Patents by Inventor Shinichi Kurita

Shinichi Kurita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7982266
    Abstract: A dielectrically isolated semiconductor device of high reliability is provided by realizing a fine and deep element isolating region which can prevent dislocation of an oxide film as an insulation layer by oxidation-induced stress. The dielectrically isolated semiconductor device includes an SOI substrate supporting an active element layer deeper than an expanded distance of a depletion layer subjected to the highest voltage applied to the device, and an element isolating region which encloses the active element layer. The element isolating region contains a deep trench which comes into contact with the insulation layer, and which is filled with n heavily doped layers on both side walls, second insulation films each adjacent to the n heavily doped layer and a polycrystalline semiconductor layer formed between the second insulation films.
    Type: Grant
    Filed: March 9, 2007
    Date of Patent: July 19, 2011
    Assignee: Hitachi, Ltd.
    Inventors: Atsuo Watanabe, Mitsutoshi Honda, Norio Ishitsuka, Masahiro Ito, Toshihito Tabata, Shinichi Kurita, Hidekazu Kamioka
  • Patent number: 7976635
    Abstract: One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: July 12, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Wendell T. Blonigan, Akihiro Hosokawa
  • Patent number: 7973546
    Abstract: A method for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the method includes transferring a substrate on an end effector relative to a testing platform having a plurality of testing columns coupled thereto, the substrate having a plurality of electronic devices located thereon, and moving the substrate in a single directional axis relative to an optical axis of each of the plurality of testing columns, the single directional axis being substantially orthogonal to the optical axis to define a test area on the substrate, wherein the test area is configured to cover an entire length or an entire width of the substrate such that the testing columns are capable of testing the entire substrate as the substrate is moved through the test area.
    Type: Grant
    Filed: June 29, 2010
    Date of Patent: July 5, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Fayez E. Abboud, Sriram Krishnaswami, Benjamin M. Johnston, Hung T. Nguyen, Matthias Brunner, Ralf Schmid, John M. White, Shinichi Kurita, James C. Hunter
  • Publication number: 20110146577
    Abstract: Embodiments of the present invention generally relate to a gas distribution showerhead having insulated corner regions to reduce arcing and improve deposition uniformity control. In one embodiment, the gas distribution showerhead is formed of a conductive material with material from the corner regions removed. Corner members formed substantially in the shape of the removed portion of corner regions are attached to the conductive showerhead. The corner members may be made of a material having electrical insulating properties, such as a ceramic or insulating polymer.
    Type: Application
    Filed: December 22, 2010
    Publication date: June 23, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: SUHAIL ANWAR, John M. White, Soo Young Choi, Gaku Furuta, Shinichi Kurita, Carl Sorenson, Robin L. Tiner
  • Patent number: 7923057
    Abstract: Methods, apparatus and systems are disclosed for printing color filters for flat panel displays and avoiding mura effects by depositing a plurality of ink drops on a substrate within a column of pixel wells and intentionally varying the size and/or the relative lateral position of the ink drops deposited in the pixel wells. Numerous other aspects are disclosed.
    Type: Grant
    Filed: February 6, 2007
    Date of Patent: April 12, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Bassam Shamoun
  • Patent number: 7919972
    Abstract: A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may include an end effector disposed therein to transfer the substrate relative to an upper surface of the testing table. The method includes transferring the substrate to the testing table and moving the substrate relative to the plurality of testing columns. Signals indicative of electronic device performance are sensed to determine operability of the devices on the substrate.
    Type: Grant
    Filed: January 18, 2008
    Date of Patent: April 5, 2011
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Emanuel Beer, Hung T. Nguyen, Benjamin Johnston, Fayez E. Abboud
  • Publication number: 20110076118
    Abstract: A method and apparatus for a transfer robot that having at least one image sensor disposed thereon is provided. The transfer robot includes a lift assembly having a first drive assembly for moving a first platform relative to a second platform in a first linear direction, an end effector assembly disposed on the second platform and movable in a second linear direction by a second drive assembly, the second linear direction being orthogonal to the first linear direction, at least one image sensor, and a lighting device associated with the at least one image sensor.
    Type: Application
    Filed: September 24, 2010
    Publication date: March 31, 2011
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Shinichi Kurita, Takayuki Matsumoto, Suhail Anwar, Makoto Inagawa
  • Publication number: 20100327162
    Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.
    Type: Application
    Filed: June 29, 2010
    Publication date: December 30, 2010
    Inventors: FAYEZ E. ABBOUD, Sriram Krishnaswami, Benjamin M. Johnston, Hung T. Nguyen, Matthias Brunner, Ralf Schmid, John M. White, Shinichi Kurita, James C. Hunter
  • Patent number: 7847566
    Abstract: A method of testing electronic devices on substrates is described. The method includes placing a configurable prober over a first substrate, testing the first substrate, re-configuring the configurable prober, placing the configurable prober over a second substrate, and testing the second substrate.
    Type: Grant
    Filed: November 15, 2007
    Date of Patent: December 7, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Matthias Brunner, Shinichi Kurita, Ralf Schmid, Fayez (Frank) E. Abboud, Benjamin Johnston, Paul Bocian, Emanuel Beer
  • Patent number: 7845891
    Abstract: Embodiments of the invention include a chamber body having at least one of a top or bottom decoupled from the sidewalls of the chamber body. The invention is suitable for use as a load lock chamber, substrate transfer chamber and vacuum processing chambers, among others.
    Type: Grant
    Filed: January 13, 2006
    Date of Patent: December 7, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Jae-Chull Lee, Shinichi Kurita, John M. White, Suhail Anwar
  • Publication number: 20100288197
    Abstract: Embodiments disclosed herein generally relate to an apparatus having an anodized gas distribution showerhead. In large area, parallel plate RF processing chambers, mastering the RF return path can be challenging. Arcing is a frequent problem encountered in RF processing chambers. To reduce arcing in RF processing chambers, straps may be coupled to the susceptor to shorten the RF return path, a ceramic or insulating or anodized shadow frame may be coupled to the susceptor during processing, and an anodized coating may be deposited onto the edge of the showerhead that is nearest the chamber walls. The anodized coating may reduce arcing between the showerhead and the chamber walls and therefore enhance film properties and increase deposition rate.
    Type: Application
    Filed: May 13, 2010
    Publication date: November 18, 2010
    Applicant: Applied Materials, Inc.
    Inventors: Soo Young Choi, Suhail Anwar, Gaku Furuta, Beom Soo Park, Robin L. Tiner, John M. White, Shinichi Kurita
  • Publication number: 20100281683
    Abstract: A non-polygon shaped, multi-piece chamber is provided. A non-polygon shaped, multi-piece chamber may include (1) a central piece having a first side and a second side, (2) a first side piece adapted to couple with the first side of the central piece, and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece, and the second side piece form a cylindrical overall shape when coupled together. Numerous other aspects are provided.
    Type: Application
    Filed: July 20, 2010
    Publication date: November 11, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: John M. White, Donald Verplancken, Shinichi Kurita
  • Publication number: 20100269853
    Abstract: Systems and methods for debris extraction reduce the lifting force on the workpiece through a supply air feature. The supply air feature can be implemented through an extraction nozzle, which has an outer supply duct surrounding an inner exhaust duct. Further reduction of the lifting force can be realized through the use of multiple extraction nozzles which limit exhaust airflow to areas of the workpiece with active laser scribing.
    Type: Application
    Filed: April 27, 2009
    Publication date: October 28, 2010
    Applicant: Applied Materials, Inc.
    Inventors: BENJAMIN JOHNSTON, Shinichi Kurita
  • Patent number: 7822324
    Abstract: Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: October 26, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Suhail Anwar, Jae-Chull Lee, Shinichi Kurita
  • Patent number: 7784164
    Abstract: A non-polygon shaped, multi-piece chamber is provided. A non-polygon shaped, multi-piece chamber may include (1) a central piece having a first side and a second side, (2) a first side piece adapted to couple with the first side of the central piece, and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece, and the second side piece form a cylindrical overall shape when coupled together. Numerous other aspects are provided.
    Type: Grant
    Filed: August 29, 2005
    Date of Patent: August 31, 2010
    Assignee: Applied Materials, Inc.
    Inventors: John M. White, Donald Verplancken, Shinichi Kurita
  • Publication number: 20100196626
    Abstract: A method and apparatus for providing an electrically symmetrical ground or return path for electrical current between two electrodes is described. The apparatus includes at least on radio frequency (RF) device coupled to one of the electrodes and between a sidewall and/or a bottom of a processing chamber. The method includes moving one electrode relative to another and realizing a ground return path based on the position of the displaced electrode using one or both of a RF device coupled to a sidewall and the electrode, a RF device coupled to a bottom of the chamber and the electrode, or a combination thereof.
    Type: Application
    Filed: February 4, 2010
    Publication date: August 5, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Soo Young Choi, Robin L. Tiner, Shinichi Kurita, John M. White, Carl A. Sorensen, Jeffrey A. Kho, Suhail Anwar, Makoto Inagawa, Gaku Furuta
  • Patent number: 7746088
    Abstract: A method and apparatus for testing a plurality of electronic devices formed on a large area substrate is described. In one embodiment, the apparatus performs a test on the substrate in one linear axis in at least one chamber that is slightly wider than a dimension of the substrate to be tested. Clean room space and process time is minimized due to the smaller dimensions and volume of the system.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: June 29, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Fayez E. Abboud, Sriram Krishnaswami, Benjamin M. Johnston, Hung T. Nguyen, Matthias Brunner, Ralf Schmid, John M. White, Shinichi Kurita, James C. Hunter
  • Patent number: 7735710
    Abstract: A method and apparatus for supporting a substrate is generally provided. In one aspect, an apparatus for supporting a substrate includes a support plate having a first body disposed proximate thereto. A first pushing member is radially coupled to the first body and adapted to urge the substrate in a first direction parallel to the support plate when the first body rotates. In another aspect, a load lock chamber having a substrate support that supports a substrate placed thereon includes a cooling plate that is moved to actuate at least one alignment mechanism. The alignment mechanism includes a pushing member that urges the substrate in a first direction towards a center of the support. The pushing member may additionally rotate about an axis perpendicular to the first direction.
    Type: Grant
    Filed: November 16, 2004
    Date of Patent: June 15, 2010
    Assignee: Applied Materials, Inc.
    Inventors: Shinichi Kurita, Wendell T. Blonigan, Suhail Anwar, Toshio Kiyotake, Hung T. Nguyen
  • Publication number: 20100139889
    Abstract: Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.
    Type: Application
    Filed: February 22, 2010
    Publication date: June 10, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Shinichi Kurita, Suhail Anwar, Jae-Chull Lee
  • Publication number: 20100122982
    Abstract: Embodiments disclosed herein relate to a large vacuum chamber body that has been welded together. The chamber body may have a high emissivity coating on at least one surface therein. Due to the large size of the chamber body, the chamber body may be formed by welding several pieces together rather than forging the body from a single piece of metal. The pieces may be welded together at a location spaced from the corner of the body, which may be under the greatest stress during evacuation, to ensure that the weld, which may be the weakest point in the body, does not fail. At least one surface of the chamber body may be coated with a high emissivity coating to aid in heat transfer from incoming, heated substrates. The high emissivity coating may increase substrate throughput by lowering the time that may be needed to reduce the substrate temperature.
    Type: Application
    Filed: August 3, 2009
    Publication date: May 20, 2010
    Applicant: APPLIED MATERIALS, INC.
    Inventors: SHINICHI KURITA, Mehran Behdjat, Makoto Inagawa