Patents by Inventor Shintaro Nakagawa

Shintaro Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970004
    Abstract: A liquid discharge head includes a liquid discharge substrate that has a discharge-orifice row, pressure generating elements, and pressure chambers. The liquid discharge head discharges a liquid in a block-by-block manner using sequential driving. The discharge-orifice row is disposed so as to incline at an angle ?=Arctan (d1/d2) relative to a direction extending orthogonal to the conveyance direction of the medium, in which d1 (?m) is a disposition spacing of the discharge orifices in the discharge-orifice row in the conveyance direction and d2 (?m) is a disposition spacing of the discharge orifices in the discharge-orifice row in the direction orthogonal to the conveyance direction. A partition wall is formed between adjacent pressure chambers so as to separate the adjacent pressure chambers from each other. The partition wall has a communicating portion that communicates the adjacent pressure chambers with each other.
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: April 30, 2024
    Assignee: Canon Kabushiki Kaisha
    Inventors: Tomohiro Sato, Shuzo Iwanaga, Takatsugu Moriya, Koichi Ishida, Shingo Okushima, Shintaro Kasai, Yoshiyuki Nakagawa, Akiko Hammura
  • Patent number: 11919408
    Abstract: An information processing apparatus controls a vehicle having a service power supply used to provide a service and a driving power supply used for traveling. The information processing apparatus has a storage unit configured to store service-related information concerning the service provided by the vehicle, and a controller configured to select any of a first mode, in which the service power supply and the driving power supply are independently used, and a second mode, in which the service power supply and the driving power supply are shared, based on the service-related information.
    Type: Grant
    Filed: November 18, 2020
    Date of Patent: March 5, 2024
    Assignee: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Shintaro Matsutani, Aya Sato, Yasuki Nakagawa, Shigeru Inamori, Fuminori Matsuoka, Taro Hasegawa, Masaki Nanahara, Misaki Sato, Motoki Maekawa, Hiroki Ashizawa
  • Publication number: 20230276778
    Abstract: A fishing rod reel seat according to one embodiment of the present disclosure comprises a reel seat main body on which a reel leg placing portion on which a reel leg is placed is formed, a cylindrical moving hood that is guided by an outer surface of the reel seat main body and is movable along an axial direction of the reel seat main body, and a cylindrical fixing nut that is provided on the outer surface of the reel seat main body and holds a position of the moving hood in the axial direction, in which the fixing nut comprises an engaging portion and an engaged portion, and the fixing nut is made detachable from the reel seat main body by releasing engagement between the engaging portion and the engaged portion.
    Type: Application
    Filed: February 20, 2023
    Publication date: September 7, 2023
    Inventors: Hideaki TESHIROGI, Shintaro NAKAGAWA
  • Patent number: 8821651
    Abstract: A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: September 2, 2014
    Assignees: Nippon Paint Co., Ltd., Showa Denko K.K.
    Inventors: Tatsuo Yoshida, Masahiko Matsukawa, Miwa Iida, Shintaro Nakagawa
  • Patent number: 8824144
    Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
    Type: Grant
    Filed: January 18, 2012
    Date of Patent: September 2, 2014
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Keiji Toh, Shogo Mori, Hideyasu Obara, Nobuhiro Wakabayashi, Shintaro Nakagawa, Shinobu Yamauchi
  • Patent number: 8815022
    Abstract: A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: August 26, 2014
    Assignees: Nippon Paint Co., Ltd., Showa Denko K.K.
    Inventors: Tatsuo Yoshida, Masahiko Matsukawa, Shintaro Nakagawa
  • Publication number: 20140140004
    Abstract: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.
    Type: Application
    Filed: February 27, 2013
    Publication date: May 22, 2014
    Applicants: SHOWA DENKO K.K., KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Hidehito KUBO, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
  • Patent number: 8411438
    Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
    Type: Grant
    Filed: June 27, 2006
    Date of Patent: April 2, 2013
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
  • Patent number: 8387685
    Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: March 5, 2013
    Assignees: Kabushiki Kaisha Toshiba Jidoshokki, Showa Denko K.K.
    Inventors: Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Katsufumi Tanaka, Kota Otoshi, Eiji Kono, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
  • Patent number: 8198539
    Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: June 12, 2012
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Kota Otoshi, Eiji Kono, Keiji Toh, Katsufumi Tanaka, Yuichi Furukawa, Shinobu Yamauchi, Ryoichi Hoshino, Nobuhiro Wakabayashi, Shintaro Nakagawa
  • Publication number: 20120113598
    Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
    Type: Application
    Filed: January 18, 2012
    Publication date: May 10, 2012
    Applicants: SHOWA DENKO K.K., KABUSHIKI KAISHA TOYOTA JIDOSHOKKI
    Inventors: Keiji Toh, Shogo Mori, Hideyasu Obara, Nobuhiro Wakabayashi, Shintaro Nakagawa, Shinobu Yamauchi
  • Publication number: 20120064241
    Abstract: The present invention relates to a method of surface-treating an aluminum heat exchanger for vehicles in which a sufficient amount of photocatalytic metal oxide particles are retained on a surface of the heat exchanger in a state capable of exhibiting a photocatalytic activity thereof to remove VOC in a compartment of the vehicles by irradiating an ultraviolet ray thereto in an efficient manner. The method of surface-treating an aluminum heat exchanger for vehicles according to the present invention includes (1) a step of dispersing photocatalytic metal oxide particles whose surface is modified with apatite in an aqueous solution in which a low-temperature heat-decomposable resin is dissolved, to prepare a slurry; (2) a step of applying the slurry onto a surface of the heat exchanger; and (3) a step of drying the heat exchanger at a temperature of from 150 to 280° C. to decompose and remove a part of the low-temperature heat-decomposable resin on the surface of the photocatalytic metal oxide particles.
    Type: Application
    Filed: September 12, 2011
    Publication date: March 15, 2012
    Applicants: NIPPON PAINT CO., LTD., SHOWA DENKO K.K.
    Inventors: Tatsuo YOSHIDA, Isao KAWASAKI, Takashi TERADA, Satoshi MATSUMOTO, Shintaro NAKAGAWA
  • Patent number: 8102652
    Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.
    Type: Grant
    Filed: March 8, 2007
    Date of Patent: January 24, 2012
    Assignees: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Keiji Toh, Shogo Mori, Hideyasu Obara, Nobuhiro Wakabayashi, Shintaro Nakagawa, Shinobu Yamauchi
  • Publication number: 20110180248
    Abstract: A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 28, 2011
    Applicants: NIPPON PAINT CO., LTD., Showa Denko K.K.
    Inventors: Tatsuo YOSHIDA, Masahiko MATSUKAWA, Miwa IIDA, Shintaro NAKAGAWA
  • Publication number: 20110180249
    Abstract: A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 28, 2011
    Applicants: NIPPON PAINT CO., LTD., Showa Denko K.K.
    Inventors: Tatsuo Yoshida, Masahiko Matsukawa, Shintaro Nakagawa
  • Patent number: 7923833
    Abstract: A semiconductor module 10 includes a ceramic substrate having a front surface on which a semiconductor element 12 is mounted and a rear surface on the opposite side of the front surface, a front metal plate 15 joined to the front surface, a rear metal plate 16 joined to the rear surface, and a heat sink 13 joined to the rear metal plate 16. The rear metal plate 16 includes a joint surface 16b that faces the heat sink 13. The joint surface 16b includes a joint area and a non-joint area. The non-joint area includes recesses 18 which extend in the thickness direction of the rear metal plate 16. The joint area of the rear metal plate 16 is in a range from 65% to 85% of the total area of the joint surface 16b on the rear metal plate 16. As a result, excellent heat dissipating performance can be achieved while occurrence of distortion and cracking due to thermal stress is prevented.
    Type: Grant
    Filed: December 11, 2006
    Date of Patent: April 12, 2011
    Assignees: Showa Denko K.K., Kabushiki Kaisha Toyota Jidoshokki
    Inventors: Yuichi Furukawa, Shinobu Yamauchi, Nobuhiro Wakabayashi, Shintaro Nakagawa, Keiji Toh, Eiji Kono, Kota Otoshi, Katsufumi Tanaka
  • Publication number: 20100002397
    Abstract: A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.
    Type: Application
    Filed: March 8, 2007
    Publication date: January 7, 2010
    Applicants: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, SHOWA DENKO K.K.
    Inventors: Keiji Toh, Shogo Mori, Hideyasu Obara, Nobuhiro Wakabayashi, Shintaro Nakagawa, Shinobu Yamauchi
  • Publication number: 20090314474
    Abstract: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided. The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50.
    Type: Application
    Filed: April 19, 2006
    Publication date: December 24, 2009
    Applicants: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, SHOWA DENKO K.K.
    Inventors: Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Katsufumi Tanaka, Kota Otoshi, Eiji Kono, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
  • Publication number: 20090302458
    Abstract: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
    Type: Application
    Filed: June 27, 2006
    Publication date: December 10, 2009
    Inventors: Hidehito Kubo, Masahiko Kimbara, Keiji Toh, Kota Otoshi, Eiji Kono, Katsufumi Tanaka, Nobuhiro Wakabayashi, Shintaro Nakagawa, Yuichi Furukawa, Shinobu Yamauchi
  • Publication number: 20090200065
    Abstract: A heat radiator 1 includes an insulating substrate 3 whose first side serves as a heat-generating-element-mounting side, and a heat sink 5 fixed to a second side of the insulating substrate 3. A metal layer 7 is formed on the second side of the insulating substrate 3 opposite the heat-generating-element-mounting side. A stress relaxation member 4 formed of a high-thermal-conduction material intervenes between the metal layer 7 of the insulating substrate 3 and the heat sink 5 and includes a plate-like body 10 and a plurality of projections 11 formed at intervals on one side of the plate-like body 10. The end faces of the projections 11 of the stress relaxation member 4 are brazed to the metal layer 7, whereas the side of the plate-like body 10 on which the projections 11 are not formed is brazed to the heat sink 5. This heat radiator 1 is low in material cost and exhibits excellent heat radiation performance.
    Type: Application
    Filed: July 5, 2006
    Publication date: August 13, 2009
    Applicants: Kabushiki Kaisha Toyota Jidoshokki, Showa Denko K.K.
    Inventors: Kota Otoshi, Eiji Kono, Keiji Toh, Katsufumi Tanaka, Yuichi Furukawa, Shinobu Yamauchi, Ryoichi Hoshino, Nobuhiro Wakabayashi, Shintaro Nakagawa