Abstract: A printed wiring board includes conductive layers, resin insulation layers, a through-hole conductor penetrating through one or more insulation layers and having a first-surface-side and second-surface-side lands, a first-surface-side signal line formed on one of the insulation layers and connecting the first-surface-side land and a conductive layer on the insulation layer, and a second-surface-side signal line formed on one of the insulation layers and connecting the second-surface-side land and a conductive layer on the insulation layer.

Abstract: A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate.

Abstract: A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer includes a first signal line interposed between the first and second interlayer insulating layers, a first ground layer formed on a surface of the first interlayer resin insulating layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal line is interposed between the first and second ground layers, the first and second interlayer insulating layers and the outermost interlayer insulating layer include resin materials, respectively, and the first and second interlayer insulating layers are different from the outermost interlayer insulating layer in material and/or thickness.

Abstract: A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.

Abstract: A front-seat air conditioner and a rear-seat air conditioner, which are independent from each other, are provided. An engine is automatically stopped under preset stop conditions. When the engine is automatically stopped in a case in which the number of passengers is a specified preset number (five, for example) or larger during heating, the operation of the rear-seat air conditioner is stopped (reduction of power consumption) and the operation of the front-seat air conditioner is continued (prevention of windshield glass from being fogged). Thereby, the windshield glass can be prevented from being fogged during the engine's automatic stop, reducing the power consumption of air conditioning.

Abstract: A wiring board includes a substrate which has multiple opening portions and one or more boundary portions separating the opening portions, multiple electronic devices positioned in the opening portions of the substrate, respectively, a conductive pattern formed on a surface of the boundary portion, and an insulation layer formed on the substrate and the conductive pattern on the boundary portion of the substrate such that the insulation layer covers the electronic devices in the opening portions of the substrate. The boundary portion has a width which is in a range of approximately 0.05 to approximately 2.0 mm.

Abstract: A blower fan is driven, and conditioning air flows down through an evaporator and then is supplied into a vehicle compartment. An idling-stop condition in a roof-open state is set to make an idling stop to be relatively easily attained, compared to a roof-closed state, so that a fuel economy can be improved. When an outside-air temperature is a specified temperature or higher or a solar-radiation intensity is a specified degree or greater at an engine's automatic stop, the blower fan is driven, so that the conditioning air is supplied toward a passenger in a manner of an electric fan. The evaporator through which the conditioning air flows down is sufficiently cool at the timing right after the automatic stop of the engine. Accordingly, it is preferable to configure such that the sufficiently-cooled conditioning air is supplied for a properly-long period of time.

Abstract: A sheet conveying apparatus includes an intermediate plate (21b) as a sheet receiving member configured to stack a sheet, a feed roller (22) as a feed rotator configured to feed the sheet stacked on the intermediate plate (21b), and a separation roller (23) as a separation member configured to separate the sheet from a sheet bundle stacked on the intermediate plate (21b). The sheet conveying apparatus further includes a restrict member (60) as a restrict portion disposed so as to reach a position overlapped in a width direction orthogonal to a sheet conveying direction with the feed roller (22) as at least one member among the feed roller (22) and the separation roller (23) and offset in the width direction from the feed roller (22), and restricting a leading end position of the sheet stacked on the intermediate plate (21b).

Abstract: A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

Abstract: A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer includes a first signal line interposed between the first and second interlayer insulating layers, a first ground layer formed on a surface of the first interlayer resin insulating layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal line is interposed between the first and second ground layers, the first and second interlayer insulating layers and the outermost interlayer insulating layer include resin materials, respectively, and the first and second interlayer insulating layers are different from the outermost interlayer insulating layer in material and/or thickness.

Abstract: A sheet conveying apparatus includes an intermediate plate (21b) as a sheet receiving member configured to stack a sheet, a feed roller (22) as a feed rotator configured to feed the sheet stacked on the intermediate plate (21b), and a separation roller (23) as a separation member configured to separate the sheet from a sheet bundle stacked on the intermediate plate (21b). The sheet conveying apparatus further includes a restrict member (60) as a restrict portion disposed so as to reach a position overlapped in a width direction orthogonal to a sheet conveying direction with the feed roller (22) as at least one member among the feed roller (22) and the separation roller (23) and offset in the width direction from the feed roller (22), and restricting a leading end position of the sheet stacked on the intermediate plate (21b).

Abstract: An image reading apparatus including a shading correction mechanism that can be formed by fewer component parts than conventional ones, and is increased in the degree of freedom of design, thereby enabling reduction of the size and weight thereof. A contact glass guides an original to an image reading position. A glass holding member holds the glass. A line image sensor reads an image on the original conveyed to the image reading location, through the contact glass. A reference member is disposed at a location different from the image reading location on the contact glass. A moving mechanism relatively moves the line image sensor and the reference member so that the line image sensor can alternatively read the original conveyed to the image reading location and the reference member. A drive section externally drives the moving mechanism to move the line image sensor and/or the reference member.

Abstract: A portable electronic device and a magnetic field antenna circuit are provided for making it possible to keep an antenna resonance frequency in a fixed range even if temperature changes. A mobile telephone device (1) is provided with a second communication unit driven by a chargeable battery (43) to execute a predetermined function and an RFID unit (41) accompanied with magnetic communication. The RFID unit (41) includes a magnetic antenna unit (50), which can transmit or receive a wireless signal by a magnetic field, and a capacitor (52), one terminal of which is connected with the magnetic antenna unit (50) to generate a predetermined resonance frequency. The capacitor (52) is characterized in having a temperature-reactance characteristic reverse to an amount of an inductance value that fluctuates as the magnetic antenna unit (50) changes in accordance with temperatures.

Abstract: An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion.

Abstract: An image reading apparatus including a shading correction mechanism that can be formed by fewer component parts than conventional ones, and is increased in the degree of freedom of design, thereby enabling reduction of the size and weight thereof. A contact glass guides an original to an image reading position. A glass holding member holds the glass. A line image sensor reads an image on the original conveyed to the image reading location, through the contact glass. A reference member is disposed at a location different from the image reading location on the contact glass. A moving mechanism relatively moves the line image sensor and the reference member so that the line image sensor can alternatively read the original conveyed to the image reading location and the reference member. A drive section externally drives the moving mechanism to move the line image sensor and/or the reference member.

Abstract: A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.

Abstract: An image reading apparatus including a shading correction mechanism that can be formed by fewer component parts than conventional ones, and is increased in the degree of freedom of design, thereby enabling reduction of the size and weight thereof. A contact glass guides an original to an image reading position. A glass holding member holds the glass. A line image sensor reads an image on the original conveyed to the image reading location, through the contact glass. A reference member is disposed at a location different from the image reading location on the contact glass. A moving mechanism relatively moves the line image sensor and the reference member so that the line image sensor can alternatively read the original conveyed to the image reading location and the reference member. A drive section externally drives the moving mechanism to move the line image sensor and/or the reference member.

Abstract: A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.