Abstract: Provided is a micro optical circuit including a first micro optical waveguide and a second micro optical waveguide with a boundary face therebetween, in which the height of the first and second micro optical waveguides is different from each other, and the side faces of the first micro optical waveguide are connected to the side faces of the second micro optical waveguide at first and second connection points in a plan view. An intersection between the boundary face and the center line equidistant from the two side faces of the second micro optical waveguide is present in a region between a first straight line and a second straight line in a plan view, the first straight line passing through the first and second connection points, the second straight line crossing the second micro optical waveguide so as not to cross the first micro optical waveguide.

Abstract: An electronic component comprises: a magnetic core having a flat base and a core, the flat base having a top, a bottom, and first and second opposite sides, the core is on the top; a winding having an edgewise coil including a wound flat wire and the core, the winding having two non-wound flat wires extending therefrom; and a magnetic exterior body covering the core and the edgewise coil. The two non-wound flat wires extend along the top, the first side, the bottom and then the second side, and the two non-wound flat wires are non-adhesively positioned around the flat base. The two non-wound flat wires on the bottom are externally exposed electrodes. The second side inclines towards the core. The two ends of the two non-wound flat wires are embedded into the magnetic exterior body to fix the two non-wound flat wires to the magnetic exterior body.

Abstract: A photodetector includes: a substrate; an optical fiber disposed on the substrate; and a photodetection element fixed to the substrate, and that detects scattered light of light guided by the optical fiber. The photodetector further includes: a first fixing member and a second fixing member that fix the optical fiber to the substrate.

Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Abstract: A battery module includes a plurality of battery cells each having a terminal, and a lead plate having a lead part each of which is joined to the terminal of each of the battery cells to electrically connect the battery cells to each other. The lead part includes an aluminum thin plate having aluminum purity higher than or equal to 99.0%. Surface roughness Ra of a joining surface of the lead part to the terminal is less than or equal to 10 ?m. The lead part is electrically connected to the terminal by solid-phase bonding.

Abstract: An electronic component includes a magnetic core member, a winding and a magnetic exterior body. The magnetic core member has a flat base and a core. The flat base has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface. The core is located on the top surface of the flat base. A winding has an edgewise coil and two non-wound flat wires that extend from the edgewise coil. A magnetic exterior body covers at least the core and the edgewise coil. The two non-wound flat wires continuously extend along the top surface, the first side surface, the bottom surface and the second side surface of the flat base in this order. The two non-wound flat wires located on the bottom surface work as electrodes.

Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Abstract: A double mirror (Mi) is made of a first mirror (Mi1) that is mounted on a top surface of a base plate (B) and a second mirror (Mi2) that is mounted on a top surface of the first mirror (Mi1). The first mirror (Mi1) has a reflective surface (S1) for reflecting an input beam. The second mirror (Mi2) has a reflective surface (S2) for reflecting the input beam which has been reflected by the reflective surface (S1).

Abstract: A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Abstract: A method for manufacturing an electronic component for avoiding electromagnetic interference includes: (a) placing a T-shaped core and an air-core coil in a metal mold; (b) injecting a mixture of a composite magnetic material and a resin into the metal mold so that the T-shaped core and the air-core coil are embedded by the mixture; (c) heating the mixture at a first temperature; (d) adjusting an outer shape while removing excessive mixture; and (e) hardening the mixture. The method may further include a process of polishing an outside of the hardened mixture. The method may further include a process of applying a pressure of 0.1 to 20.0 kg/cm2 to the mixture for adjusting an outer shape of the mixture by a movable punch of a press machine before the hardening process.

Abstract: An optical device includes a window glass plate with which a window of a lid section is provided and which is connected to the lid section via a solder layer so that an internal space of the optical device is hermetically sealed. The solder layer has a void which is isolated from an external space and an internal space of the optical device.

Abstract: In a laser device 1 in which a laser module 2 is mounted on a heat sink 3, a base plate 20 of the laser module 2 is fixed onto a mounting surface 3s of the heat sink 3 in such a manner that a peripheral part 20b is fixed to the heat sink 3 with screws. The elastic force of the base plate 20 causes stress in the direction toward the mounting surface 3s on the central part 20a of the base plate 20 surrounded by the peripheral part 20b.

Abstract: In order to reduce a high frequency loss of a substrate-type optical waveguide without facilitating, in a low frequency domain, a reflection by an entrance end of a traveling-wave electrode, the substrate-type optical waveguide includes a coplanar line, provided on an upper surface of an upper cladding, which includes (i) a traveling-wave electrode connected to a P-type semiconductor region and (ii) an earth conductor connected to an N-type semiconductor region. The traveling-wave electrode and the earth conductor are provided so that a distance D therebetween decreases as a distance from an entrance end of the traveling-wave electrode increases.

Abstract: Emitter width of an LD is set greater than a diameter, of a core, in an entrance end surface of an optical fiber. An optical system provided between the LD and the optical fiber causes a diameter, of laser beam, in the entrance end surface of the optical fiber to become smaller than the diameter, of the core, in the entrance end surface of the optical fiber. The LD is configured so that a beam parameter product of the laser beam emitted from the LD shows a local minimal value which changes in accordance with the emitter width of the LD, and which is equal to or smaller than a beam parameter product of the optical fiber. The emitter width of the LD is set so that the beam parameter product of the laser beam emitted from the LD is equal to or smaller than that of the optical fiber.

Abstract: The substrate-type optical waveguide includes a rib-slab type core. A depletion layer exists in a rib part and, in any cross section of the core, a width of a first slab part is set to be greater than a width of a second slab part.

Abstract: In a laser device 1 in which a laser module 2 is mounted on a heat sink 3, a base plate 20 of the laser module 2 is fixed onto a mounting surface 3s of the heat sink 3 in such a manner that a peripheral part 20b is fixed to the heat sink 3 with screws. The elastic force of the base plate 20 causes stress in the direction toward the mounting surface 3s on the central part 20a of the base plate 20 surrounded by the peripheral part 20b.

Abstract: A control method of the present invention is a control method of controlling a fiber laser including a plurality of LD modules constituting a plurality of groups. The control method includes the steps of: (a) detecting an intensity of laser light outputted from the fiber laser; and (b) controlling a driving current so that, in a case where the intensity of the laser light which intensity has been detected in the step (a) is lower than a predetermined lower limit threshold, a driving current for LD modules in a specific group among the plurality of groups is increased.

Abstract: In order to reduce a high frequency loss of a substrate-type optical waveguide without facilitating, in a low frequency domain, a reflection by an entrance end of a traveling-wave electrode, the substrate-type optical waveguide includes a coplanar line, provided on an upper surface of an upper cladding, which includes (i) a traveling-wave electrode connected to a P-type semiconductor region and (ii) an earth conductor connected to an N-type semiconductor region. The traveling-wave electrode and the earth conductor are provided so that a distance D therebetween decreases as a distance from an entrance end of the traveling-wave electrode increases.

Abstract: To provide an optical device which enables both (i) suppression of an increase in production cost and (ii) suppression of an increase in optical loss which increase is caused in accordance with a change in temperature of an external environment. In the optical device, a holding member and an optical fiber are bonded and fixed to each other via a first resin layer which is provided between a holding surface of the holding member and a surface of the optical fiber, and the substrate waveguide and the holding member are bonded and fixed to each other via a second resin layer which is provided between an upper surface of the substrate waveguide and a region (bonding surface 31) of a lower surface of the holding member which region is outside the holding surface.