Patents by Inventor Shinichi Yano

Shinichi Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7129298
    Abstract: The present invention provides a TFE resin molding material which has electric characteristics, particularly low dielectric dissipation factor, in a microwave area, can also lower extrusion pressure as the material is of low molecular weight and can provide a molded article excellent in surface smoothness. The material is especially useful as a coating material for a coaxial cable for equipment in which microwave is used, including satellite transmitting equipment and a cell phone base station. A tetrafluoroethylene resin molding material excellent in high frequency electric characteristics, which provides a molded article having a dielectric constant of at most 2.2 and a dielectric dissipation factor of at most 1.60×10?4 under 12 GHz, and a standard specific gravity of at least 2.192 and less than 2.3 is provided. As the tetrafluoroethylene resin, a tetrafluoroethylene homopolymer or a copolymer of 99.9 to 99.9999% by mole of tetrafluoroethylene and 0.0001 to 0.1% by mole of a specific fluoromonomer is used.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: October 31, 2006
    Assignee: Daikin Industries, Ltd.
    Inventors: Makoto Ono, Michio Asano, Yoshinori Nanba, Shunji Kasai, Hiroyuki Yoshimoto, Shinichi Yano, Tetsuo Shimizu
  • Patent number: 6987224
    Abstract: A polytetrafluoroethylene mixed powder, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000±500,000 and a maximum peak temperature of 327±5° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000±1,000,000 and a maximum peak temperature of 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, and the mixed powder has evident peak temperatures of 327±5° C. and 340±7° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter.
    Type: Grant
    Filed: May 29, 2001
    Date of Patent: January 17, 2006
    Assignee: Daikin Industries, Ltd.
    Inventors: Katsutoshi Yamamoto, Hiroyuki Yoshimoto, Kazuo Ishiwari, Shinichi Yano
  • Publication number: 20040236047
    Abstract: The present invention provides a TFE resin molding material which has electric characteristics, particularly low dielectric dissipation factor, in a microwave area, can also lower extrusion pressure as the material is of low molecular weight and can provide a molded article excellent in surface smoothness. The material is especially useful as a coating material for a coaxial cable for equipment in which microwave is used, including satellite transmitting equipment and a cell phone base station. A tetrafluoroethylene resin molding material excellent in high frequency electric characteristics, which provides a molded article having a dielectric constant of at most 2.2 and a dielectric dissipation factor of at most 1.60×10−4 under 12 GHz, and a standard specific gravity of at least 2.192 and less than 2.3 is provided. As the tetrafluoroethylene resin, a tetrafluoroethylene homopolymer or a copolymer of 99.9 to 99.9999% by mole of tetrafluoroethylene and 0.0001 to 0.
    Type: Application
    Filed: January 27, 2003
    Publication date: November 25, 2004
    Inventors: Makato Ono, Michio Asano, Yoshinori Nanba, Shunji Kasai, Hiroyuki Yoshimoto, Shinichi Yano, Tetsuo Shimizu
  • Publication number: 20040197566
    Abstract: The present invention provides a polytetrafluoroethylene molded article, particularly a PTFE molded article for high-frequency insulation, which is excellent in various electric properties and mechanical properties in a high frequency range of 3 to 30 GHz. The present invention also provides PTFE fine powder, which is excellent in extrusion moldability and capable of providing the molded article, and a process for preparing the same. More specifically, the present invention relates to a polytetrafluoroethylene fine powder having a standard specific gravity of 2.180 to 2.225, which is obtained by contacting polytetrafluoroethylene fine powder having a standard specific gravity of 2.180 to 2.225 with a fluorine radical source, wherein tan &dgr; at 12 GHz of a film comprising the powder, which is obtained by cooling at 5 to 50° C./second after baking, is at most 2.0×10−4.
    Type: Application
    Filed: January 30, 2004
    Publication date: October 7, 2004
    Inventors: Tetsuo Shimizu, Michio Asano, Makoto Ono, Yoshinori Nanba, Shunji Kasai, Shinichi Yano, Hiroyuki Yoshimoto
  • Publication number: 20040112627
    Abstract: An insulating layer for high frequency signal transmission device having a low dielectric constant, low dielectric dissipation factor and improved end processability, and a material powder thereof are provided. A polytetrafluoroethylene mixed powder for insulation of a product for high-frequency signal transmission, which is obtained by mixing low molecular weight polytetrafluoroetylene powder and high molecular weight polytetrafluoroethylene powder obtained by emulsion polymerization of tetrafluoroethylene, wherein the low molecular weight polytetrafluoroetylene powder has a number average molecular weight of 1,000,000±500,000 and a maximum peak temperature of 327±5° C. in the endothermic curve appearing on the crystalline melting curve obtained by using a differential scanning calorimeter, the high molecular weight polytetrafluoroetylene powder has a number average molecular weight of 4,500,000±1,000,000 and a maximum peak temperature of 340±7° C.
    Type: Application
    Filed: December 13, 2002
    Publication date: June 17, 2004
    Inventors: Katsutoshi Yamamoto, Hiroyuki Yoshimoto, Kazuo Ishiwari, Shinichi Yano
  • Patent number: 6747108
    Abstract: In the preparation of a modified polytetrafluoroethylene fine powder by polymerizing tetrafluoroethylene in an aqueous medium in the presence of a water soluble fluorine-containing dispersant, a fluoroalkyl vinyl ether is added to a reaction system at latest at a start of a reaction and a copolymerization reaction of the fluoroalkyl vinyl ether with tetrafluoroethylene is initiated, and a chain transfer agent is added to the reaction system after at least 80% of tetrafluoroethylene to be polymerized is consumed. The obtained modified polytetrafluoroethylene fine powder has good molding properties, in particular, extrusion properties, and high heat resistance.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: June 8, 2004
    Assignee: Daikin Industries, Ltd.
    Inventors: Kazutaka Hosokawa, Tatsuro Uchida, Shinichi Yano, Yoshinori Nanba
  • Patent number: 6630421
    Abstract: A reactive agent for decomposing fluorine compounds comprising alumina and an alkaline earth metal compound; a process for decomposing fluorine compounds, comprising contacting the reactive agent with a fluorine compound at a temperature of 200° C. or more; and a process for manufacturing a semiconductor device, comprising an etching or cleaning and a decomposing using the reactive agent.
    Type: Grant
    Filed: April 28, 2000
    Date of Patent: October 7, 2003
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Hitoshi Atobe, Toraichi Kaneko, Yuji Hayasaka, Shinichi Yano
  • Patent number: 6563011
    Abstract: A reactive agent for decomposing fluorine compounds comprising alumina and an alkaline earth metal compound; a process for decomposing fluorine compounds, comprising contacting the reactive agent with a fluorine compound at a temperature of 200° C. or more; and a process for manufacturing a semiconductor device, comprising an etching or cleaning and a decomposing using the reactive agent.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: May 13, 2003
    Assignee: Showa Denko Kabushiki Kaisha
    Inventors: Hitoshi Atobe, Toraichi Kaneko, Yuji Hayasaka, Shinichi Yano
  • Publication number: 20020032358
    Abstract: A reactive agent for decomposing fluorine compounds comprising alumina and an alkaline earth metal compound; a process for decomposing fluorine compounds, comprising contacting the reactive agent with a fluorine compound at a temperature of 200° C. or more; and a process for manufacturing a semiconductor device, comprising an etching or cleaning and a decomposing using the reactive agent.
    Type: Application
    Filed: September 21, 2001
    Publication date: March 14, 2002
    Applicant: SHOWA DENKO K.K.
    Inventors: Hitoshi Atobe, Toraichi Kaneko, Yuji Hayasaka, Shinichi Yano
  • Patent number: 5343610
    Abstract: A method for making an anti-skid apparatus for an automobile tire includes coating a plurality of core materials with rubber to form a plurality of cords; placing the cords in grooves of a preliminary molding plate and knitting the cords to form a net body; molding the cord into a non-vulcanized net body which inherently possesses crossing sections-where one of the plurality of cords lies on top of another of the plurality of cords; pressing the crossing sections so as to cause the core materials at the crossing sections to become linearly aligned; and vulcanizing the pressed non-vulcanized anti-skid net bodies to form a vulcanized net body. The step of pressing the crossing sections temporarily fixes the respective cords to each other at respective crossing sections. Also, affixing elements are attached to the vulcanized net body to detachably secure the vulcanized net body to an automobile tire.
    Type: Grant
    Filed: May 14, 1993
    Date of Patent: September 6, 1994
    Assignee: Okamoto Industries, Inc.
    Inventors: Osamu Haruda, Shin Imamura, Suguru Hanzawa, Nobuo Amada, Kazuo Kunii, Hidetaka Kobayashi, Shinichi Yano, Muneo Nishiyama
  • Patent number: 5247980
    Abstract: An anti-skid net body for a tire includes a plurality of cords having crossing portions and open portions, with the crossing portions having a flat shape. At least one rope is fixed to an inside portion of the net body. An actional band and a setting band are detachably connected to an outside portion of the net body, wherein the setting band is connected prior to connecting the actional band, thereby tightly fastening the anti-skid net body to a tire.
    Type: Grant
    Filed: April 5, 1990
    Date of Patent: September 28, 1993
    Assignee: Okamoto Industries, Inc.
    Inventors: Osamu Haruda, Shin Imamura, Suguru Hanzawa, Nobuo Amada, Kazuo Kunii, Hidetaka Kobayashi, Shinichi Yano, Muneo Nishiyama