Patents by Inventor Shinichi Ishiwata

Shinichi Ishiwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Radiation-curable adhesive tape
    Patent number: 5281473
    Abstract: There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.
    Type: Grant
    Filed: February 25, 1992
    Date of Patent: January 25, 1994
    Assignee: Furakawa Electric Co., Ltd.
    Inventors: Shinichi Ishiwata, Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi
  • Radiation-curable adhesive tape
    Patent number: 5149586
    Abstract: There is a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting-substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.
    Type: Grant
    Filed: December 21, 1990
    Date of Patent: September 22, 1992
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Shinichi Ishiwata, Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi
  • Radiation-curable adhesive tape
    Patent number: 4999242
    Abstract: There is provided a radiation-curable adhesive tape comprising a radiation-curable adhesive layer which is formed on a radiation transmitting substrate. The radiation-curable adhesive layer is composed of an acrylic adhesive and radiation-curable compound having carbon-carbon double bonds. The radiation-curable tape can be used preferably in processing steps for the production of semiconductor wafer, ceramics and glass employing a direct picking-up system.
    Type: Grant
    Filed: July 7, 1988
    Date of Patent: March 12, 1991
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Shinichi Ishiwata, Michio Ueyama, Hiroyuki Nakae, Yoshiyuki Funayama, Kazushige Iwamoto, Isamu Noguchi