Patents by Inventor Shintaro Shinjo

Shintaro Shinjo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10964631
    Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: March 30, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hideharu Yoshioka, Akimichi Hirota, Naofumi Yoneda, Hidenori Ishibashi, Shintaro Shinjo, Kiyoshi Ishida, Hideki Morishige
  • Publication number: 20210083627
    Abstract: An apparatus includes an envelope detecting unit for detecting an envelope of a signal to be amplified, and a variable power supply applies, to an output terminal of a carrier amplifier, a voltage increased with increase in the envelope detected by the envelope detecting unit. As a result, highly efficient operation can be implemented without including a phase shifter including a quarter wavelength line or the like.
    Type: Application
    Filed: June 23, 2017
    Publication date: March 18, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuichi SAKATA, Yuji KOMATSUZAKI, Shintaro SHINJO
  • Patent number: 10911003
    Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keigo Nakatani, Shintaro Shinjo, Koji Yamanaka
  • Publication number: 20210006208
    Abstract: A conventional Doherty amplifier requires a load modulation line having an electrical length of 90 degrees, a frequency compensation line having an electrical length of an integral (n) multiple of 180 degrees, and an input phase adjustment line having an electrical length corresponding to a difference (180°×n?90°) between the electrical length of the load modulation line and the electrical length of the frequency compensation line. Thus, the conventional Doherty amplifier has a problem of an increase in circuit size.
    Type: Application
    Filed: September 22, 2020
    Publication date: January 7, 2021
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Shuichi SAKATA, Shintaro SHINJO, Keigo NAKATANI, Koji YAMANAKA
  • Publication number: 20210005535
    Abstract: In a semiconductor device including gate fingers each having a linear shape extending from a feed line, and arranged in areas between drain electrodes and source electrodes, open stubs are connected directly to the feed line.
    Type: Application
    Filed: September 18, 2020
    Publication date: January 7, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yutaro YAMAGUCHI, Masatake HANGAI, Shintaro SHINJO, Koji YAMANAKA
  • Patent number: 10748860
    Abstract: Parallel inductors include a first metal wire (8a or 8b) for connecting a drain terminal (2) and a first metal pattern (7a or 7b), and a second metal wire (10a or 10b) for connecting the first metal pattern (7a or 7b) and a second metal pattern (9a or 9b). The second metal wires (10a and 10b) are each positioned between the corresponding first metal wire (8a or 8b) and a corresponding third metal wire (12a or 12b) for connecting the drain terminal (2) and a third metal pattern (11). The direction of current through the second metal wires (10a and 10b) is opposite to the direction of current through each of the first metal wire (8a or 8b) and the third metal wire (12a or 12b).
    Type: Grant
    Filed: July 1, 2016
    Date of Patent: August 18, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Keigo Nakatani, Yuji Komatsuzaki, Shintaro Shinjo, Koji Yamanaka, Shohei Imai
  • Publication number: 20200244227
    Abstract: Included is a compensation circuit (9) having one end connected to another end of a first output circuit (7) and another end of a second output circuit (8) and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Yuji KOMATSUZAKI, Shuichi SAKATA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20200136564
    Abstract: In a case where the power of a signal to be amplified is greater than or equal to a threshold value, a signal distributor (2) outputs one of signals to a carrier amplifier (6), outputs another signal, a phase of which is 90 degrees behind that of the one of the signals, to a peak amplifier (8), and adjusts a phase shift amount of a signal shifted by a phase shifter (7) depending on the frequency of the signal to be amplified. In a case where the power of the signal to be amplified is less than the threshold value, the signal distributor (2) outputs the one of the signals to the carrier amplifier (6) without outputting the other signal to the peak amplifier (8).
    Type: Application
    Filed: July 27, 2017
    Publication date: April 30, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Shuichi SAKATA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20200126896
    Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.
    Type: Application
    Filed: February 25, 2016
    Publication date: April 23, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hideharu YOSHIOKA, Akimichi HIROTA, Naofumi YONEDA, Hidenori ISHIBASHI, Shintaro SHINJO, Kiyoshi ISHIDA, Hideki MORISHIGE
  • Patent number: 10608594
    Abstract: In a Doherty amplifier including a carrier amplifier (6) and a peaking amplifier (8) connected in parallel with each other, a compensation circuit (9) for causing an impedance seen from an output end (9a) of the compensation circuit (9) toward the peaking amplifier (8) to be open within a used frequency range and compensating for frequency dependence of an impedance seen from an output of a combiner (10) toward the combiner (10) in a state in which the peaking amplifier (8) is not operating is arranged between the peaking amplifier (8) and the combiner (10). This achieves a wider bandwidth without making the circuit larger in size and more complicated.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: March 31, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuji Komatsuzaki, Shintaro Shinjo, Keigo Nakatani, Shohei Imai
  • Publication number: 20200091871
    Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.
    Type: Application
    Filed: January 24, 2017
    Publication date: March 19, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Shintaro SHINJO, Koji YAMANAKA
  • Patent number: 10574197
    Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.
    Type: Grant
    Filed: December 8, 2015
    Date of Patent: February 25, 2020
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki Yoshioka, Shintaro Shinjo, Koji Yamanaka
  • Patent number: 10523158
    Abstract: Provided is a load modulation amplifier including: a high frequency circuit board; and on the board, an input distribution circuit unit (DC) including: a distributor for dividing one input signal into two signals IS1 and IS2; and a phase delay circuit formed on a signal line for the divided IS2; a carrier amplifier (CA) including a first high frequency transistor for amplifying the IS1; a peak amplifier (PA) including a second high frequency transistor and for amplifying the IS2; and an output combination circuit (OCCU) including: a 90-degree phase delay circuit (90DC) formed on a signal line for output of the CA; a combiner for combining output of the 90DC and output of the PA; and an impedance conversion circuit for converting an output impedance of the combiner. The CA and the PA are directly connected to the OCCU without converting an output impedance.
    Type: Grant
    Filed: February 23, 2016
    Date of Patent: December 31, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shintaro Shinjo, Yuji Komatsuzaki, Keigo Nakatani, Koji Yamanaka
  • Patent number: 10340855
    Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.
    Type: Grant
    Filed: January 5, 2016
    Date of Patent: July 2, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yuji Komatsuzaki, Shintaro Shinjo, Keigo Nakatani, Takaaki Yoshioka
  • Publication number: 20190149097
    Abstract: In a Doherty amplifier including a carrier amplifier (6) and a peaking amplifier (8) connected in parallel with each other, a compensation circuit (9) for causing an impedance seen from an output end (9a) of the compensation circuit (9) toward the peaking amplifier (8) to be open within a used frequency range and compensating for frequency dependence of an impedance seen from an output of a combiner (10) toward the combiner (10) in a state in which the peaking amplifier (8) is not operating is arranged between the peaking amplifier (8) and the combiner (10). This achieves a wider bandwidth without making the circuit larger in size and more complicated.
    Type: Application
    Filed: May 18, 2016
    Publication date: May 16, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuji KOMATSUZAKI, Shintaro SHINJO, Keigo NAKATANI, Shohei IMAI
  • Publication number: 20190148315
    Abstract: Parallel inductors include a first metal wire (8a or 8b) for connecting a drain terminal (2) and a first metal pattern (7a or 7b), and a second metal wire (10a or 10b) for connecting the first metal pattern (7a or 7b) and a second metal pattern (9a or 9b). The second metal wires (10a and 10b) are each positioned between the corresponding first metal wire (8a or 8b) and a corresponding third metal wire (12a or 12b) for connecting the drain terminal (2) and a third metal pattern (11). The direction of current through the second metal wires (10a and 10b) is opposite to the direction of current through each of the first metal wire (8a or 8b) and the third metal wire (12a or 12b).
    Type: Application
    Filed: July 1, 2016
    Publication date: May 16, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Keigo NAKATANI, Yuji KOMATSUZAKI, Shintaro SHINJO, Koji YAMANAKA, Shohei IMAI
  • Publication number: 20190028062
    Abstract: Provided is a load modulation amplifier including: a high frequency circuit board; and on the board, an input distribution circuit unit (DC) including: a distributor for dividing one input signal into two signals IS1 and IS2; and a phase delay circuit formed on a signal line for the divided IS2; a carrier amplifier (CA) including a first high frequency transistor for amplifying the IS1; a peak amplifier (PA) including a second high frequency transistor and for amplifying the IS2; and an output combination circuit (OCCU) including: a 90-degree phase delay circuit (90DC) formed on a signal line for output of the CA; a combiner for combining output of the 90DC and output of the PA; and an impedance conversion circuit for converting an output impedance of the combiner. The CA and the PA are directly connected to the OCCU without converting an output impedance.
    Type: Application
    Filed: February 23, 2016
    Publication date: January 24, 2019
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shintaro SHINJO, Yuji KOMATSUZAKI, Keigo NAKATANI, Koji YAMANAKA
  • Publication number: 20180331664
    Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.
    Type: Application
    Filed: December 8, 2015
    Publication date: November 15, 2018
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takaaki YOSHIOKA, Shintaro SHINJO, Koji YAMANAKA
  • Publication number: 20180287566
    Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.
    Type: Application
    Filed: January 5, 2016
    Publication date: October 4, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yuji KOMATSUZAKI, Shintaro SHINJO, Keigo NAKATANI, Takaaki YOSHIOKA
  • Patent number: 7501897
    Abstract: A high-power amplifier changes matching conditions of an output matching circuit 5 connected between a final stage amplifying element 3 and an output terminal 8 in response to the output power of the amplifying element 3. Thus, the efficiency at low output power can be greatly improved without reducing the efficiency at the maximum output. Besides, since it is not necessary to load a DC-DC converter, an increase in size or cost can be prevented.
    Type: Grant
    Filed: July 14, 2004
    Date of Patent: March 10, 2009
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kazutomi Mori, Shintaro Shinjo, Masaharu Hattori, Kazunori Takahashi, Hiroaki Seki, Akira Ohta, Noriharu Suematsu