Patents by Inventor Shinji Ota

Shinji Ota has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5754093
    Abstract: A thick-film resistor in a thick-film printed substrate, the resistance of which is maintained at an appropriate value, is disclosed. In a thick-film printed substrate formed by printing a thick-film conductor and a resistor of lanthanum boride type on a ceramic substrate and then sintering, an intermediate resistor layer of lanthanum boride type is provided between the thick-film conductor and the resistor of lanthanum boride type. Reaction of glass composition contained in the thick-film conductor is suppressed, and resistance abnormality is prevented during sintering by causing the intermediate resistor layer of lanthanum boride type to be interposed.
    Type: Grant
    Filed: April 26, 1996
    Date of Patent: May 19, 1998
    Assignee: Nippondenso Co., Ltd.
    Inventors: Shinji Ota, Takashi Nagasaka
  • Patent number: 5321382
    Abstract: A thermal type flow rate sensor comprising a sensor chip having a rectangular shape. The sensor chip is supported between supporting pins through ribbon-like leads connected to opposite ends of the sensor chip. The ribbon-like leads serve to correctly locate the surface of the sensor chip with respect to flow of fluid. The surfaces of the sensor chip is formed with a thin film heater. A heater portion of the thin film heater comprises a plurality of straight portions and a plurality of turn portions connecting the straight portions to each other. Each turn portion is formed in a smoothly curved shape to avoid the concentration of electric currents and is disposed at an end portion of the sensor chip which has a comparatively low temperature. This structure is effective in preventing generation of cracks in the turn portions. In addition, the plurality of straight portions are alternatively inclined to effectively utilize the surface of the sensor chip to form a long heating portion.
    Type: Grant
    Filed: July 7, 1992
    Date of Patent: June 14, 1994
    Assignee: Nippondenso Co., Ltd.
    Inventors: Masahito Mizukoshi, Shinji Ota, Norikazu Hosokawa, Yasushi Kohno