Abstract: A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.

Abstract: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.

Abstract: A heat dissipation apparatus including an insulation substrate, a heat sink, and a heat mass member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. A heat sink is thermally coupled to the second surface of the insulation substrate. A heat mass member includes a stress reduction portion and a heat mass portion arranged so that one is above the other. The stress reduction portion includes a plurality of recesses in at least either one of a surface facing toward the insulation substrate and a surface facing toward the heat sink of the heat mass member. The heat mass portion has a thickness that is greater than that of the stress reduction portion, and the heat mass member has a thickness that is greater than three millimeters.

Abstract: A heat dissipation apparatus including an insulation substrate, a heat sink, and a stress reduction member. The insulation substrate includes a first surface serving as a heated body receiving surface and a second surface opposite to the first surface. The heat sink is thermally coupled to the second surface of the insulation substrate. The heat sink, which includes an upper case and a lower case, serves as a liquid cooling device including a cooling passage. The stress reduction member is arranged between the insulation substrate and the upper case. The stress reduction member includes stress absorption hollows. The upper case includes a first portion that contacts the stress reduction member and a second portion defined by the remaining part of the upper case. The first portion has a thickness that is less than that of the second portion.

Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on a side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5. The stress relaxation member 4 is formed of an aluminum plate 10 having a plurality of through holes 9 formed therein, and the through holes 9 serve as stress-absorbing spaces. The stress relaxation member 4 is brazed to the metal layer 7 of the insulating substrate 3 and to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.

Abstract: A semiconductor device is disclosed that includes a circuit board, a semiconductor element, a heat sink, and a stress relaxation member. The circuit board includes an insulated substrate, a metal circuit joined to one side of the insulated substrate, and a metal plate joined to the other side of the insulated substrate. The semiconductor element is joined to the metal circuit. The heat sink radiates heat generated in the semiconductor element. The stress relaxation member thermally joins the heat sink to the metal plate. The stress relaxation member is formed of a material having a high thermal conductivity. The stress relaxation member includes recesses, which curve inward from the peripheral portion of the stress relaxation member, to form stress relaxation spaces at the peripheral portion of the stress relaxation member.

Abstract: A liquid-cooling type cooling plate including at least one flat multi-bored tube, a substrate, and a cover plate. The substrate includes, at its upper surface, two header forming dented portions arranged apart from each other and a tube accommodating dented portion for accommodating the tube, the tube accommodating dented portion being formed between the header forming dented portions. An upper surface of the cover plate and/or a lower surface of the substrate is configured to be attached by a member to be cooled. The tube is accommodated in the tube accommodating dented portion and is disposed between the substrate and the cover plate. An opening of each header forming dented portion is closed by the cover plate, whereby two header portions are formed. The substrate, the tube, and the cover plate are integrally jointed.

Abstract: A heat exchanger for use as an evaporator includes a heat exchange core having a plurality of heat exchange tubes arranged in a left-right direction at a spacing, and a refrigerant turn tank as a lower tank disposed toward a lower end of the heat exchange core. The heat exchange tubes are inserted through respective tube insertion holes formed in the turn tank and joined to the tank, The turn tank has drain grooves each extending from a forwardly or rearwardly outer end of each of the tube insertion holes for discharging condensation water to below the turn tank therethrough. Each of the drain grooves has a bottom extending gradually downward as the bottom extends away from the tube insertion hole.

Abstract: A heat exchanger fin, capable of improving heat transfer rate while preventing generation of heat bypass flow, such as a louver fin provided with a plurality louvers arranged at certain intervals in the introduction direction of air. The louvers are formed by cutting and bending the heat exchanger fin so that the air is passed while being guided by the louvers. The plurality of louvers include louvers different in louver width, the louver width being defined by a length of the louver along which the heat medium passes. Wider louvers and narrower louvers can be arranged alternatively.

Abstract: A heat transfer fin is capable of enhancing heat transfer rate, decreasing pressure loss, and is excellent in heat exchanging performance. A corrugated fin (53) as the heat tranfer fin is disposed between adjacent heat exchanging tubes (51 and 52). The corrugated fin (53) is formed by connecting a plurality of louver fins (54) in a zigzag manner, and is provided with a plurality of louvers (55) formed at certain intervals. Thus, an air passage (56) is formed between the louver fins (54). The windward side edge (54a) of the louver fin (54) and the windward side edge (55a) of the louver (55) are respectively formed into a semielliptic cross-sectional configuration which becomes thinner toward the windward side.

Abstract: A heat exchanger includes a refrigerant inlet-outlet tank, a refrigerant turn tank, and tube groups in the form of at least two rows arranged between the two tanks, and each including a plurality of heat exchange tubes. The refrigerant inlet-outlet tank has its interior divided into a refrigerant inlet header chamber and a refrigerant outlet header chamber. The refrigerant turn tank has its interior divided by a divided flow control plate into a refrigerant inflow header chamber and a refrigerant outflow header chamber. The divided flow control plate has refrigerant dam portions at respective opposite end portions thereof, and a refrigerant passing portion provided between the dam portions and having one or at least two refrigerant passing holes. The heat exchanger exhibits improved heat exchange performance when used as an evaporator.

Abstract: An evaporator 1 comprises a heat exchange core 10 comprising a plurality of tube groups 5 arranged in rows as spaced forwardly or rearwardly of the evaporator and each comprising a plurality of heat exchange tubes 4 arranged in parallel at a spacing laterally of the evaporator, and a lower tank 3 disposed at a lower end of the core 10 and having connected thereto lower ends of the heat exchange tubes 4 providing the tube groups 5. The lower tank 3 has a top surface 3a, front and rear opposite side surfaces 3b and a bottom surface 3c. The lower tank 3 is provided in each of front and rear opposite side portions thereof with grooves 29 formed between respective laterally adjacent pairs of heat exchange tubes 4 and extending from an intermediate portion of the top surface 3a with respect to the forward or rearward direction to the side surface 3b for causing water condensate to flow therethrough.

Abstract: A galactosaminoglycan 4-sulfotransferase having an activity of transferring a sulfate group from a sulfate group donor to a hydroxyl group at the C-4 position of galactosamine residue of a galactosaminoglycan is presented.