Abstract: A mask holder and a mask conveying and holding mechanism using the same, effectively usable in an exposure apparatus for printing a pattern of a mask or reticle on a workpiece such as a semiconductor wafer or a plate-like member made of glass or cermaics, is disclosed. In one preferred form, the mask holder has three positioning rollers, two spring-biased pressing rollers for pressing two side faces of a mask so that other two side faces of the mask abut against the positioning rollers, and two spring-biased pressing members for pressing an upper face of the mask so that a lower face of the mask abuts against a lower end face of a mask accommodating portion of the holder. With this arrangement, the mask can be held as a unit with the holder during conveyance. Also, the holder and a mask stage of the exposure apparatus may be arranged so that the mask can be held on the stage by vacuum suction.

Abstract: A positioning device for positioning a mask having formed thereon a pattern to be transferred onto a semiconductor wafer. On the basis of a peripheral shape of the mask, the positioning device positions the mask so that a center of the mask is brought into alignment with a center of rotation of a holder for holding the mask. The positioning device includes a plurality of engaging pins to be engaged by the periphery of the mask, each engaging pin being movable in a direction toward the center of rotation of the mask holder. Movement of each of the engaging pins is controlled independently from the others, whereby the mask can be positioned irrespective of its size and/or shape.

Abstract: A pattern transfer apparatus for transferring a pattern of a mask onto a wafer. The apparatus includes a wafer chuck for holding the wafer at a position whereat the pattern of the mask is transferred onto the wafer. The temperature of the wafer held by the wafer chuck is controlled to expand/contract the wafer to achieve alignment of the pattern of the mask with a pattern which has already been formed on the wafer. A mechanism for preparatively adjusting the temperature of the wafer before it is moved to the wafer chuck is provided, whereby the time until the temperature of the wafer on the wafer chuck reaches a desired level is reduced and, therefore, throughput of the apparatus is improved. Further, any fluctuation in the temperature of the wafer chuck is prevented so that the reliability of alignment between the pattern of the mask and the pattern formed on the wafer is improved.

Abstract: A cassette-type container for a sheet-like member, includes a lower member for carrying the sheet-like member, an upper member engageable with the lower member to define a closed chamber, a guide channel formed in the upper member, for guiding rectilinear movement of the upper member when it is engaged by or disengaged from the lower member, a guide pin formed on the lower member and engageable with the guide channel so that the upper member is pivotally movable relative to the lower member, and a member for holding the upper member and lower member against separation.

Abstract: In a semiconductor exposure apparatus having chucks for holding a mask and a wafer, respectively, the holding portion of at least one of the chucks has a coefficient of linear expansion equal to or smaller than the coefficient of linear expansion of the bodies held. Particularly, the coefficient of linear expansion of the holding portion of the chuck should preferably be of a small absolute value, but even where the absolute value of the coefficient of linear expansion is great, the chucks are usable by providing temperature control.

Abstract: A method of and an apparatus for adsorbingly fixing a body, such as a photomask (mask) or a wafer to a chuck, effect a preliminary vacuum-adsorbing step of preventing the creation of internal stress due to the temperature change between the body and the chuck before the final vacuum adsorption is effected, or effect a preliminary vacuum releasing step for relieving the created internal stress.