. A passage-forming member forming discharge ports and ink passages is formed on the protective layer and an ink supply port is then formed by anisotropic etching from the other surface of the silicon substrate. In this step, since the protective layer serves as an etching stop layer, the passage-forming member is not in contact with an etchant. Subsequently, the protective layer formed in the through-holes is removed so that the ink supply port includes a filter.

Abstract: An ink jet recording head includes three sets of nozzle arrays each having a large nozzle array including a first ejection outlet group and an adjacent small nozzle array including a second ejection outlet group. The ejection outlets of the second ejection outlet group have smaller diameters than those of the first ejection outlet group. In nozzle arrays constituted by two adjacent ones of the three nozzle array sets, a large nozzle array, a small nozzle array, a small nozzle array, and a large nozzle array are arranged in the order named, in the main scanning direction. One of the two adjacent nozzle array sets ejects cyan ink, the other one of the two adjacent nozzle array sets ejects magenta ink, and a nozzle array set other than the two adjacent nozzle array sets ejects yellow ink.

Abstract: A method of manufacturing an ink jet head which discharges ink, comprising: a step of preparing a silicon substrate; a step of forming a membrane having a layer in which a plurality of holes are disposed to constitute a filter mask, and a layer with which a first surface is coated in such a manner that the first surface is not exposed from the plurality of holes on the first surface of the substrate; a step of forming a close contact enhancing layer on the membrane formed on the substrate; a step of forming a channel constituting member on the close contact enhancing layer to constitute a plurality of discharge ports and a plurality of ink channels communicating with the plurality of discharge ports; a step of forming an ink supply port communicating with the plurality of ink channels in the silicon substrate by anisotropic etching from a second surface facing the first surface of the substrate; and a step of forming a filter in a portion of the close contact enhancing layer positioned in an opening of the in

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) remains on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 ?m.

Abstract: An ink supply port is opened in an Si substrate on which an ink discharge energy generating element is formed, by anisotropic etching, from a back surface opposite to a surface on which the ink discharge energy generating element is formed. When the anisotropic etching is effected, OSF (oxidation induced laminate defect) is remained on the back surface of the Si substrate with OSF density equal to or greater than 2×104 parts/cm2 and a length of OSF equal to or greater than 2 &mgr;m.