Patents by Inventor Shinn-Juh Lay

Shinn-Juh Lay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packaging structure with low switching noises
    Patent number: 6683781
    Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.
    Type: Grant
    Filed: May 23, 2002
    Date of Patent: January 27, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Ted C. Ho, Min-Lin Lee, Huey-Ru Chang, Shinn-Juh Lay
  • PACKAGING STRUCTURE WITH LOW SWITCHING NOISES
    Publication number: 20030217858
    Abstract: A packaging structure with low switching noises is disclosed. In this structure, a chip capacitor is connected to a chip. The chip capacitor is a capacitor structure formed using a high dielectric material to provide a better noise filtering effect. Therefore, the invention can effectively lower switching noises.
    Type: Application
    Filed: May 23, 2002
    Publication date: November 27, 2003
    Inventors: Ted C. Ho, Min-Lin Lee, Huey-Ru Chang, Shinn-Juh Lay