Abstract: The solenoid coil includes a coil having a first end surface and a second end surface on its both ends in an axial direction, a member which is in contact with the first end surface, and has a groove through which the wire material of the coil passes, and an insulating resin formed to coat at least an outer circumferential surface and the second end surface of the coil. The resin with a substantially U-shaped section is continuously coated on at least a part of an inner circumferential surface of the coil via an area from the outer circumferential surface to the second end surface.

Abstract: Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.

Abstract: A semiconductor device includes a semiconductor chip including a first circuit and a wiring substrate over which the semiconductor chip is mounted. The wiring substrate includes input signal wires transmitting an input signal to the semiconductor chip, output signal wires transmitting an output signal from the semiconductor chip, and first conductor planes supplied with a reference potential. When a wire cross-sectional area is defined as the cross-sectional area of each wire in a direction orthogonal to a direction in which the wire extends, the wire cross-sectional area of each input signal wire is smaller than the wire cross-sectional area of each output signal wire. In the thickness direction of the wiring substrate, each input signal wire is interposed between second conductor planes and third conductor planes each supplied with the reference potential. Between the output signal wires and the input signal wires, the third conductor planes are disposed.

Abstract: Performance of a semiconductor device is improved. The semiconductor device includes a semiconductor chip and a chip component that are electrically connected to each other via a wiring substrate. The semiconductor chip includes an input/output circuit and an electrode pad electrically connected to the input/output circuit and transmitting the signal. The chip component includes a plurality of types of passive elements and includes an equalizer circuit for correcting signal waveforms of the signal, and electrodes electrically connected to the equalizer circuit. The path length from the signal electrode of the semiconductor chip to the electrode of the chip component is 1/16 or more and 3.5/16 or less with respect to the wavelength of the signal.

Abstract: A semiconductor device includes a semiconductor chip including a first circuit and a wiring substrate over which the semiconductor chip is mounted. The wiring substrate includes input signal wires transmitting an input signal to the semiconductor chip, output signal wires transmitting an output signal from the semiconductor chip, and first conductor planes supplied with a reference potential. When a wire cross-sectional area is defined as the cross-sectional area of each wire in a direction orthogonal to a direction in which the wire extends, the wire cross-sectional area of each input signal wire is smaller than the wire cross-sectional area of each output signal wire. In the thickness direction of the wiring substrate, each input signal wire is interposed between second conductor planes and third conductor planes each supplied with the reference potential. Between the output signal wires and the input signal wires, the third conductor planes are disposed.

Abstract: A method for manufacturing a high frequency cable that includes covering a central conductor made from aluminum or an aluminum alloy with a covering layer made from copper; and wire drawing of the central conductor covered by the covering layer using dies at multiple steps, each of the dies having a cross-section reduction rate of 20% to 29% with an entire reduction angle of 16 degrees, to form a fiber-like structure in a longitudinal direction in the covering layer, and to form an intermetallic compound layer having greater volume resistivity than the covering layer between the central conductor and the covering layer.

Abstract: A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.

Abstract: A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.

Abstract: A high frequency cable includes: a central conductor made from aluminum or an aluminum alloy; a covering layer made from copper covering the central conductor, and having a fiber-like structure in a longitudinal direction; and an intermetallic compound layer formed between the central conductor and the covering layer and having greater volume resistivity than the covering layer, wherein a cross-sectional area of the covering layer is 15% or less of an entire cross-sectional area including the central conductor, the intermetallic compound layer and the covering layer.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alkyl ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: A metal coil or an elastic cushion formed by winding the metal coil around a corrosion-resistant frame is sandwiched between an electrode and an electrode collector or a cell wall or is used as an electrode. The elasticity of the metal coil or the elastic cushion enables the easy handling and the uniform contact between the electrode and another electrolysis element. The metal coil or the elastic cushion can be also used as an elastic cathode. The elasticity of the elastic cathode also enables the easy handling of the electrode itself and the uniform contact between the ion exchange membrane and the current collector.

Abstract: The invention provides an ion exchange membrane electrolyzer ensuring a satisfactory circulation of electrolyte, high electrolytic efficiency and great ridigity. An anode chamber partition in a flat sheet form is joined to a cathode chamber partition in a flat sheet form. An electrode retainer member in a sheet form is joined to at least one partition at a belt-like junction. A projecting strip with an electrode joined thereto is located between adjacent junctions. A space on an electrode surface side of the electrode retainer member defines a path through which a fluid goes up in the electrode chamber, and a space that spaces away from the space defines a path through which an electrolyte separated from a gas at a top portion of the electrode goes down.

Abstract: The invention provides an ion exchange membrane electrolyzer. An electric current is passed through at least one electrode while the electrode is in contact with a plurality of comb-like flat leaf spring tags extending at an angle from a flat leaf spring form of retainer member located on an electrode partition provided in an electrode chamber. Each pair of comb-like flat leaf spring tags are arranged in such a way that adjacent flat leaf spring tags extend in mutually opposite directions.

Abstract: In a gas diffusion electrode assembly, and in an electrolyzer using the same, a bonding piece having on at least one surface a perfluorosulfonic acid layer, a perfluorosulfonyl fluoride layer or an alky ester of perfluorocarboxylic acid layer is positioned at its perfluoro compound layer surface with respect to the gas diffusion electrode assembly. Adjacent gas diffusion electrodes are heat fusion bonded together, or heat fusion bonding is carried out using the bonding piece in a frame form. Adjacent gas diffusion electrodes are sealed up by heat fusion bonding, using a material that is similar to the material that forms the gas diffusion electrodes.

Abstract: In order to discharge current from a gas diffusion electrode in an electrolytic unit cell including a gas chamber, the gas diffusion electrode is electrically connected to the wall surface of the gas chamber having conductivity through an electric connecting element in partial contact with the gas diffusion electrode

Abstract: A lubrication and breather system for an engine that is generally adapted for use as either a vertically-oriented crankshaft-type engine or a horizontally-oriented crankshaft-type engine. The crankcase has first and second bearing bosses supporting first and second journal portions of the crankshaft. The second bearing boss lies above the first bearing boss when the engine is of the vertical-type. The system includes a cap that is secured over the second bearing boss and cooperates with the second bearing boss to define an annular chamber for receiving splashed oil produced in the crankcase. The cap has a plurality of ribs formed thereon that reduce an amount of oil, which is entrained in the blow-by gas, sent from the annular chamber to the breather chamber. The second bearing block includes an oil feed hole, a plurality of oil sumps, and a plurality of oil return holes, with the oil return holes being of relatively smaller size. Each of the oil sumps is associated with one oil return hole.

Abstract: A metal coil or an elastic cushion formed by winding the metal coil around a corrosion-resistant frame is sandwiched between an electrode and an electrode collector or a cell wall or is used as an electrode. The elasticity of the metal coil or the elastic cushion enables the easy handling and the uniform contact between the electrode and another electrolysis element. The metal coil or the elastic cushion can be also used as an elastic cathode. The elasticity of the elastic cathode also enables the easy handling of the electrode itself and the uniform contact between the ion exchange membrane and the current collector.

Abstract: An OHC engine includes a valve operation system housed in a valve operation chamber formed between a cylinder head and a head cover joined to the cylinder head. The valve operation system includes a valve-operating cam and is cooperatively connected to an intake valve and an exhaust valve. The OHC engine also includes timing transmitting device disposed between the valve operation system and a crankshaft, the timing transmitting means including a driven wheel that rotates together with the valve-operating cam and a transmission belt that is wrapped around the driven wheel so that oil within a crankcase can accompany the transmission belt and be supplied to the valve operation chamber. The head cover is provided with an arc-form curved cover part for covering the upper part of the driven wheel.