Patents by Inventor Shin-ichiro Iwanaga
Shin-ichiro Iwanaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090288855Abstract: The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.Type: ApplicationFiled: July 30, 2009Publication date: November 26, 2009Applicant: JSR CORPORATIONInventors: Kouji NISHIKAWA, Kousuke Mori, Masaru Ohta, Shin-ichiro Iwanaga
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Patent number: 7495332Abstract: A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.Type: GrantFiled: November 27, 2006Date of Patent: February 24, 2009Assignees: Ibiden Co., Ltd., JSR CorporationInventors: Takashi Kariya, Toshiki Furutani, Hirofumi Goto, Shin-ichiro Iwanaga
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Patent number: 7482111Abstract: It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition.Type: GrantFiled: March 24, 2005Date of Patent: January 27, 2009Assignee: JSR CorporationInventors: Kouji Nishikawa, Tooru Kimura, Shin-ichiro Iwanaga
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Publication number: 20080097032Abstract: Disclosed is a positive photosensitive insulating resin composition which comprises: (A) a copolymer comprising (A1) 10 to 99 mol % of a structural unit of the formula (1) and (A2) 90 to 1 mol % of a structural unit of the formula (2); (B) a quinone diazide group-containing compound; (C) at least one compound selected from the group consisting of (C1) an aromatic compound containing a methylol group and/or an alkoxy methyl group (except for aromatic compounds containing an amino group), (C2) an aromatic aldehyde compound, (C3) an aliphatic aldehyde compound, (C4) an alkyl-etherified amino group-containing compound and (C5) an epoxy group-containing compound; (D) a solvent; and (E) an adhesion assistant. Disclosed also is a cured product obtainable from the composition. wherein Ra and Rb are each an alkyl group having 1 to 4 carbon atoms, alkoxy group or aryl group, Rb and Rc are each hydrogen or a methyl group, n is an integer of 0 to 3 and m is an integer of 1 to 3.Type: ApplicationFiled: October 28, 2005Publication date: April 24, 2008Applicant: JSR CorporationInventors: Atsushi Ito, Ken-ichi Yokoyama, Katsumi Inomata, Shin-ichiro Iwanaga
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Publication number: 20080039585Abstract: A thermosetting resin composition of the present invention contains an epoxy resin (A), a crosslinked diene-based rubber (B) in which the content of bonded acrylonitrile is less than 10 wt %, and a curing agent (D) and/or a curing catalyst (E). A cured product obtained by curing the thermosetting resin composition is excellent in properties such as electric insulation properties and electrical properties.Type: ApplicationFiled: November 9, 2005Publication date: February 14, 2008Applicant: JSR CorporationInventors: Takashi Nishioka, Hirofumi Gotou, Tsunemitsu Miyata, Shin-ichiro Iwanaga
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Publication number: 20070248905Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.Type: ApplicationFiled: June 14, 2007Publication date: October 25, 2007Applicant: JSR CorporationInventors: Masaru OHTA, Atsushi ITO, Isamu Mochizuki, Katsumi INOMATA, Shin-ichiro IWANAGA
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Publication number: 20070190450Abstract: It is an object of the present invention to provide a process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a negative radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a negative radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2), (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator, and by forming a negative radiation-sensitive resin film using the composition.Type: ApplicationFiled: March 24, 2005Publication date: August 16, 2007Applicant: JSR CorporationInventors: Kouji Nishikawa, Tooru Kimura, Shin-ichiro Iwanaga
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Publication number: 20070190465Abstract: It is an object of the present invention to provide a production process capable of precisely producing a plated shaped article of a large thickness such as a bump or a wiring, a positive radiation-sensitive resin composition which is preferably used for the process and has excellent sensitivity and resolution, and a transfer film using the composition. The above object is achieved by a positive radiation-sensitive resin composition comprising (A) a polymer containing structural units represented by the following formula (1) and/or the following formula (2) and an acid-dissociable functional group (b), (B) a component which generates an acid by irradiation with radiation and (C) and organic solvent, and is achieved by producing a positive radiation-sensitive resin film using the composition.Type: ApplicationFiled: March 24, 2005Publication date: August 16, 2007Applicant: JSR CORPORATIONInventors: Kouji Nishikawa, Shin-ichiro Iwanaga
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Patent number: 7247420Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate. The method comprises the steps of: sequentially applying positive radiation-sensitive resin compositions 1 and 2 to form a two-layer laminate; subjecting the two-layer resist to single exposure and development to produce fine patterns having an undercut cross section; depositing and/or sputtering an organic or inorganic thin layer with use of the resist pattern as a mask; and lifting off the resist pattern to leave a pattern of the thin layer in desired shape.Type: GrantFiled: November 15, 2002Date of Patent: July 24, 2007Assignee: JSR CorporationInventors: Masaru Ohta, Atsushi Ito, Isamu Mochizuki, Katsumi Inomata, Shin-ichiro Iwanaga
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Patent number: 7214471Abstract: The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 ?m in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 ?m. According to the photosensitive resin film, a high bump having a height of not less than 50 ?m can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.Type: GrantFiled: March 25, 2004Date of Patent: May 8, 2007Assignee: JSR CorporationInventors: Shin-ichiro Iwanaga, Tooru Kimura, Kouji Nishikawa
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Publication number: 20070085203Abstract: A multilayer printed wiring board is equipped with a core board 20, a build-up layer 30 formed on the core board 20 so as to have a conductor pattern 32 on the upper surface thereof, a low-elasticity layer 40 formed on the build-up layer 30, lands 52 that are provided on the upper surface of the low-elasticity layer 40 and connected to an IC chip 70 via solder bumps 66, and conductor posts 50 that penetrate through the low-elasticity layer 40 and electrically connect the lands 52 to the conductor pattern 32. The low-elasticity layer 40 is formed of resin composition containing epoxy resin, phenol resin, cross-linked rubber particles and a hardening catalyst.Type: ApplicationFiled: November 27, 2006Publication date: April 19, 2007Applicants: IBIDEN CO., LTD., JSR CORPORATIONInventors: Takashi Kariya, Toshiki Furutani, Hirofumi Goto, Shin-ichiro Iwanaga
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Publication number: 20070031758Abstract: The positive-type radiation-sensitive resin composition for producing a metal-plating formed material relating to the present invention comprises (A) a polymer containing a structural unit having an acid-dissociative functional group, which is dissociated in the presence of an acid to generate an acidic functional group, and a crosslinking structure; (B) a radiation-sensitive acid generator; and (C) an organic solvent. The positive-type radiation-sensitive resin composition is excellent in sensitivity and resolution, exhibits excellent adhesion to a substrate, leaves no residue at an opening after development, and is capable of preventing occurrence of crack in the resin film after metal plating and push-in of plated metal into the resin film.Type: ApplicationFiled: August 2, 2006Publication date: February 8, 2007Applicant: JSR CorporationInventors: Kouji Nishikawa, Kousuke Mori, Masaru Ohta, Shin-ichiro Iwanaga
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Publication number: 20070027231Abstract: The present invention provides a photosensitive insulating resin composition which can be cured at low temperatures without inhibiting functions of an organic semiconductor device or the like, by the use of which a cured product excellent in various properties such as resolution, electrical insulation, thermal shock resistance and chemical resistance can be obtained and which is suitably used for a surface protective film or a layer insulating film of a semiconductor device. The photosensitive insulating resin composition of the present invention comprises a copolymer (A), which is obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group and a vinyl monomer having an oxetanyl group, and a photosensitive acid generator (B). The copolymer (A) is preferably obtained by copolymerizing monomer components containing a vinyl monomer having an epoxy group, a vinyl monomer having an oxetanyl group and another vinyl monomer.Type: ApplicationFiled: August 31, 2004Publication date: February 1, 2007Applicant: JSR CorporationInventors: Hirohumi Goto, Katsumi Inomata, Shin-ichiro Iwanaga
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Patent number: 7141355Abstract: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein: the alkali-soluble resin having an unsaturated group (A) is obtained by reacting: 100 parts by weight of a copolymer comprising 1 to 40 wt % structural units derived from (a) a radically polymerizable compound having a carboxyl group; 1 to 50 wt % structural units having a phenolic hydroxyl group which are derived from (b-1) a radically polymerizable compound having a phenolic hydroxyl group or (b-2) a radically polymerizable compound having a functional group convertible into a phenolic hydroxyl group after the copolymerization, other structural units of said copolymer being derived from (c) another radically polymerizable compound; with 0.1 to 20 parts by weight of (d) a radically polymerizable compound having an epoxy group.Type: GrantFiled: December 13, 2002Date of Patent: November 28, 2006Assignee: JSR CorporationInventors: Shin-ichiro Iwanaga, Satoshi Iwamoto, Tooru Kimura, Hiroko Nishimura, Koji Nishikawa
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Publication number: 20060210912Abstract: The photosensitive resin film in an uncured state of the invention comprises (A) a specific alkali-soluble copolymer, (B) a compound having at least one ethylenically unsaturated double bond and (C) a radiation-sensitive radical polymerization initiator by the use of which a coating film having a dry film thickness of 70 ?m in an uncured state has a 365 nm radiation transmittance of not less than 10% and a 405 nm radiation transmittance of not less than 60%, contains the radiation-sensitive radical polymerization initiator (C) in an amount of 20 to 40 parts by weight based on 100 parts by weight of the component (A), and has a dry film thickness of not less than 50 ?m. According to the photosensitive resin film, a high bump having a height of not less than 50 ?m can be readily formed on a chip substrate with high precision though formation of such a high bump is difficult by the conventional technique. Moreover, connection failure of an element can be inhibited, and reliability of an element can be enhanced.Type: ApplicationFiled: March 25, 2004Publication date: September 21, 2006Applicant: JSR CorporationInventors: Shin-ichiro Iwanaga, Tooru Kimura, Kouji Nishikawa
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Publication number: 20040142280Abstract: A radiation-sensitive resin composition comprising (A) an alkali-soluble resin having an unsaturated group, (B) a compound having at least one ethylenically unsaturated double bond, and (C) a radiation-induced radical polymerization initiator, wherein:Type: ApplicationFiled: November 18, 2003Publication date: July 22, 2004Inventors: Shin-ichiro Iwanaga, Satoshi Iwamoto, Tooru Kimura, Hiroko Nishimura, Koji Nishikawa
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Publication number: 20040131963Abstract: The invention concerns a lift-off process for patterning layers that are deposited and/or sputtered. The invention provides a two-layer resist and a patterning method using the resist. The patterning method can readily produce burr-free layers on a substrate.Type: ApplicationFiled: October 27, 2003Publication date: July 8, 2004Inventors: Masaru Ohta, Atsushi Ito, Isamu Mochizuki, Katsumi Inomata, Shin-ichiro Iwanaga
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Publication number: 20040110084Abstract: Disclosed is a photosensitive insulating resin composition comprising (A) an alkali-soluble resin having a phenolic hydroxyl group, (B) a compound containing at least two alkyl-etherificated amino groups in the molecule, (C) crosslinked fine particles, (D) a photosensitive acid generator and (E) an organic solvent. Also disclosed is a cured product obtained by curing the photosensitive insulating resin composition. From the photosensitive insulating resin composition, a cured product excellent not only in resolution, electrical insulation properties and thermal shock resistance but also in heat resistance and chemical resistance can be obtained.Type: ApplicationFiled: December 9, 2002Publication date: June 10, 2004Applicant: JSR CORPORATIONInventors: Katsumi Inomata, Atsushi Ito, Masako Suzuki, Shin-ichiro Iwanaga
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Patent number: 6727032Abstract: A radiation-sensitive resin composition including (A) a resin containing an alicyclic skeleton in its backbone, and (B) a radiation-sensitive acid-generating agent, is provided. This composition is excellent in transparency with respect to radiation and dry etching resistance, and can give a photoresist pattern excellent in adhesion to substrates, sensitivity, resolution, and developability.Type: GrantFiled: February 7, 1997Date of Patent: April 27, 2004Assignee: JSR CorporationInventors: Mitsuhito Suwa, Toru Kajita, Shin-ichiro Iwanaga, Toshiyuki Ota
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Publication number: 20040038148Abstract: The present invention provides a positive type radiation-sensitive resin composition for producing a product formed by plating, which is capable of forming a product formed by plating of a thick film such as a bump or a wiring with high precision and has excellent sensitivity and resolution, and a process for producing a product formed by plating using the composition. The positive type radiation-sensitive resin composition for producing a product formed by plating comprises (A) a polymer having an acid-dissociative functional group which is dissociated by an acid to generate an acid functional group and (B) a component which generates an acid when irradiated with a radiation. This composition is used also for a positive type radiation-sensitive resin film. The product formed by plating is produced by a process including a step wherein electroplating is carried out with the use of a pattern that is formed from the composition or the resin film on the substrate as a mold.Type: ApplicationFiled: August 21, 2002Publication date: February 26, 2004Applicant: JSR CORPORATIONInventors: Masaru Ohta, Atsushi Ito, Shin-Ichiro Iwanaga
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Patent number: 5125837Abstract: An apparatus for scaling of teeth and lavage of the gingival sulcus is provided. The apparatus comprises a base unit which contains reservoirs for the medicaments used in the lavage procedure, and a handpiece connected to the base unit by a conduit, which contains an insert for scaling of teeth. Switches on the base unit and a footswitch make it possible for the practitioner to use the apparatus for scaling only, lavage only, or for simultaneous lavage and scaling.Type: GrantFiled: August 7, 1990Date of Patent: June 30, 1992Assignee: Dentsply Management Corp.Inventors: George E. Warrin, Rene J. Perdreaux