Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: The present invention has for its object to provide a multilayer printed circuit board which is very satisfactory in facture toughness, dielectric constant, adhesion and processability, among other characteristics. The present invention is directed to a multilayer printed circuit board comprising a substrate board, a resin insulating layer formed on said board and a conductor circuit constructed on said resin insulating layer, wherein said resin insulating layer comprises a polyolefin resin.

Abstract: A copper catalyst obtained by reducing a precursor containing copper and aluminum and not containing substantially malachite and aluminum hydroxide permits preparation of amides with a high productivity and in a high selectivity by the hydration of nitrites.

Abstract: An electromagnetic wave shielding system for an optical sensor includes: a sensor body having an aperture through which an optical signal is made incident on the sensor body; a shielding plate disposed within the sensor body, the shielding plate having an opening having a dimension of at most about one-half of the wavelength of electromagnetic waves; an optical system for gathering the optical signal which passes through the aperture of the sensor body to the dimension of the opening in the shielding plate so that it can pass through the opening; and a detecting/processing unit for detecting and processing the optical signal which passes through the opening in the shielding plate. Thus, the electromagnetic waves which have entered are prevented from passing through or are remarkably attenuated by the opening in the shielding plate, and are thereby prevented from reaching the detecting/processing unit.