Patents by Inventor Shinji Koike

Shinji Koike has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9126298
    Abstract: A machining center includes a rotatable tool magazine (22) arranged above a work space (WS) facing a spindle (15) tilted so that the spindle side becomes lower and having a plurality of grippers (24) for holding tools (16) in a circumferential direction, and a shutter (26) arranged below the tool magazine (22) to be able to open and close facing the spindle side. The tool magazine (22) has a tool-free area (AR2) where there are no grippers (24) at a part of the circumferential direction and a tool-holding area (ARA) where there are grippers (24) at another part of the circumferential direction. The tool magazine (22) is controlled in rotation so that when the shutter (26) is closed, the tool-free area (AR2) moves to the spindle side while when the shutter (26) is open, the tool-holding area (AR1) moves to the spindle side.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: September 8, 2015
    Assignee: Markino Milling Machine Co., Ltd.
    Inventors: Shinji Koike, Kazumasa Nakayasu, Yoshitaka Yamaguchi
  • Publication number: 20140199917
    Abstract: An eyeglass lens processing apparatus includes: a lens rotation unit configured to rotate a lens chuck shaft; a processing tool rotational shaft to which a processing tool is attached; a shaft-to-shaft distance change unit that includes a carriage which holds the lens chuck shaft or the processing tool rotational shaft and is movable in a direction where a shaft-to-shaft distance between the lens chuck shaft and the processing tool rotational shaft changes by driving a motor, a movement member that is moved in the shaft-to-shaft distance direction, a connection member that connects the movement member and the carriage, and a deformation detecting sensor configured to detect a deformation of the connection member; and a controller configured to control the driving of the motor based on a detection result of the deformation detecting sensor.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 17, 2014
    Applicant: Nidek Co., Ltd.
    Inventors: Ryoji SHIBATA, Toshiaki ASAOKA, Yoshiaki KAMIYA, Shinji KOIKE
  • Patent number: 8769791
    Abstract: A machine tool for machining a workpiece with a tool moved relative to the workpiece is provided with a bed (13) providing a base, a column (15) vertically mounted on the bed (13), and a carriage (27) having supporting columns (27a and 27b), disposed on either side thereof, for oscillatably supporting a table (35), the carriage being oriented so that one (27b) of the supporting columns (27a and 27b) is positioned adjacent the column (15) and the other (27a) of the supporting columns is positioned away from the column (15).
    Type: Grant
    Filed: May 27, 2008
    Date of Patent: July 8, 2014
    Assignee: Makino Milling Machine Co., Ltd.
    Inventors: Takeshi Kawada, Shinji Koike, Rintaro Nagatomo
  • Patent number: 8671532
    Abstract: An eyeglass lens processing apparatus includes: a mode selector for selecting an auxiliary lens processing mode; an eyeglass data input unit for inputting a first target lens shape of the eyeglass lens and a right target lens shape-to-left target lens shape distance; a first hole data input unit for inputting a position of a first hole, to which a first magnet is attached; a determination unit which determines second target lens shape of the auxiliary lens, a position of a second hole to which a second magnet is attached, positions of third holes to which a bridge is attached; and a processing controller which processes the auxiliary lenses based on the second target lens shape data, and drills the auxiliary lenses based on the second and third hole positions in the auxiliary lens processing mode.
    Type: Grant
    Filed: March 25, 2010
    Date of Patent: March 18, 2014
    Assignee: Nidek Co., Ltd.
    Inventors: Ryoji Shibata, Shinji Koike
  • Publication number: 20130331245
    Abstract: A machining center includes a rotatable tool magazine (22) arranged above a work space (WS) facing a spindle (15) tilted so that the spindle side becomes lower and having a plurality of grippers (24) for holding tools (16) in a circumferential direction, and a shutter (26) arranged below the tool magazine (22) to be able to open and close facing the spindle side. The tool magazine (22) has a tool-free area (AR2) where there are no grippers (24) at a part of the circumferential direction and a tool-holding area (ARA) where there are grippers (24) at another part of the circumferential direction. The tool magazine (22) is controlled in rotation so that when the shutter (26) is closed, the tool-free area (AR2) moves to the spindle side while when the shutter (26) is open, the tool-holding area (AR1) moves to the spindle side.
    Type: Application
    Filed: February 24, 2011
    Publication date: December 12, 2013
    Inventors: Shinji Koike, Kazumasa Nakayasu, Yoshitaka Yamaguchi
  • Publication number: 20130322979
    Abstract: According to the machine tool according to the present invention, a top-bottom guide is attached to a back surface of a base frame. By being guided by this top-bottom guide, the lifter moves in the top-bottom direction with respect to the base frame. A drive source which drives rotation of a top-bottom feed screw which extends parallel to the top-bottom guide is attached to a back surface of the base frame. This drive source is coupled with a bottom end of the top-bottom feed screw. As a result, compared to when the drive source is coupled with a top end of the top-bottom feed screw, the center of gravity of the machine tool can be set to a lower position. In this way, a machine tool can be increased in stability.
    Type: Application
    Filed: February 17, 2011
    Publication date: December 5, 2013
    Applicant: MAKINO MILLING MACHINE CO., LTD.
    Inventors: Shinji Koike, Kazumasa Nakayasu, Kazuya Mayumi
  • Patent number: 8356455
    Abstract: A system for reducing power consumption of a packaging machine, including a processing device performing a predetermined process on supplied processing objects and discharging them, and a packaging machine packaging the objects discharged from the processing device. The packaging machine includes a centralized control unit controlling the operation of the packaging machine. The control unit operates the packaging machine in a power-saving mode when an insufficient supply of the processing objects is in or is likely to be in the processing device.
    Type: Grant
    Filed: October 31, 2008
    Date of Patent: January 22, 2013
    Assignee: Ishida Co., Ltd.
    Inventors: Ryoichi Sato, Shinji Koike
  • Patent number: 8132394
    Abstract: A bag manufacturing and packaging apparatus manufactures a bag by sealing a packaging material formed in a tubular shape and at the same time fills the bag with articles to be packaged. The bag manufacturing and packaging apparatus includes a conveyance mechanism, a squeezing mechanism and a conveyance adjusting unit. The conveyance mechanism is configured and arranged to convey the packaging material in a conveying direction. The squeezing mechanism includes a squeezing unit configured and arranged to sandwich the packaging material and to perform a squeezing motion so as to move the articles to be packaged to the downstream side in the conveying direction. The conveyance adjusting unit configured and arranged to move the packaging material towards the upstream side in the conveying direction during the squeezing motion of the squeezing unit.
    Type: Grant
    Filed: October 29, 2007
    Date of Patent: March 13, 2012
    Assignee: Ishida Co., Ltd.
    Inventor: Shinji Koike
  • Patent number: 7936065
    Abstract: A semiconductor device is provided with a silicon substrate, with a surface for soldering the silicon substrate to a ceramic substrate, and an electrode making contact with the surface of the silicon substrate. The electrode comprises a first conductor layer, a second conductor layer, and a third conductor layer. The first conductor layer makes contact with the surface of the silicon substrate and includes aluminum and silicon. The second conductor layer makes contact with the first conductor layer and includes titanium. The third conductor layer is separated from the first conductor layer by the second conductor layer and includes nickel.
    Type: Grant
    Filed: June 11, 2007
    Date of Patent: May 3, 2011
    Assignees: Toyota Jidosha Kabushiki Kaisha, ULVAC, Inc.
    Inventors: Yoshihito Mizuno, Masahiro Kinokuni, Shinji Koike, Masahiro Matsumoto, Fumitsugu Yanagihori
  • Publication number: 20110070044
    Abstract: A machine tool for machining a workpiece with a tool moved relative to the workpiece is provided with a bed (13) providing a base, a column (15) vertically mounted on the bed (13), and a carriage (27) having supporting columns (27a and 27b), disposed on either side thereof, for oscillatably supporting a table (35), the carriage being oriented so that one (27b) of the supporting columns (27a and 27b) is positioned adjacent the column (15) and the other (27a) of the supporting columns is positioned away from the column (15).
    Type: Application
    Filed: May 27, 2008
    Publication date: March 24, 2011
    Applicant: MAKINO MILLING MACHINE CO., LTD.
    Inventors: Takeshi Kawada, Shinji Koike, Rintaro Nagatomo
  • Publication number: 20100323868
    Abstract: A bag-making and packaging apparatus includes a bag-making and packaging mechanism and a fold formation mechanism. The fold formation mechanism is configured and arranged to deform a packaging material from a planar state to a folded state having a cross-sectional shape including a fold portion formed by three creases, and to feed the packaging material to the bag-making and packaging mechanism. The fold formation mechanism may include a conveying path regulating part that defines a part of a conveying path of the packaging material with the conveying path regulating part temporarily bending the packaging material for a plurality of times. The bag-making and packaging apparatus may further includes a slanting member for slanting the fold portion to be generally parallel to a region of the packaging material other than the folding section, and a conveying angle changing member disposed downstream of the slanting member.
    Type: Application
    Filed: June 18, 2009
    Publication date: December 23, 2010
    Applicant: ISHIDA CO., LTD.
    Inventors: Hideshi Miyamoto, Shinji Koike
  • Publication number: 20100242416
    Abstract: An object of the present invention is to provide a technology capable of reducing the power consumption of a packaging machine without declining the availability factor of the whole of the system in a packaging system. In order to achieve the object, the packaging system includes a processing device performing a predetermined process on supplied processing objects and discharging them, and a packaging machine packaging the processing objects discharged from the processing device. The packaging machine includes a control unit centralized controlling the operation of the whole of the packaging machine. The control unit operates the packaging machine in the power-saving mode when the insufficient supply of the processing objects has occurred in the processing device, or when the insufficient supply of the processing objects is likely to occur in the processing device.
    Type: Application
    Filed: October 31, 2008
    Publication date: September 30, 2010
    Applicant: ISHIDA, CO., LTD
    Inventors: Ryoichi Sato, Shinji Koike
  • Publication number: 20100247253
    Abstract: An eyeglass lens processing apparatus includes: a mode selector for selecting an auxiliary lens processing mode; an eyeglass data input unit for inputting a first target lens shape of the eyeglass lens and a right target lens shape-to-left target lens shape distance; a first hole data input unit for inputting a position of a first hole, to which a first magnet is attached; a determination unit which determines second target lens shape of the auxiliary lens, a position of a second hole to which a second magnet is attached, positions of third holes to which a bridge is attached; and a processing controller which processes the auxiliary lenses based on the second target lens shape data, and drills the auxiliary lenses based on the second and third hole positions in the auxiliary lens processing mode.
    Type: Application
    Filed: March 25, 2010
    Publication date: September 30, 2010
    Applicant: NIDEK CO., LTD.
    Inventors: Ryoji SHIBATA, Shinji KOIKE
  • Publication number: 20100101188
    Abstract: A bag manufacturing and packaging apparatus manufactures a bag by sealing a packaging material formed in a tubular shape and at the same time fills the bag with articles to be packaged. The bag manufacturing and packaging apparatus includes a conveyance mechanism, a squeezing mechanism and a conveyance adjusting unit. The conveyance mechanism is configured and arranged to convey the packaging material in a conveying direction. The squeezing mechanism includes a squeezing unit configured and arranged to sandwich the packaging material and to perform a squeezing motion so as to move the articles to be packaged to the downstream side in the conveying direction. The conveyance adjusting unit configured and arranged to move the packaging material towards the upstream side in the conveying direction during the squeezing motion of the squeezing unit.
    Type: Application
    Filed: October 29, 2007
    Publication date: April 29, 2010
    Applicant: ISHIDA CO., LTD.
    Inventor: Shinji Koike
  • Publication number: 20070296080
    Abstract: A semiconductor device is provided with a silicon substrate, with a surface for soldering the silicon substrate to a ceramic substrate, and an electrode making contact with the surface of the silicon substrate. The electrode comprises a first conductor layer, a second conductor layer, and a third conductor layer. The first conductor layer makes contact with the surface of the silicon substrate and includes aluminum and silicon. The second conductor layer makes contact with the first conductor layer and includes titanium. The third conductor layer is separated from the first conductor layer by the second conductor layer and includes nickel.
    Type: Application
    Filed: June 11, 2007
    Publication date: December 27, 2007
    Inventors: Yoshihito Mizuno, Masahiro Kinokuni, Shinji Koike, Masahiro Matsumoto, Fumitsugu Yanagihori
  • Patent number: 6785942
    Abstract: The present invention relates to a machine tool (11) for machining a large-sized workpiece (89) such as aircraft parts mounted on a workpiece mounting table (99), by moving a spindle having a tool mounted thereon in directions along the X-axis, the Y-axis and the Z-axis. The machine tool (11) can provide a highly efficient, high-speed and highly precise machining for a large-sized workpiece (89) and solve a problem of a compact installation area. In order to solve this problem, according to the present invention, a workpiece support structure (15) is disposed in opposed relation to a spindle support structure (13) which a spindle head (73) movable in the directions along the X-axis, the Y-axis and the Z-axis. The workpiece mounting table (99) of the workpiece support structure (15) is provided with pallet securing means on two opposed pallet mounting surfaces thereof and is supported to allow for rotational indexing about a horizontal axis extending in the direction along the X-axis.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: September 7, 2004
    Assignee: Makino Milling Machine Co., Ltd.
    Inventor: Shinji Koike
  • Patent number: 6786686
    Abstract: A numerically controlled machine tool is disclosed including a spindle support structure for moving the spindle having a tool mounted thereon in directions along an X-axis, a Y-axis and a Z-axis, a workpiece support structure having an indexing workpiece mounting table, and a chip discharge means located between the spindle support structure and the workpiece support structure for discharging chips produced in the machining area to the outside. Since the workpiece mounting table is allowed for rotational indexing, the setup process for the workpiece can be performed with the workpiece mounting surface of the workpiece mounting table facing upward, and therefore the setup process can be shortened while at the same time improving the machine operating rate. Also, since the spindle support structure, the workpiece support structure and the chip discharge means can be configured separately from each other, the machine tool can be manufactured and installed easily.
    Type: Grant
    Filed: July 17, 2001
    Date of Patent: September 7, 2004
    Assignee: Makino Milling Machine Co., Ltd.
    Inventor: Shinji Koike
  • Patent number: 6719609
    Abstract: An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes: a lens rotating shaft which holds and rotates an eyeglass lens to be processed; an abrasive wheel rotating shaft movable between a retracted position and a processing position; a chamfering abrasive wheel which is attached to the abrasive wheel rotating shaft and which chamfers the lens while receiving a processing load from the lens during processing; a detecting unit which detects the load to the chamfering abrasive wheel; and a control unit which issues a control signal for relatively moving the lens and the chamfering abrasive wheel one from another to reduce the processing load if the detected processing load is higher than a predetermined first level and for continuing the chamfering, and which issues a control signal for ending the chamfering if the detected processing load over the entire periphery of the lens is lower than a predetermined second level.
    Type: Grant
    Filed: April 27, 2001
    Date of Patent: April 13, 2004
    Assignee: Nidek Co., Ltd.
    Inventors: Toshiaki Mizuno, Shinji Koike
  • Patent number: 6599066
    Abstract: The invention relates to a rotating shaft apparatus for rotationally driving a spindle or a feed screw shaft and a machine tool including the rotating shaft apparatus, and is directed to enhance durability of a rotating shaft apparatus if the rotating shaft such as a spindle or a feed shaft rotates at a high speed. In order to solve the problem, according to the invention, a rotating shaft is rotationally supported by a bearing to a housing, the bearing being previously applied to or filled with a lubricant. A lubricant impregnated member, which is impregnated with a lubricant to be supplied to the bearing, is provided in the rotating shaft. The lubricant is separated and discharged from the lubricant impregnated member by centrifugal force due to the rotation of the shaft.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: July 29, 2003
    Assignee: Makino Milling Machine Co., Ltd.
    Inventors: Shinji Koike, Shinichi Inoue
  • Patent number: 6592431
    Abstract: An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, includes: a lens rotating unit having rotating shafts for holding and rotating the lens; an abrasive wheel; an abrasive wheel state detecting unit for detecting a lowered processing performance of the abrasive wheel; and a notifying unit for notifying that dressing for the abrasive wheel is required based on a result of detection by the abrasive wheel state detecting unit.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: July 15, 2003
    Assignee: Nidex Co., Ltd.
    Inventors: Toshiaki Mizuno, Shinji Koike