Patents by Inventor Shinichi Ike

Shinichi Ike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190035751
    Abstract: A measuring device includes two sensor chips that measure a flow rate of a fluid flowing through a pipe, electrode pads extending from a temperature measuring section and from a heater, respectively, toward peripheries of the two sensor chips, and wires that are electrically connected to the electrode pads and via which a measurement signal that is output from the temperature measuring section or the heater is transmitted to outside of the sensor chips. Each of the electrode pads includes a straight portion that extends linearly from the temperature measuring section or the heater and a wide portion that is formed at a leading end of each of the electrode pads and is wider than the straight portion, and an entire surface area of the wide portion is set as a wire-bonding-allowed region, to which one of the wires is to be bonded.
    Type: Application
    Filed: July 26, 2018
    Publication date: January 31, 2019
    Applicant: AZBIL CORPORATION
    Inventor: Shinichi Ike
  • Patent number: 10113892
    Abstract: A measuring apparatus including a tubular member, a sensor fixed to an outer peripheral surface of the tubular member, and a circuit board that relays a detection signal from the sensor, the circuit board being fixed to the outer peripheral surface in an area different from an area where the sensor is fixed and being separated from the sensor, and a wire that electrically connects the sensor and the circuit board.
    Type: Grant
    Filed: November 16, 2016
    Date of Patent: October 30, 2018
    Assignee: Azbil Corporation
    Inventor: Shinichi Ike
  • Publication number: 20170153138
    Abstract: A measuring apparatus including a tubular member, a sensor fixed to an outer peripheral surface of the tubular member, and a circuit board that relays a detection signal from the sensor, the circuit board being fixed to the outer peripheral surface in an area different from an area where the sensor is fixed and being separated from the sensor, and a wire that electrically connects the sensor and the circuit board.
    Type: Application
    Filed: November 16, 2016
    Publication date: June 1, 2017
    Applicant: Azbil Corporation
    Inventor: Shinichi IKE
  • Publication number: 20140007670
    Abstract: A flow sensor includes a base made of glass, a substrate made of glass and disposed on an upper surface of the base, a flow velocity detection unit including an electrical resistance element and disposed on an upper surface of the substrate, and an electrode that penetrates the substrate and is electrically connected to the electrical resistance element.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 9, 2014
    Applicant: Azbil Corporation
    Inventors: Shinichi IKE, Seishi NAKANO
  • Publication number: 20140007671
    Abstract: A flow sensor includes a flow channel body in which a flow channel is formed, and an insertion hole that is communicated with the flow channel is formed from an outer surface, a base made of glass and inserted in the insertion hole of the flow channel body, an elastic gasket disposed between the insertion hole and the base, a substrate made of glass and disposed on an upper surface of the base, a flow velocity detection unit including an electrical resistance element, disposed on an upper surface of the substrate, and positioned in the flow channel, and an electrode that penetrates the substrate and is electrically connected to the electrical resistance element.
    Type: Application
    Filed: July 8, 2013
    Publication date: January 9, 2014
    Inventor: Shinichi IKE
  • Patent number: 8166814
    Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: May 1, 2012
    Assignee: Yamatake Corporation
    Inventors: Shinichi Ike, Hiroshi Hatakeyama, Satoshi Tsuchiya
  • Patent number: 7765865
    Abstract: A flow sensor may be formed of a sensor chip in which a flow rate detecting section is formed on an electric insulating film applied to cover at least a part of a concave portion formed on an upper surface of a substrate and may also include a flow path forming member which is provided on the sensor chip and has a flow path of a fluid flowing through the flow rate detecting section formed therein.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: August 3, 2010
    Assignee: Yamatake Corporation
    Inventors: Shinichi Ike, Shoji Kamiunten, Junji Kumasa
  • Publication number: 20090078041
    Abstract: A flow sensor may be formed of a sensor chip in which a flow rate detecting section is formed on an electric insulating film applied to cover at least a part of a concave portion formed on an upper surface of a substrate and may also include a flow path forming member which is provided on the sensor chip and has a flow path of a fluid flowing through the flow rate detecting section formed therein.
    Type: Application
    Filed: August 14, 2008
    Publication date: March 26, 2009
    Applicant: Yamatake Corporation
    Inventors: Shinichi Ike, Shoji Kamiunten, Junji Kumasa
  • Publication number: 20090078040
    Abstract: A flow sensor may be formed by bonding a sensor chip formed with a flow rate detecting part and a flow path-forming member that is provided on the sensor chip and is formed with a flow path for a fluid flowing in the flow rate detecting part to each other on the upper surface of a substrate. The flow path-forming member may be formed by bonding a transparent first flow path forming member and a second flow path-forming member to each other. The first flow path forming member has a plate shape, and is provided with an inflow port and a outflow port for the fluid to be measured, and the second flow path forming member has a plate shape, and is provided with a through hole that forms the flow path along the flow of the fluid flowing along the flow rate detecting part.
    Type: Application
    Filed: August 14, 2008
    Publication date: March 26, 2009
    Applicant: Yamatake Corporation
    Inventors: Shinichi Ike, Hiroshi Hatakeyama, Satoshi Tsuchiya
  • Patent number: 7383726
    Abstract: The package structure may includes: a sensor chip having a detecting device formed on a front surface of a substrate; through electrodes that are arranged at predetermined positions of the substrate around the detecting device, electrically insulated at circumferences thereof, pierce the substrate from the front surface to a rear surface, are connected with lead patterns of the detecting device on the front surface side, and connected with signal fetching means for the outside on the rear surface side; a flow path body on which the sensor chip is mounted and which has a flow path (a conduction path) for a fluid being formed on a surface facing the detecting device and sealing means.
    Type: Grant
    Filed: February 7, 2007
    Date of Patent: June 10, 2008
    Assignee: Yamatake Corporation
    Inventors: Shinichi Ike, Nobuhiko Zushi, Takeshi Nishi
  • Publication number: 20070227260
    Abstract: Please replace the current Abstract with the following new Abstract. The package structure may includes: a sensor chip having a detecting device formed on a front surface of a substrate; through electrodes that are arranged at predetermined positions of the substrate around the detecting device, electrically insulated at circumferences thereof, pierce the substrate from the front surface to a rear surface, are connected with lead patterns of the detecting device on the front surface side, and connected with signal fetching means for the outside on the rear surface side; a flow path body on which the sensor chip is mounted and which has a flow path (a conduction path) for a fluid being formed on a surface facing the detecting device and sealing means.
    Type: Application
    Filed: February 7, 2007
    Publication date: October 4, 2007
    Inventors: Shinichi Ike, Nobuhiko Zushi, Takeshi Nishi
  • Patent number: 7185539
    Abstract: In a flow sensor (1) including an anticorrosion metallic diaphragm; an insulating film formed on one surface of the metallic diaphragm; and a flow rate measuring sensor formed on the insulating film, the other surface of the metallic diaphragm being in contact with a fluid under measure, between the insulating film (122) on which sensor devices (25) are formed and the metallic diaphragm, a buffer layer (121) having an intermediate linear expansion coefficient between the linear expansion coefficient of the insulating film (122) and the linear expansion coefficient of an anticorrosion metal is interposed. Thereby, the sensitivity and response of the flow sensor are improved, and also the heat resistance is improved, by which the flow sensor is made especially suitable for measuring the flow rate of a corrosive fluid.
    Type: Grant
    Filed: August 26, 2004
    Date of Patent: March 6, 2007
    Assignee: Yamatake Corporation
    Inventors: Shinichi Ike, Nobuhiko Zushi
  • Publication number: 20060288773
    Abstract: In a flow sensor (1) including an anticorrosion metallic diaphragm; an insulating film formed on one surface of the metallic diaphragm; and a flow rate measuring sensor formed on the insulating film, the other surface of the metallic diaphragm being in contact with a fluid under measure, between the insulating film (122) on which sensor devices (25) are formed and the metallic diaphragm, a buffer layer (121) having an intermediate linear expansion coefficient between the linear expansion coefficient of the insulating film (122) and the linear expansion coefficient of an anticorrosion metal is interposed. Thereby, the sensitivity and response of the flow sensor are improved, and also the heat resistance is improved, by which the flow sensor is made especially suitable for measuring the flow rate of a corrosive fluid.
    Type: Application
    Filed: August 26, 2004
    Publication date: December 28, 2006
    Inventors: Shinichi Ike, Nobuhiko Zushi
  • Patent number: 7117736
    Abstract: A flow sensor (1) is constituted by a substrate (4) having a front surface (4a) side facing a channel (3) for a measurement target fluid (2), and a channel forming member (5) and a plate (6) disposed oppositely across the substrate (4). The substrate (4) is formed of stainless steel having a thickness of about 50 ?m to 150 ?m into a plate. An electric insulating film is formed on that surface (4b) of the substrate (4) which is opposite to the channel (3) side, and a temperature detection sensor (7) for measuring the flow velocity (flow rate) of the fluid (2), an ambient temperature sensor (8), an electrode pad (9), and a thin metal film (10) for wiring are formed on it.
    Type: Grant
    Filed: October 17, 2001
    Date of Patent: October 10, 2006
    Assignee: Yamatake Corporation
    Inventors: Shoji Kamiunten, Yoshiyuki Ishikura, Shinichi Ike, Seiichiro Kinugasa, Hideyuki Tanaka
  • Patent number: 6981410
    Abstract: A flow sensor includes a substrate, an electrical insulating film, and a flow velocity detection mechanism. In the substrate, a diaphragm portion having a first surface in contact with a measurement target fluid and a thick fixing portion surrounding the diaphragm portion are integrally formed. The electrical insulating film is formed on a second surface of the diaphragm portion which is on a side opposite to the first surface. The flow velocity detection mechanism is arranged on the electrical insulating film. A method of manufacturing a flow sensor is also disclosed.
    Type: Grant
    Filed: May 9, 2003
    Date of Patent: January 3, 2006
    Assignee: Yamatake Corporation
    Inventors: Koji Seki, Nobuhiko Zushi, Shinichi Ike, Seishi Nakano, Tarou Nakata, Shoji Kamiunten
  • Publication number: 20040045352
    Abstract: A flow sensor (1) is constituted by a substrate (4) having a front surface (4a) side facing a channel (3) for a measurement target fluid (2), and a channel forming member (5) and a plate (6) disposed oppositely across the substrate (4). The substrate (4) is formed of stainless steel having a thickness of about 50 &mgr;m to 150 &mgr;m into a plate. An electric insulating film is formed on that surface (4b) of the substrate (4) which is opposite to the channel (3) side, and a temperature detection sensor (7) for measuring the flow velocity (flow rate) of the fluid (2), an ambient temperature sensor (8), an electrode pad (9), and a thin metal film (10) for wiring are formed on it.
    Type: Application
    Filed: September 25, 2003
    Publication date: March 11, 2004
    Inventors: Shoji Kamiunten, Yoshiyuki Ishikura, Shinichi Ike, Seiichiro Kinugasa, Hideyuki Tanaka
  • Publication number: 20040025585
    Abstract: A flow sensor includes a substrate, an electrical insulating film, and a flow velocity detection mechanism. In the substrate, a diaphragm portion having a first surface in contact with a measurement target fluid and a thick fixing portion surrounding the diaphragm portion are integrally formed. The electrical insulating film is formed on a second surface of the diaphragm portion which is on a side opposite to the first surface. The flow velocity detection mechanism is arranged on the electrical insulating film. A method of manufacturing a flow sensor is also disclosed.
    Type: Application
    Filed: May 9, 2003
    Publication date: February 12, 2004
    Inventors: Koji Seki, Nobuhiko Zushi, Shinichi Ike, Seishi Nakano, Tarou Nakata, Shoji Kamiunten
  • Patent number: D654385
    Type: Grant
    Filed: February 11, 2011
    Date of Patent: February 21, 2012
    Assignee: Yamatake Corporation
    Inventor: Shinichi Ike