Patents by Inventor Shinichi Ishiwata

Shinichi Ishiwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9324592
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: April 26, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: 9324593
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Grant
    Filed: January 3, 2012
    Date of Patent: April 26, 2016
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Hiromitsu Maruyama, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: 8722184
    Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
    Type: Grant
    Filed: March 28, 2008
    Date of Patent: May 13, 2014
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata
  • Patent number: 8545979
    Abstract: A wafer-processing tape, which has an adhesive layer and a removable adhesive layer formed on a surface of a base film, and which has an area where B>A, and an area where A>B, in which a peeling force between the base film and the adhesive layer is designated as A, and peeling forces between a target to be bonded and the adhesive layer and between a target to be bonded and the removable adhesive layer are designated as B, wherein the adhesive layer is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer is not transferred onto the target to be bonded in the area where A>B during peeling off the tape.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: October 1, 2013
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Kenji Kita, Yasumasa Morishima, Shinichi Ishiwata
  • Publication number: 20120100325
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Application
    Filed: January 3, 2012
    Publication date: April 26, 2012
    Inventors: Hiromitsu MARUYAMA, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: 8043698
    Abstract: A wafer-processing tape, having a removable adhesive layer (2), and an adhesive layer (3), formed on a substrate film (1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: October 25, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata, Takanori Yamakawa
  • Publication number: 20110014443
    Abstract: Problem to be Solved by the Invention: To provide a adhesive tape for electronic component fabrication, having extremely high antistatic performance, superior adherence between an antistatic layer and a adhesive layer, does not cause corrosion of a magnetic head that is comprised of a metal such as pure copper or the like, and alumina to occur, and which is easier to be released again.
    Type: Application
    Filed: December 10, 2008
    Publication date: January 20, 2011
    Applicant: The Furukawa Electric Co., Ltd
    Inventors: Hirotoki Yokoi, Akira Suda, Syouzou Yano, Shinichi Ishiwata
  • Publication number: 20100227165
    Abstract: A wafer processing tape includes a release film having a large length; an adhesive layer formed on a first surface of the release film and having a predetermined planar shape; a pressure-sensitive adhesive film having a label portion and a surrounding portion surrounding outside the label portion; and a support member formed on a second surface of the release film opposite to the first surface on which the adhesive layer and the pressure-sensitive adhesive film are formed. The label portion has a predetermined planar shape and covers the adhesive layer so that the label portion contacts with the release film around the adhesive layer. The support member is disposed at both end portions of the release film in a short side direction of the release film. The support member has a coefficient of linear expansion of 300 ppm/° C. or less.
    Type: Application
    Filed: July 16, 2008
    Publication date: September 9, 2010
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Noboru Sakuma, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: 7517724
    Abstract: The present invention provides a dicing/die bonding sheet which can be used as a dicing tape during dicing, enables ready separation of the semiconductor element and the adhesive layer from the pressure-sensitive adhesive layer during pickup, and in which the adhesive layer has satisfactory adhesiveness as a die bonding material. A dicing/die bonding sheet in which the pressure-sensitive adhesive layer comprises a compound (A), containing intramolecular, radiation curable carbon-carbon double bonds with an iodine value of 0.5 to 20, and at least one compound (B) selected from a group consisting of polyisocyanates, melamine-formaldehyde resins, and epoxy resins, and the adhesive layer comprises an epoxy resin (a), a phenolic resin (b) with a hydroxyl equivalent of at least 150 g/eq., an epoxy group-containing acrylic copolymer (c), comprising from 0.
    Type: Grant
    Filed: March 15, 2005
    Date of Patent: April 14, 2009
    Assignees: Hitachi Chemical Company, Ltd., Furukawa Electric Co., Ltd.
    Inventors: Keiichi Hatakeyama, Michio Uruno, Takayuki Matsuzaki, Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata
  • Publication number: 20080299345
    Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
    Type: Application
    Filed: March 28, 2008
    Publication date: December 4, 2008
    Inventors: Yasumasa MORISHIMA, Kenji Kita, Shinichi Ishiwata
  • Patent number: 7413965
    Abstract: A method of manufacturing a thin-film circuit substrate, containing: (a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the substrate, to form a section to be formed a penetrating section; (b) providing a protecting adhesive tape to adhere to the gouged surface of the substrate, before a backing surface of the substrate is ground; (c) grinding the backing surface in such a thickness that the gouged section would not penetrate; (d) dry etching entirely the backing surface, while the tape adheres to the substrate, after completion of the grinding for the backing surface; and (e) making the gouged section of the substrate to penetrate, by the dry etching, thereby forming the penetrating structure section; and, a protecting adhesive tape usable in the method.
    Type: Grant
    Filed: September 14, 2005
    Date of Patent: August 19, 2008
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shinichi Ishiwata, Masakatsu Inada
  • Publication number: 20070141330
    Abstract: A wafer-processing tape, having a removable adhesive layer(2), and an adhesive layer (3), formed on a substrate film(1), wherein the tape is used in a process involving the steps of: grinding a back face of a wafer circuit substrate (5) having convex-type metal electrodes (4), and dicing the wafer circuit substrate into chips, in a state that the tape is adhered to the wafer circuit substrate; and picking up the chips, in which the chips are picked up in a state that the adhesive layer (3) is peeled from the substrate film (1) but is bonded to the individual chip.
    Type: Application
    Filed: January 31, 2007
    Publication date: June 21, 2007
    Inventors: Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata, Takanori Yamakawa
  • Publication number: 20060204749
    Abstract: A wafer-processing tape (10), having an intermediate resin layer (2), a removable adhesive layer (3), and, if necessary, an adhesive layer (4), which are laminated in this order on a substrate film (1), wherein a storage elastic modulus at 80° C. of the intermediate resin layer is larger than a storage elastic modulus at 80° C. of the removable adhesive layer.
    Type: Application
    Filed: May 4, 2006
    Publication date: September 14, 2006
    Inventors: Kenji Kita, Yasumasa Morishima, Shinichi Ishiwata, Akira Yabuki
  • Publication number: 20060154066
    Abstract: A wafer-processing tape, which has an adhesive layer (1) and a removable adhesive layer (2) formed on a surface of a base film (3), and which has an area where B>A, and an area where A>B, in which a peeling force between the base film (3) and the adhesive layer (1) is designated as A, and peeling forces between a target to be bonded (4) and the adhesive layer (1) and between a target to be bonded (5) and the removable adhesive layer (2) are designated as B, wherein the adhesive layer (1) is transferred onto the chip side during pickup in the area where B>A, and the removable adhesive layer (2) is not transferred onto the target to be bonded (5) in the area where A>B during peeling off the tape.
    Type: Application
    Filed: March 9, 2006
    Publication date: July 13, 2006
    Inventors: Kenji Kita, Yasumasa Morishima, Shinichi Ishiwata
  • Publication number: 20060115989
    Abstract: A method of manufacturing a thin-film circuit substrate, containing: (a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the substrate, to form a section to be formed a penetrating section; (b) providing a protecting adhesive tape to adhere to the gouged surface of the substrate, before a backing surface of the substrate is ground; (c) grinding the backing surface in such a thickness that the gouged section would not penetrate; (d) dry etching entirely the backing surface, while the tape adheres to the substrate, after completion of the grinding for the backing surface; and (e) making the gouged section of the substrate to penetrate, by the dry etching, thereby forming the penetrating structure section; and, a protecting adhesive tape usable in the method.
    Type: Application
    Filed: September 14, 2005
    Publication date: June 1, 2006
    Inventors: Shinichi Ishiwata, Masakatsu Inada
  • Publication number: 20050249909
    Abstract: A wafer-adhering adhesive tape, which has, on a surface of a base, a radiation-curable removable adhesive layer, and if necessary a die-bonding adhesive layer in order, wherein the radiation-curable removable adhesive layer is mainly composed of an acrylic-series copolymer having, in a principal chain, at least a radiation-curable carbon-carbon double bond containing group, a hydroxyl group, and a group containing a carboxyl group, respectively, and the radiation-curable removable adhesive layer has a gel fraction of 60% or greater.
    Type: Application
    Filed: July 19, 2005
    Publication date: November 10, 2005
    Inventors: Yasumasa Morishima, Kenji Kita, Shinichi Ishiwata
  • Patent number: 5538771
    Abstract: There is disclosed a semiconductor wafer-securing adhesive tape having a radiation-curable adhesive layer on one surface of a support film, wherein the support film is composed of a laminated film that comprises, as a center layer, a film comprising a styrene/ethylene/butene/styrene block copolymer, a ethylene/acrylic acid-type copolymer, and a polyamide/polyether copolymer in a specific ratio, and has a layer for adhesive coating laid, directly or through a bonding layer, on one surface of the center layer on the side where said radiation-curable adhesive layer is provided, and has a transfer-preventing layer laid, directly or through a bonding layer, on the other surface of the center layer. There is also disclosed a semiconductor wafer-securing adhesive tape wherein the center layer of said semiconductor wafer-securing adhesive tape has a film comprising said SEBS block copolymer or SEPS block copolymer, an amorphous poly .alpha.-olefin, and a polyamide/polyether copolymer, in a specific ratio.
    Type: Grant
    Filed: August 17, 1993
    Date of Patent: July 23, 1996
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Koji Nakayama, Kenji Mougi, Eiji Shiramatsu, Kazushige Iwamoto, Shinichi Ishiwata, Morikuni Hasebe
  • Patent number: 5300172
    Abstract: There is disclosed a surface-protection method during chemical etching of a plate material, which comprises sticking a radiation-curable adhesive tape onto the area of plate material where etching should not be effected, and after the radiation-curable adhesive layer is cured with irradiation of radiation, subjecting said plate material to a chemical etching treatment.
    Type: Grant
    Filed: October 29, 1992
    Date of Patent: April 5, 1994
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Shinichi Ishiwata, Kazushige Iwamoto, Michio Ueyama, Isamu Noguchi
  • Patent number: D621803
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: August 17, 2010
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata
  • Patent number: D628170
    Type: Grant
    Filed: July 16, 2008
    Date of Patent: November 30, 2010
    Assignee: The Furukawa Electric Company
    Inventors: Hiromitsu Maruyama, Shuzo Taguchi, Yasumasa Morishima, Shinichi Ishiwata