Patents by Inventor Shinji Matsuda

Shinji Matsuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200373328
    Abstract: A semiconductor device includes a semiconductor layer containing metal atoms, a charge storage layer provided on a surface of the semiconductor layer via a first insulating film, and an electrode layer provided on a surface of the charge storage layer via a second insulating film. The thickness of the first insulating film is 5 nm or more and 10 nm or less. The concentration of the metal atoms in the semiconductor layer is 5.0×1017 [EA/cm3] or higher and 1.3×1020 [EA/cm3] or lower.
    Type: Application
    Filed: August 14, 2020
    Publication date: November 26, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Yuta SAITO, Shinji MORI, Keiichi SAWA, Kazuhisa MATSUDA, Kazuhiro MATSUO, Hiroyuki YAMASHITA
  • Patent number: 10785854
    Abstract: Disclosed is a lighting system that can control lighting using a PLC communications while reducing an increase in cost for equipment. The lighting system includes a controller configured to communicate through a PLC communications, and a lighting apparatus group having a plurality of lighting apparatuses. The plurality of lighting apparatuses includes a master configured to communicate through the PLC communications, and a slave capable of communicating with the master. The master communicates with the slave through a communications that is different from the PLC communications.
    Type: Grant
    Filed: March 18, 2019
    Date of Patent: September 22, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Yasuhito Hirauchi, Shinji Matsuda
  • Publication number: 20200295035
    Abstract: In one embodiment, a semiconductor device includes a substrate, insulating films and first films alternately stacked on the substrate, at least one of the first films including an electrode layer and a charge storage layer provided on a face of the electrode layer via a first insulator, and a semiconductor layer provided on a face of the charge storage layer via a second insulator. The device further includes at least one of a first portion including nitrogen and provided between the first insulator and the charge storage layer with an air gap provided in the first insulator, a second portion including nitrogen, provided between the charge storage layer and the second insulator, and including a portion protruding toward the charge storage layer, and a third portion including nitrogen and provided between the second insulator and the semiconductor layer with an air gap provided in the first insulator.
    Type: Application
    Filed: September 3, 2019
    Publication date: September 17, 2020
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Keiichi SAWA, Kazuhiro MATSUO, Kazuhisa MATSUDA, Hiroyuki YAMASHITA, Yuta SAITO, Shinji MORI, Masayuki TANAKA, Kenichiro TORATANI, Atsushi TAKAHASHI, Shouji HONDA
  • Patent number: 10777573
    Abstract: A semiconductor device includes a semiconductor layer containing metal atoms, a charge storage layer provided on a surface of the semiconductor layer via a first insulating film, and an electrode layer provided on a surface of the charge storage layer via a second insulating film. The thickness of the first insulating film is 5 nm or more and 10 nm or less. The concentration of the metal atoms in the semiconductor layer is 5.0×1017 [EA/cm3] or higher and 1.3×1020 [EA/cm3] or lower.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: September 15, 2020
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Yuta Saito, Shinji Mori, Keiichi Sawa, Kazuhisa Matsuda, Kazuhiro Matsuo, Hiroyuki Yamashita
  • Patent number: 10741807
    Abstract: A heater module is configured to be arranged on a side surface of a battery module and includes: a heat equalizing plate; a heater, a heater cover; and a metal stay in this order from the side surface of the battery module. The heater is fixed on the heat equalizing plate, the heater cover includes a heat equalizing plate holding portion and a stay holding portion, the metal stay includes: fastening portions provided on both end portions thereof in a stacking direction of cells and configured to be fastened to the side surface of the battery module; and a bent portion configured to cover a lower surface of the heater cover, and the bent portion of the metal stay is arranged at a location overlapping with the heat equalizing plate holding portion of the heater cover in the stacking direction.
    Type: Grant
    Filed: October 25, 2017
    Date of Patent: August 11, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Shinji Wada, Masanori Matsuda, Yoshikazu Kenmoku
  • Patent number: 10647075
    Abstract: A friction transmission belt has a rubber layer forming a pulley contacting portion. The rubber layer is made of a rubber composition containing a crosslinked rubber component and crosslinked polyolefin particles. Examples of the crosslinked polyolefin particles can contain ultrahigh molecular weight polyolefin particles having an average molecular weight of 500,000 or more.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: May 12, 2020
    Assignee: Bando Chemical Industries, Ltd.
    Inventors: Takayuki Okubo, Hisashi Matsuda, Hideaki Kawahara, Shinji Takahashi
  • Publication number: 20200091165
    Abstract: A semiconductor memory device includes a channel layer and a gate electrode. A first insulating layer is between the semiconductor layer and the gate electrode. A second insulating layer is between the first insulating layer and the gate electrode. A storage region is between the first insulating layer and the second insulating layer. The storage region comprises metal or semiconductor material. A coating layer comprises silicon and nitrogen and surrounds the storage region. The coating layer is between the storage region and the second insulating layer and between the storage region and the first insulating layer.
    Type: Application
    Filed: February 27, 2019
    Publication date: March 19, 2020
    Inventors: Hiroyuki YAMASHITA, Shinji MORI, Keiichi SAWA, Kazuhiro MATSUO, Kazuhisa MATSUDA, Yuta SAITO, Atsushi TAKAHASHI, Masayuki TANAKA
  • Publication number: 20200091172
    Abstract: A semiconductor device comprises a substrate. A plurality of electrode layers and a plurality of insulating layers are formed in an alternating stack above the substrate. A semiconductor column extends through the plurality of electrode layers and the plurality of insulating layers. The semiconductor column comprises a single-crystal semiconductor material on an outer peripheral surface facing the electrode and insulating layers. First insulating films are formed between the semiconductor column and the electrode layers. The first insulating films are spaced from each other along the column length. Each first insulating film corresponds to one electrode layer. A charge storage layer is between each of the first insulating films and the electrode layers. A second insulating film is between the charge storage layer and each of the electrode layers.
    Type: Application
    Filed: February 14, 2019
    Publication date: March 19, 2020
    Inventors: Shinji MORI, Kazuhiro MATSUO, Yuta SAITO, Keiichi SAWA, Kazuhisa MATSUDA, Atsushi TAKAHASHI, Masayuki TANAKA, Kenichiro TORATANI
  • Patent number: 10583746
    Abstract: A vehicle power source system includes a plurality of module groups each including a plurality of battery modules and disposed separately from each other, and a cooling circuit including a plurality of module group cooling units which are configured to respectively cool the plurality of module groups. The plurality of module group cooling units are connected in series. Each of the plurality of module group cooling units includes a plurality of module cooling units, each of which is configured to cool one or more of the battery modules. In each of the plurality of module group cooling units, the plurality of module cooling units are connected in parallel.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: March 10, 2020
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Toru Ogaki, Masanori Matsuda, Shinji Wada, Ryu Tate, Yasutomo Kashiwakura
  • Patent number: 10558069
    Abstract: A display device includes a panel member, a flexible substrate, and a tap. The flexible substrate includes a substrate body and a substrate extending portion. The substrate body is disposed in an area of a surface of the panel member inner than an outer peripheral edge portion of the surface. The substrate extension portion is extended from an outer peripheral edge portion of the substrate body. The substrate extension portion includes an overlapping portion overlapping a section of the outer peripheral edge portion of the surface. The tape is pasted to the area inner than the outer peripheral edge portion of the surface. The tape covers the substrate extension portion that is folded back to the substrate body from an opposite side from the substrate body such that the overlapping portion does not overlap the outer peripheral edge portion of the surface to hold the substrate extension portion.
    Type: Grant
    Filed: June 5, 2019
    Date of Patent: February 11, 2020
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Shinji Tomokawa, Takafumi Matsuda, Akiyoshi Takaoka
  • Publication number: 20200017490
    Abstract: The purpose of the present invention is to provide a mesoionic compound, which exhibits an improved controlling effect on various harmful organisms, or a salt thereof. A mesoionic compound represented by formula (1) (wherein: R1 is selected from a hydrogen atom, etc.; R2 represents an optionally substituted phenyl group; R3 is selected from a hydrogen atom, etc.; R4 is selected from a hydrogen atom, etc.; R5 is selected from an optionally substituted ethylene group, etc.; and X is selected from an oxygen atom, etc.) or a salt thereof.
    Type: Application
    Filed: September 25, 2017
    Publication date: January 16, 2020
    Inventors: Tomohiro Kamo, Shinji Hasegawa, Yuma Kagohara, Shotaro Ueno, Takaaki Miyake, Takeru Kobayashi, Ryusei Matsuda, Shu Asano
  • Patent number: 10522596
    Abstract: In one embodiment, a semiconductor storage device includes a first interconnect extending in a first direction, a plurality of second interconnects extending in a second direction different from the first direction, and a plurality of first insulators provided alternately with the second interconnects. The device further includes a resistance change film provided between the first interconnect and at least one of the second interconnects and including a first metal layer or a first semiconductor layer that includes a first face provided on a first interconnect side and a second face provided on a second interconnect side, at least any of the first face and the second face having a curved plane shape.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: December 31, 2019
    Assignee: TOSHIBA MEMORY CORPORATION
    Inventors: Keiichi Sawa, Kazuhisa Matsuda, Atsushi Takahashi, Takaumi Morita, Masayuki Tanaka, Shinji Mori, Kazuhiro Matsuo, Yuta Saito, Kenichiro Toratani, Hisashi Okuchi
  • Publication number: 20190388995
    Abstract: The present invention relates to a fillet welded joint and a manufacturing method thereof, and addresses the problem of providing a fillet welded joint having excellent weld fatigue strength while suppressing low temperature cracking. In a fillet welded joint according to the present invention, a tensile strength of a base material is 980 MPa or more, a carbon equivalent is 0.36 or more and 0.60 or less, a tensile strength [MPa] is 1950 times or more of the carbon equivalent [wt%], an average carbon equivalent of weld metal is 0.45 or more and 0.65 or less, and at a prescribed position below a surface of a weld toe, a Vickers hardness HVbond at a boundary between the weld metal and a heat affected zone, an average value HVwmt of the Vickers hardness of the weld metal in a position 0.1 mm or more and 0.3 mm or less to the weld metal side of the boundary, and an average value HVhaz of the Vickers hardness of the heat affected zone in a position 0.1 mm or more and 0.
    Type: Application
    Filed: February 28, 2018
    Publication date: December 26, 2019
    Applicant: NIPPON STEEL CORPORATION
    Inventors: Shinji KODAMA, Kazuki MATSUDA, Yoshinari ISHIDA
  • Publication number: 20190384093
    Abstract: A display device includes a panel member, a flexible substrate, and a tap. The flexible substrate includes a substrate body and a substrate extending portion. The substrate body is disposed in an area of a surface of the panel member inner than an outer peripheral edge portion of the surface. The substrate extension portion is extended from an outer peripheral edge portion of the substrate body. The substrate extension portion includes an overlapping portion overlapping a section of the outer peripheral edge portion of the surface. The tape is pasted to the area inner than the outer peripheral edge portion of the surface. The tape covers the substrate extension portion that is folded back to the substrate body from an opposite side from the substrate body such that the overlapping portion does not overlap the outer peripheral edge portion of the surface to hold the substrate extension portion.
    Type: Application
    Filed: June 5, 2019
    Publication date: December 19, 2019
    Inventors: Shinji TOMOKAWA, Takafumi MATSUDA, Akiyoshi TAKAOKA
  • Publication number: 20190371810
    Abstract: A semiconductor device includes a semiconductor layer containing metal atoms, a charge storage layer provided on a surface of the semiconductor layer via a first insulating film, and an electrode layer provided on a surface of the charge storage layer via a second insulating film. The thickness of the first insulating film is 5 nm or more and 10 nm or less. The concentration of the metal atoms in the semiconductor layer is 5.0×1017 [EA/cm3] or higher and 1.3×1020 [EA/cm3] or lower.
    Type: Application
    Filed: February 25, 2019
    Publication date: December 5, 2019
    Applicant: TOSHIBA MEMORY CORPORATION
    Inventors: Yuta SAITO, Shinji MORI, Keiichi SAWA, Kazuhisa MATSUDA, Kazuhiro MATSUO, Hiroyuki YAMASHITA
  • Publication number: 20190310538
    Abstract: A technology that allows a user to view image information more comfortably has been demanded. The present disclosure provides an information processing apparatus including a control unit that controls a person detection unit on the basis of an irradiation direction in which an irradiation unit capable of irradiating various image information irradiates the image information, the person detection unit forming a detection area in a direction opposite to the irradiation direction. According to the present disclosure, the person detection unit is controlled on the basis of the irradiation direction, whereby an operation unintended by a user is less likely to be performed. The user can thus view the image information more comfortably.
    Type: Application
    Filed: December 22, 2017
    Publication date: October 10, 2019
    Applicant: Sony Mobile Communications Inc.
    Inventors: Yuichiro SAITO, Shinji MATSUDA, Tomoki HAMAJIMA
  • Publication number: 20190306980
    Abstract: An embodiment of the present invention provides a flexible printed circuit board (1) which is distinguishable from another flexible printed circuit board by use of an identifier. The flexible printed circuit board (1) includes: a base layer (13); a wiring layer (14); a surface cover layer (15); and an identifier (121) which allows the flexible printed circuit board (1) to be distinguished from another flexible printed circuit board, the surface cover layer (15) being formed in a surface cover region (11) while not being formed in a non-surface cover region (12), and the identifier (121) being provided in the non-surface cover region (12).
    Type: Application
    Filed: March 19, 2019
    Publication date: October 3, 2019
    Inventors: TAKUMA WATANABE, SHINJI TOMOKAWA, TAKAFUMI MATSUDA, AKIYOSHI TAKAOKA
  • Publication number: 20190297709
    Abstract: Disclosed is a lighting system that can control lighting using a PLC communications while reducing an increase in cost for equipment. The lighting system includes a controller configured to communicate through a PLC communications, and a lighting apparatus group having a plurality of lighting apparatuses. The plurality of lighting apparatuses includes a master configured to communicate through the PLC communications, and a slave capable of communicating with the master. The master communicates with the slave through a communications that is different from the PLC communications.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 26, 2019
    Inventors: Yasuhito HIRAUCHI, Shinji MATSUDA
  • Patent number: 10396280
    Abstract: A semiconductor memory device includes a plurality of first interconnections extending in a first direction, and a second interconnection extending in a second direction different from the first direction. The device further includes a resistance change film provided between the plurality of first interconnections and the second interconnection, the resistance change film including (a) silicon and a semiconductor layer including one or more elements selected from among oxygen, carbon, nitrogen, phosphorus, boron, and germanium, or (b) a first layer containing the germanium and a second layer containing the silicon.
    Type: Grant
    Filed: September 5, 2017
    Date of Patent: August 27, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Shinji Mori, Masayuki Tanaka, Kazuhiro Matsuo, Kenichiro Toratani, Keiichi Sawa, Kazuhisa Matsuda, Atsushi Takahashi, Yuta Saito
  • Publication number: 20190196476
    Abstract: In automatic travel control of a flying device towards a target, when a current distance from the target is large in comparison to a prescribed distance threshold, a controller of the flying device performs velocity feedback PID control to control the flight propulsion unit of the flying device. When the current distance becomes small in comparison to the prescribed distance threshold, the controller performs a hybrid of the velocity feedback PID control and position feedback PID control to control the flight propulsion unit such that as the flying device approaches the target, the position feedback PID control becomes more dominant than the velocity PID control. The processor calculates a weighted average of the respective manipulated variables with dynamically adjusted weights to achieve the hybrid control.
    Type: Application
    Filed: December 21, 2018
    Publication date: June 27, 2019
    Applicant: CASIO COMPUTER CO., LTD.
    Inventors: Hideaki MATSUDA, Takahiro MIZUSHINA, Shunsuke YAMADA, Toshihiro TAKAHASHI, Masanori OHTA, Shinji DAZAI