Patents by Inventor Shingo Okuyama

Shingo Okuyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6569367
    Abstract: The object of the present invention is to reduce irregularity of the amount of applying of the conductive paste applied for forming the side face electrode so as to be extended from a part of the side face of the component body up to a part of the face adjoining the side face, wherein the conductive paste is filled into the slit provided on the slit plate, and the component body is disposed with its side face toward the first principal face side of the slit plate, followed by allowing the shutter member to undergo elastic deformation toward the inside of the slit by compressing the shutter member comprising an elastic material with a projection on the compression member, thereby the conductive paste is applied so as to extend the paste from a part of the side face of the component body up to a part of the faces adjoining the side face while supplying the conductive paste on in the slit so as to swell on the first principal face.
    Type: Grant
    Filed: May 25, 2000
    Date of Patent: May 27, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Tadahiro Nakagawa, Takehiko Miura, Makoto Fukuda
  • Patent number: 6551426
    Abstract: A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.
    Type: Grant
    Filed: May 9, 2001
    Date of Patent: April 22, 2003
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Shingo Okuyama, Makoto Fukuda
  • Patent number: 6445593
    Abstract: A chip type electronic component and a method of manufacturing the same reduces the steps necessary for applying an electrically conductive paste to define a first external electrode, a second external electrode and a third external electrode on the outer surface of an electronic component main body. External electrodes are provided around the side surfaces of the main body of the electronic component. The first external electrode is positioned on the first end surface of the main body, the second external electrode is positioned on the second end surface, the third external electrode is positioned between the first and second external electrodes. The first and second external electrodes are arranged to extend to edge portions of the first and second end surfaces, but exposing at least the approximate central portions of these end surfaces. In this way, the external electrodes are formed by applying the electrically conductive paste on the side surfaces of the main body.
    Type: Grant
    Filed: August 21, 2000
    Date of Patent: September 3, 2002
    Assignee: Murata Manufacturing Co., Ltd.
    Inventor: Shingo Okuyama
  • Publication number: 20020008606
    Abstract: A laminated ceramic electronic component significantly simplifies a step of forming external electrodes and has reliable electrical connection between an internal electrode and the external electrodes. A method for manufacturing the laminated ceramic electronic component includes the steps of forming composite sheets each having a conductor and a ceramic layer provided at the sides of the conductor on a carrier film, laminating the composite sheets with each other for forming a mother laminate, cutting the mother laminate in the thickness direction thereof so as to divide the conductor for forming laminates each forming one laminated ceramic electronic component, in which the conductor is exposed on the cut surface of the laminate, and firing the laminate so as to simultaneously form external electrodes from the exposed conductors and a sintered ceramic body.
    Type: Application
    Filed: May 22, 2001
    Publication date: January 24, 2002
    Applicant: Murata Manufacturing Co., Ltd
    Inventors: Shingo Okuyama, Tadahiro Nakagawa
  • Publication number: 20010054472
    Abstract: A manufacturing method for a laminated ceramic electronic component includes the steps of printing a layer of a conductor and a ceramic green sheet formed around the conductor a plurality of times on a carrier film, thus preparing a composite sheet laminate in which composite sheets made up of the conductor and the ceramic green sheet are laminated, and pressing and attaching the composite sheet laminate to another ceramic green sheet and removing the carrier film.
    Type: Application
    Filed: May 9, 2001
    Publication date: December 27, 2001
    Inventors: Shingo Okuyama, Makoto Fukuda
  • Publication number: 20010015250
    Abstract: A manufacturing method for a laminated ceramic electronic component is performed such that the thickness of the inner electrode is greatly increased, delamination does not occur, and reliability is superior. The manufacturing method for the laminated ceramic electronic component includes a process in which a green sheet including the inner electrode paste layer and the ceramic paste layer, is provided on a carrier sheet such that the inner electrode paste layer penetrates the green sheet from the top surface to the bottom surface thereof, and a process, in which laminates of the green sheet and the carrier film are adhered by pressing, and thereafter the carrier film is peeled off, are repeated to obtain the ceramic laminate, and the ceramic laminate is fired after pressing in the direction of the thickness to obtain the ceramic sintered body.
    Type: Application
    Filed: December 20, 2000
    Publication date: August 23, 2001
    Inventors: Hiromichi Tokuda, Shingo Okuyama, Tsuyoshi Tatsukawa, Makoto Fukuda
  • Patent number: 4908590
    Abstract: A chip-like LC filter which comprises a cylindrical magnetic element having a through hole. A cylindrical capacitor element has a through hole and terminal electrodes formed on inner and outer peripheral surfaces thereof. A central conductor is inserted in the through holes of the magnetic element and the capacitor element, which through holes are aligned along an axial direction. The terminal electrode on the inner peripheral side of the capacitor element is electrically connected with the central conductor. Cap-shaped external terminal members are respectively provided on both end portions of the central conductor, so that the magnetic element and the capacitor element are located between the external terminal members.
    Type: Grant
    Filed: April 15, 1988
    Date of Patent: March 13, 1990
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukio Sakamoto, Shinichi Madokoro, Shingo Okuyama
  • Patent number: 4906209
    Abstract: A compliant pin terminal inserted into a through hole, such as a center hole of a feed-through capacitor or a through hole of a circuit substrate having an electrode at the inner periphery thereof, is mounted into the through hole for electrically connecting with the electrode therein. The pin terminal includes slits, by which linear divided portions and expanded elastic contact portions are formed so that when the body is inserted into the through hole of the capacitor the elastic contact portions come into press-contact with the electrode, thereby obtaining electrical connection with the electrode and mechanical locking by means of the elasticity of each elastic contact portion. A lengthwise pulling force acting on the terminal body is borne by the linear divided portions, but does not act on the elastic portions. Accordingly, an interval between the elastic contact portions opposite to each other resists change, thereby effectively preventing the pin terminal from escaping from the through hole.
    Type: Grant
    Filed: November 9, 1988
    Date of Patent: March 6, 1990
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Takeshi Tanabe, Takaaki Ooi, Shingo Okuyama
  • Patent number: 4801904
    Abstract: A chip-like LC filter which comprises a cylindrical magnetic element having a through hole, a cylindrical capacitor element having a through hole and terminal electrodes formed on inner and outer peripheral surfaces thereof, and a central conductor inserted in the through holes of the magnetic element and the capacitor element aligned in the axial direction. The terminal electrode on the inner peripheral side of the capacitor element is electrically connected with the central conductor. Flange-shaped external terminal members are respectively provided on both end portions of the central conductor, so that the magnetic element and the capacitor element are located between the external terminal members.
    Type: Grant
    Filed: January 9, 1987
    Date of Patent: January 31, 1989
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukio Sakamoto, Shinichi Madokoro, Shingo Okuyama
  • Patent number: 4700440
    Abstract: A manufacturing method for a LC filter (an inductive filter) suitable for use as a noise filter, constituted by the steps of: inserting a central conductor into a cylindrical magnetic substance having electrodes on at least the end faces; dipping the central conductor and magnetic substance into molten solder to solder the electrodes to the central conductor; thereafter inserting the magnetic substance and central conductor into a cylindrical capacitor of a cylindrical dielectric which is provided on the inside and the outside with electrodes and on the outer peripheral surface a cylindrical eyelet member fitted thereon; sealing openings at both ends of the cylindrical capacitor by use of sealing members fitted onto the central conductor after the magnetic substance through which the central conductor passes is inserted into the cylindrical capacitor; then dipping the cylindrical capacitor into molten solder to solder the external electrode and the eyelet member; and remelting the solder for connecting the el
    Type: Grant
    Filed: March 5, 1986
    Date of Patent: October 20, 1987
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Yukio Sakamoto, Shinichi Madokoro, Shingo Okuyama