Abstract: The invention provides novel pellets having high fluidity in a hopper of an extruder and capable of forming a coating layer having good wire diameter stability and capacitance stability even when used for rapid molding of electric wire coating. The pellets contain a fluororesin. Each of the pellets, placed on a horizontal surface, has a substantially circular outline or a substantially elliptic outline and has a major axis D1 of 3.1 mm or shorter and a minor axis D2 of 3.1 mm or shorter when observed in the direction normal to the horizontal surface. Each pellet satisfies the following formula (1): (D1+D2)/2L=1.8 to 2.6, wherein D1 represents the major axis, D2 represents the minor axis, and L represents the height from the horizontal surface to the highest point of the pellet.

Abstract: A strain sensor provided with a substrate that has flexibility; a carbon nanotube (CNT) film that is provided on the surface of the substrate and that has a plurality of CNT fibers oriented in one direction; and a pair of electrodes that are arranged at both ends in the orientation direction of the CNT fibers in the CNT film; in which the CNT film has a plurality of CNT fiber bundles that consist of the plurality of CNT fibers, and a resin layer that covers the peripheral surface of the plurality of the CNT fiber bundles and joins with the surface of the substrate.

Abstract: A strain sensor includes a flexible substrate, a CNT film made of a plurality of CNT fibers aligned in an orientation direction, a pair of electrodes, and a protective coat. The electrodes are formed at the opposite ends of the CNT film in a perpendicular direction to the orientation direction of the CNT fibers. The protective coat protecting the CNT film is made of a resin, a water-based emulsion, or an oil-based emulsion. The protective coat is placed in contact with at least part of the CTN fibers on the surface of the CNT film. The strain sensor including the protective coat is able to prevent damage/breakage of the CNT film and to prevent foreign matters from entering into gaps between CNT fibers, thus improving durability in maintaining adequate sensing functionality.

Abstract: A strain sensor includes a flexible substrate, a CNT film made of a plurality of CNT fibers aligned in an orientation direction, a pair of electrodes, and a protective coat. The electrodes are formed at the opposite ends of the CNT film in a perpendicular direction to the orientation direction of the CNT fibers. The protective coat protecting the CNT film is made of a resin, a water-based emulsion, or an oil-based emulsion. The protective coat is placed in contact with at least part of the CTN fibers on the surface of the CNT film. The strain sensor including the protective coat is able to prevent damage/breakage of the CNT film and to prevent foreign matters from entering into gaps between CNT fibers, thus improving durability in maintaining adequate sensing functionality.

Abstract: A strain sensor provided with a substrate that has flexibility; a carbon nanotube (CNT) film that is provided on the surface of the substrate and that has a plurality of CNT fibers oriented in one direction; and a pair of electrodes that are arranged at both ends in the orientation direction of the CNT fibers in the CNT film; in which the CNT film has a plurality of CNT fiber bundles that consist of the plurality of CNT fibers, and a resin layer that covers the peripheral surface of the plurality of the CNT fiber bundles and joins with the surface of the substrate.

Abstract: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.

Abstract: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

Abstract: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

Abstract: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.

Abstract: A fluororesin which does not cause cone break, when used for insulating a core wire having a diameter of 0.05 to 0.07 mm under the conditions of a resin temperature of 320 to 370° C., a drawdown rate [DDR] of 80 to 120, a draw rate balance [DRB] of 1.0, a wire coating speed of 700 feet/minute and an insulating thickness of 30 to 50 ?m.

Abstract: The present invention provides a laminate which is highly impermeable to fuels and has high fuel crack resistance. The present invention is a laminate having: a layer (A) comprising a fluorinated ethylenic polymer; a layer (B) comprising a chlorotrifluoroethylene copolymer; and a layer (C) comprising a fluorine-free organic material (P); the fluorinated ethylenic polymer being different from the chlorotrifluoroethylene copolymer forming the layer (B) in one and the same laminate and the layer (A), the layer (B), and the layer (C) being bonded together in that order.

Abstract: A heteroepitaxial growth method for gallium nitride yields gallium nitride which contains good quality fine crystals and has excellent optical properties, on a quartz substrate or a silicon substrate. The method comprises a step A of nitriding the surface of the substrate, and a step B of depositing or vapor depositing at least one atom layer of gallium.

Abstract: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.

Abstract: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Abstract: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.

Abstract: A capacitor microphone includes a plate that has a fixed electrode, a diaphragm that has a variable electrode, the plate that vibrates by sound waves, and a spacer that insulates and supports the plate and the diaphragm forming airspace between the fixed electrode and the variable electrode, wherein at least either of the plate or the diaphragm is a semiconductor single-layered film or a metal single-layered film whose specific resistance in a nearby edge close to the spacer is higher than that in a central unit away from the spacer.

Abstract: The present invention provides a CTFE copolymer-containing laminate produced by coextrusion molding of a PFA and/or FEP layer and a CTFE copolymer layer with the thermal degradation of the latter layer being suppressed and the liquid chemical impermeability and gas barrier properties, among others, being improved as well as a method of producing the same. The present invention is a chlorotrifluoroethylene copolymer-containing laminate having a layer (A) comprising a tetrafluoroethylene/perfluoro(vinyl ether) copolymer and/or a tetrafluoroethylene/hexafluoropropylene copolymer and a layer (B) comprising a chlorotrifluoroethylene copolymer, the layer (A) and the layer (B) being formed by coextrusion molding under a condition such that the temperature of a flow path (pa) through which a layer (A)-forming material (a) flows is 300 to 400° C. and the temperature of a flow path (pb) through which a layer (B)-forming material (b) flows is 250 to 350° C.

Abstract: A microphone package includes a housing having a cavity and a sound hole allowing the cavity to communicate with the exterior. A microphone chip is mounted on the mounting surface inside of the cavity. The sound hole is opened on the interior surface of the housing positioned opposite to the mounting surface. A resin sealing portion is formed to seal the surrounding area of the microphone chip and the mounting surface. Alternatively, a semiconductor sensor chip and a control circuit chip are mounted on the mounting surface inside of the cavity of the housing and are electrically connected together via bonding wires. Herein, the resin sealing portion entirely seals the control circuit chip and the first joining portions joining the first ends of the bonding wires, while a resin potting portion seals the second joining portions between the electrode pads and the second ends of the bonding wires.

Abstract: A microphone package includes a housing, which has a cavity and a sound hole for allowing the cavity to communicate with the exterior, and a microphone chip, which is mounted on the mounting surface so as to detect sound within the cavity. The sound hole is opened in connection with the mounting surface and is surrounded by a projection wall projecting upwardly from the mounting surface at a prescribed position in proximity to the microphone chip.

Abstract: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.