Patents by Inventor Shinobu Kato

Shinobu Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130077133
    Abstract: An image reading apparatus including a shading correction mechanism that can be formed by fewer component parts than conventional ones, and is increased in the degree of freedom of design, thereby enabling reduction of the size and weight thereof. A contact glass guides an original to an image reading position. A glass holding member holds the glass. A line image sensor reads an image on the original conveyed to the image reading location, through the contact glass. A reference member is disposed at a location different from the image reading location on the contact glass. A moving mechanism relatively moves the line image sensor and the reference member so that the line image sensor can alternatively read the original conveyed to the image reading location and the reference member. A drive section externally drives the moving mechanism to move the line image sensor and/or the reference member.
    Type: Application
    Filed: November 15, 2012
    Publication date: March 28, 2013
    Inventors: JUN TANAKA, TAKASHI MACHIDA, SHINOBU KATO, KEIJI TSUTAOKA, TAKETO OCHIAI, MASAHIRO SHIRAI, SHIGERU IKEZAKI, HIROTAKA WATANABE
  • Publication number: 20130020116
    Abstract: A printed wiring board has a packaging substrate having multiple pads, and a transmission substrate mounted on the multiple pads of the packaging substrate. The packaging substrate has a pad group constituted of pads which mount an electronic component, the multiple pads mounting the transmission substrate includes a first pad positioned in a peripheral portion of the packaging substrate and a second pad positioned between the first pad and the pad group, the second pad is electrically connected to a signal pad of the pads in the pad group, and the transmission substrate includes a horizontal wiring which electrically connects the second pad and the first pad and which transmits a signal between the second pad and the first pad.
    Type: Application
    Filed: May 31, 2012
    Publication date: January 24, 2013
    Applicant: IBIDEN Co., Ltd.
    Inventors: Yasuhiko MANO, Shinobu Kato, Haruhiko Morita, Satoshi Kurokawa
  • Patent number: 8335021
    Abstract: An image reading apparatus including a shading correction mechanism that can be formed by fewer component parts than conventional ones, and is increased in the degree of freedom of design, thereby enabling reduction of the size and weight thereof. A contact glass guides an original to an image reading position. A glass holding member holds the glass. A line image sensor reads an image on the original conveyed to the image reading location, through the contact glass. A reference member is disposed at a location different from the image reading location on the contact glass. A moving mechanism relatively moves the line image sensor and the reference member so that the line image sensor can alternatively read the original conveyed to the image reading location and the reference member. A drive section externally drives the moving mechanism to move the line image sensor and/or the reference member.
    Type: Grant
    Filed: March 21, 2007
    Date of Patent: December 18, 2012
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Jun Tanaka, Takashi Machida, Shinobu Kato, Keiji Tsutaoka, Taketo Ochiai, Masahiro Shirai, Shigeru Ikezaki, Hirotaka Watanabe
  • Publication number: 20120212919
    Abstract: A printed wiring board includes a core substrate having a cavity and having first and second surfaces, an inductor component accommodated in the cavity, a filler resin filling a gap formed between the substrate and component in the cavity, and a buildup layer formed on the first surface of the substrate and the component. The component has a coil layer, a second insulation layer formed on the coil layer, an electrode formed on the substance layer, and a via conductor formed in the substance layer and connecting the coil layer and the electrode, the component is accommodated in the cavity such that the electrode faces the first surface of the substrate, and the buildup layer includes an interlayer insulation layer formed on the first surface of the substrate and the component, a conductive layer formed on the insulation layer, and a connection via conductor connecting the conductive layer and electrode.
    Type: Application
    Filed: January 27, 2012
    Publication date: August 23, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuhiko MANO, Shinobu Kato, Takashi Kariya
  • Patent number: 8207811
    Abstract: A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.
    Type: Grant
    Filed: January 6, 2011
    Date of Patent: June 26, 2012
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Patent number: 8164804
    Abstract: An image reading apparatus which is capable of performing accurate shading correction with simple arrangement while preventing a reference member from being scratched and preventing paper powder and the like dust from being deposited on the reference member. The image reading apparatus includes an image reading unit in which a contact glass guides an original on an image reading location. The contact glass is held by a glass holding member. A line image sensor reads the image on the original conveyed on the image reading location, through the contact glass. The image reading unit further includes a reference member whose image is readable by the image sensor, and a moving mechanism to move the image sensor so as to enable the image sensor to alternatively read the original and a reference surface of the reference member.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: April 24, 2012
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Jun Tanaka, Takashi Machida, Shinobu Kato, Keiji Tsutaoka, Taketo Ochiai, Tetsurou Ishikawa
  • Patent number: 8129625
    Abstract: In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
    Type: Grant
    Filed: April 6, 2004
    Date of Patent: March 6, 2012
    Assignee: IBIDEN Co., Ltd.
    Inventor: Shinobu Kato
  • Publication number: 20120032335
    Abstract: An electronic component including a wiring board having a power-source pattern and a signal pattern, a semiconductor element mounted on the wiring board and having a power-source electrode pad and a signal electrode pad, a first connection portion being made of a conductive material and connecting the signal pattern of the wiring board and the signal electrode pad of the semiconductor element, and a second connection portion being made of a conductive material and connecting the power-source pattern of the wiring board and the power-source electrode pad of the semiconductor element. The conductive material of the first connection portion and the conductive material of the second connection portion are selected such that the conductive material of the second connection portion has an electrical resistance which is lower than an electrical resistance of the conductive material of the first connection portion.
    Type: Application
    Filed: August 8, 2011
    Publication date: February 9, 2012
    Applicant: IBIDEN CO., LTD.
    Inventors: Takashi KARIYA, Toshiki Furutani, Shinobu Kato
  • Patent number: 8085448
    Abstract: An image reading apparatus capable of continually conveying a plurality of originals in a stable manner while cleaning a contact glass of an image sensor and reducing streaks occurring in read images. An image sensor reads an original image via a contact member which the conveyed original may contact. A cleaning member, being provided on a turning member which is able to rotate or swing and disposed at a position opposing the image sensor, cleans the contact member's surface which the original may contact. The turning member is turned by a driving unit. A controlling unit controls the driving unit to turn the turning member so that cleaning of the contact member is performed by the cleaning member after the original has passed an image reading position of the image sensor and before a subsequent original reaches the image reading position.
    Type: Grant
    Filed: March 27, 2008
    Date of Patent: December 27, 2011
    Assignee: Canon Denshi Kabushiki Kaisha
    Inventors: Shinobu Kato, Katsuhiko Okitsu, Hirokazu Higuchi
  • Publication number: 20110249302
    Abstract: An image reading apparatus which is capable of performing accurate shading correction with simple arrangement while preventing a reference member from being scratched and paper powder and the like dust from being deposited on the reference member. The image reading apparatus comprises an image reading unit. In the image reading unit, a contact glass guides an original on an image reading location. The contact glass is held by a glass holding member. A line image sensor reads the image on the original conveyed on the image reading location, through the contact glass. The image reading unit further comprises a reference member whose image is readable by the image sensor, and a moving mechanism to move the image sensor so as to enable the image sensor to alternatively read the original and a reference surface of the reference member.
    Type: Application
    Filed: June 17, 2011
    Publication date: October 13, 2011
    Applicant: CANON DENSHI KABUSHIKI KAISHA
    Inventors: Jun Tanaka, Takashi Machida, Shinobu Kato, Keiji Tsutaoka, Taketo Ochiai, Tetsurou Ishikawa
  • Patent number: 7956291
    Abstract: In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
    Type: Grant
    Filed: April 6, 2004
    Date of Patent: June 7, 2011
    Assignee: IBIDEN Co., Ltd.
    Inventor: Shinobu Kato
  • Publication number: 20110102122
    Abstract: A printed wiring board including a substrate having a first surface and a second surface on the opposite side of the second surface, a first conductive circuit formed on the first surface of the substrate, a second conductive circuit formed on the second surface of the substrate, a magnetic body embedded in the substrate and extending in a thickness direction of the substrate, the magnetic body having a through-hole formed through the magnetic body and extending in the thickness direction of the substrate, and a through-hole conductor formed on an inner surface of the through-hole of the magnetic body such that the first and second conductive circuits are electrically connected to each other through the through-hole conductor.
    Type: Application
    Filed: January 6, 2011
    Publication date: May 5, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuhiko MANO, Takashi KARIYA, Shinobu KATO
  • Publication number: 20110058348
    Abstract: A semiconductor device includes a first substrate having a power-source line, an IC device mounted on the first substrate and having a power-source line, a second substrate mounted on the IC device and having a base material, a power-source layer formed inside or on a surface of the base material, an insulation layer formed on the power-source layer, and a pad formed on the insulation layer, and a via conductor connecting the power-source layer and the pad. A first route connects the power-source line of the first substrate and the power-source line of the IC device. A second route connects the power-source line of the first substrate and the power-source layer of the second substrate. A third route connects the power-source layer of the second substrate and the power-source line of the IC device.
    Type: Application
    Filed: June 7, 2010
    Publication date: March 10, 2011
    Applicant: IBIDEN CO., LTD.
    Inventors: Atsushi SAKAI, Shinobu Kato, Naoyuki Jinbo
  • Patent number: 7868728
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Grant
    Filed: January 25, 2010
    Date of Patent: January 11, 2011
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Patent number: 7855626
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: December 21, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Patent number: 7843302
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: November 30, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Publication number: 20100282502
    Abstract: In a core substrate 30, a ground through hole 36E and a power through hole 36P are disposed in the grid formation, so that electromotive force induced in X direction and Y direction cancel out each other. As a result, even if mutual inductance is reduced and a high frequency IC chip is loaded, electric characteristic and reliability can be improved without generating malfunction or error.
    Type: Application
    Filed: July 22, 2010
    Publication date: November 11, 2010
    Applicant: IBIDEN CO., LTD.
    Inventor: Shinobu KATO
  • Patent number: 7812702
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Grant
    Filed: May 15, 2009
    Date of Patent: October 12, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Patent number: 7760062
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Grant
    Filed: May 8, 2006
    Date of Patent: July 20, 2010
    Assignee: Ibiden Co., Ltd.
    Inventors: Yasuhiko Mano, Takashi Kariya, Shinobu Kato
  • Publication number: 20100117779
    Abstract: An inductor embedded in a printed wiring board includes a conductor extending in the thickness direction of a printed circuit board and a magnetic body that is in contact with the conductor with no gap therebetween. For example, the magnetic body is composed of ferrite having a cylindrical tubular shape. The conductor is composed of a copper film formed by plating on an inner peripheral surface of the cylindrical tubular ferrite. The inductor is inserted in the thickness direction of the printed wiring board.
    Type: Application
    Filed: January 25, 2010
    Publication date: May 13, 2010
    Applicant: IBIDEN CO., LTD.
    Inventors: Yasuhiko MANO, Takashi Kariya, Shinobu Kato