Abstract: A top-blowing lance nozzle is configured to freely switch an adequate expansion condition so as to control an oxygen-blowing amount and a jetting velocity independently of each other without requiring a plurality of lance nozzles or a mechanically movable part. A lance nozzle is configured to blow refining oxygen to molten iron charged in a reaction vessel while a gas is blown from a top-blowing lance to the molten iron. One or more blowing holes for blowing a working gas are on an inner wall side surface of the nozzle, at a site where the lance nozzle has a minimum cross-sectional area in a nozzle axis direction or at a neighboring site of the site.

Abstract: A semiconductor device includes a semiconductor element and a first connection member. The semiconductor element includes a substrate and an electrode pad. The substrate includes a transistor formation region, in which a transistor is formed and which is shaped to be non-quadrangular. The electrode pad is located on the transistor formation region. The first connection member is connected to the electrode pad at one location. The electrode pad is arranged to cover a center of gravity of the transistor formation region in a plan view of the electrode pad. In the plan view, a connection region in which the first connection member is connected to the electrode pad includes a center of gravity position of the transistor formation region.

Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

Abstract: When a monolithic ceramic electronic component is viewed from either one of end surfaces thereof, an outer electrode includes a solder-repellent portion and a solder-receivable portion. The solder-repellent portion covers the central portion of an end surface of a ceramic laminate body. The solder-receivable portion includes portions disposed on two opposing sides of the solder-repellent portion. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to a portion around the central portion of the end surface. Thus, expansion and contraction that occur as a result of application of an AC voltage are not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are reduced.

Abstract: Solder-repellent portions are each arranged so as to extend over all or substantially all of a portion of a corresponding one of outer electrodes provided on a corresponding one of end surfaces of a monolithic ceramic electronic component and partially on portions of the outer electrode provided over two side surfaces of the monolithic ceramic electronic component. When the monolithic ceramic electronic component is mounted on the circuit board, solder does not adhere to the end surfaces and portions of the outer electrode provided on portions of the two side surfaces. Thus, expansion and contraction that occur as a result of application of an AC voltage is not transmitted or is not significantly transmitted to the circuit board. Consequently, vibrations of the circuit board are significantly reduced or prevented.

Abstract: In an electronic component, first and second lead wires include coated portions and first and second metal wire exposed portions. The coated portions include metal wires that are coated with insulating members. Each of the first and second metal wire exposed portions have a flat shape. The first lead wire and the second lead wire are arranged parallel or substantially parallel to each other. The second lead wire is shorter than the first lead wire. The first metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The second metal wire exposed portion is soldered to the side surface folded portion of the terminal electrode. The first and second metal wire exposed portions are located substantially in the same plane. A solder fillet is provided not only on the side surface folded portions, but also on end surface portions and in a gap.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.

Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.

Abstract: A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.

Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.

Abstract: A method for manufacturing a multilayer ceramic electronic element includes the steps of forming ceramic green sheets having superior surface smoothness and small variations in thickness at a high speed, in which defects such as pinholes are prevented from occurring, and providing internal electrodes and step-smoothing ceramic paste on the ceramic green sheets with high accuracy. The method includes the steps of applying ceramic slurry to a base film by a die coater followed by drying performed in a drying furnace for forming the ceramic green sheets, and performing gravure printing of conductive paste and ceramic paste onto the ceramic green sheets by using a first and a second gravure printing apparatus, respectively. Accordingly, the internal electrodes are formed, and the step-smoothing ceramic paste is provided in regions other than those in which the internal electrodes are formed.