Abstract: A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.

Abstract: Provided herein is a double dual slot load lock chamber. The double dual slot load lock chamber includes two isolated load lock regions that are vertically stacked and share a common wall, wherein each isolated load lock region comprises two substrate slots.

Abstract: A substrate table and method for supporting and transferring a substrate are provided. The substrate table includes a segmented stage having an upper surface for supporting a substrate, and an end effector. The end effector includes two or more spaced apart fingers and an upper surface for supporting a substrate. The end effector is at least partially disposed and moveable within the segmented stage such that the fingers of the end effector and the segmented stage interdigitate to occupy the same horizontal plane. The segmented stage is adapted to raise and lower about the end effector.

Abstract: Methods and apparatus for cleaning a nozzle plate of an inkjet print head are provided. A first method includes positioning a cleaning medium proximate the inkjet print head, determining a pressure for an inflatable bladder to apply against the cleaning medium, contacting the cleaning medium with the bladder with the determined pressure, and moving the cleaning medium relative to the inkjet print head so as to clean the inkjet print head. The method also includes purging ink from the inkjet print head prior to the bladder contacting the cleaning medium and pre-jetting ink from the inkjet print head after moving the cleaning medium. Numerous other aspects are provided.

Abstract: An improved prober for an electronic devices test system is provided. The prober is “configurable,” meaning that it can be adapted for different device layouts and substrate sizes. The prober generally includes a frame, at least one prober bar having a first end and a second end, a frame connection mechanism that allows for ready relocation of the prober bar to the frame at selected points along the frame, and a plurality of electrical contact pins along the prober bar for placing selected electronic devices in electrical communication with a system controller during testing. In one embodiment, the prober is be used to test devices such as thin film transistors on a glass substrate. Typically, the glass substrate is square, and the frame is also square. In this way, “x” and “y” axes are defined by the frame.

Abstract: Provided herein is a substrate processing system, which comprises a cassette load station; a load lock chamber; a centrally located transfer chamber; and one or more process chambers located about the periphery of the transfer chamber. The load lock chamber comprises double dual slot load locks constructed at same location. Such system may be used for processing substrates for semiconductor manufacturing.

Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.

Abstract: A method and apparatus for forming solar panels from n-doped silicon, p-doped silicon, intrinsic amorphous silicon, and intrinsic microcrystalline silicon using a cluster tool is disclosed. The cluster tool comprises at least one load lock chamber and at least one transfer chamber. When multiple clusters are used, at least one buffer chamber may be present between the clusters. A plurality of processing chambers are attached to the transfer chamber. As few as five and as many as thirteen processing chambers can be present.

Abstract: The invention provides a print head parking structure that includes a solvent and/or surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath or pool to dissolve or wash away any ink that has been deposited on the print heads.

Abstract: The invention provides a method of operating a inkjet printing system that may include a print head parking structure and a print head cleaning station. A print head parking structure may include a solvent and/or nozzle surface treatment bath for inkjet print heads. Print heads may be returned to the print head parking structure after a substrate has been printed, after one or more printing passes, and/or frequently enough to prevent ink from drying on or clogging the print heads. Once sealed within the print head parking structure, the print heads (or a portion thereof) may be dipped in a solvent bath to dissolve or wash away any ink that has been deposited on the print heads. The print heads may be coated with a surface treatment that improves jetting reliability. The print heads may be dried and moved to the print head cleaning station where they may be wiped and pre-jetting may be performed.

Abstract: In a first aspect, a system is provided for inkjet printing. The system includes (1) a first set including a first inkjet print head having a first plurality of nozzles adapted to selectively dispense a first ink, and a second inkjet print head having a second plurality of nozzles adapted to selectively dispense a second ink, (2) a second set including a third inkjet print head having a third plurality of nozzles adapted to selectively dispense a third ink and a fourth inkjet print head having a fourth plurality of nozzles adapted to selectively dispense a fourth ink and (3) a stage adapted to support and transport the substrate below the first and second sets during a printing pass such that the first set and second sets are adapted to dispense respective first/second and third/fourth inks into adjacent color wells of a display pixel on a substrate.

Abstract: It is an object of the present invention to provide an integrated circuit device structured to uniformly apply a voltage to side oxide films formed in a trench at both sides in an SOI substrate. The semiconductor integrated circuit device of the present invention comprises a substrate which supports a first insulation layer below an active device region, trench formed in the active device region to come into contact with the first insulation layer, second insulation film formed on the trench side wall, polycrystalline silicon with which the trench is filled, and third insulation film formed on the polycrystalline silicon, wherein the thickness ratio of the third insulation film to the first insulation film is 0.25 or more to uniformly apply a voltage to the oxide insulation films formed in the trench at both sides.

Abstract: Methods, apparatus and systems are disclosed for printing color filters for flat panel displays and avoiding mura effects by depositing a plurality of ink drops on a substrate within a column of pixel wells and intentionally varying the size and/or the relative lateral position of the ink drops deposited in the pixel wells. Numerous other aspects are disclosed.

Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.

Abstract: An illumination optical apparatus is arranged to illuminate a surface to be illuminated, with light in a desired polarization state, without substantive influence of manufacturing error of an optical member functioning as a wave plate. The illumination optical apparatus illuminates the surface to be illuminated (M, W) on the basis of light from a light source (1). The illumination optical apparatus is provided with a polarization converting element (12) disposed on or near an illumination pupil plane and adapted for converting a polarization state of incident light into a predetermined polarization state. The polarization converting element has a plurality of variable optical rotating members for variably yielding an angle of rotation to incident linearly polarized light. Each variable optical rotating member has two deviation prisms which are made of an optical material with an optical rotatory power and which are movable relative to each other along a direction intersecting with the optical axis (AX).

Abstract: A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.

Abstract: A load lock chamber and method for transferring large area substrates is provided. In one embodiment, a load lock chamber suitable for transferring large area substrates includes a plurality of vertically stacked single substrate transfer chambers. The configuration of vertically stacked single substrate transfer chambers contributes to reduced size and greater throughput as compared to conventional state of the art, dual slot dual substrate designs. Moreover, the increased throughput has been realized at reduced pumping and venting rates, which corresponds to reduced probability of substrate contamination due to particulates and condensation.

Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

Abstract: Methods and apparatus for inkjet inkjet drop positioning are provided. A first method includes determining an intended deposition location of an ink drop on a substrate, depositing the ink drop on the substrate using an inkjet printing system, detecting a deposited location of the deposited ink drop on the substrate, comparing the deposited location to the intended location, determining a difference between the deposited location and the intended location, and compensating for the difference between the deposited location and the intended location by adjusting a parameter of an inkjet printing system. Numerous other aspects are provided.

Abstract: Methods and apparatus for cleaning a nozzle plate of an inkjet print head are provided. A first method includes positioning a cleaning medium proximate the inkjet print head, determining a pressure for a pressure roller to apply against the cleaning medium, contacting the cleaning medium with the pressure roller with the determined pressure, and moving the cleaning medium relative to the inkjet print head so as to clean the inkjet print head. The method also includes purging ink from the inkjet print head prior to the pressure roller contacting the cleaning medium and pre-jetting ink from the inkjet print head after moving the cleaning medium. Numerous other aspects are provided.