Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Abstract: An apparatus includes an envelope detecting unit for detecting an envelope of a signal to be amplified, and a variable power supply applies, to an output terminal of a carrier amplifier, a voltage increased with increase in the envelope detected by the envelope detecting unit. As a result, highly efficient operation can be implemented without including a phase shifter including a quarter wavelength line or the like.

Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.

Abstract: A conventional Doherty amplifier requires a load modulation line having an electrical length of 90 degrees, a frequency compensation line having an electrical length of an integral (n) multiple of 180 degrees, and an input phase adjustment line having an electrical length corresponding to a difference (180°×n?90°) between the electrical length of the load modulation line and the electrical length of the frequency compensation line. Thus, the conventional Doherty amplifier has a problem of an increase in circuit size.

Abstract: In a semiconductor device including gate fingers each having a linear shape extending from a feed line, and arranged in areas between drain electrodes and source electrodes, open stubs are connected directly to the feed line.

Abstract: Parallel inductors include a first metal wire (8a or 8b) for connecting a drain terminal (2) and a first metal pattern (7a or 7b), and a second metal wire (10a or 10b) for connecting the first metal pattern (7a or 7b) and a second metal pattern (9a or 9b). The second metal wires (10a and 10b) are each positioned between the corresponding first metal wire (8a or 8b) and a corresponding third metal wire (12a or 12b) for connecting the drain terminal (2) and a third metal pattern (11). The direction of current through the second metal wires (10a and 10b) is opposite to the direction of current through each of the first metal wire (8a or 8b) and the third metal wire (12a or 12b).

Abstract: Included is a compensation circuit (9) having one end connected to another end of a first output circuit (7) and another end of a second output circuit (8) and another end grounded, the compensation circuit having an electrical length of 90 degrees at a first operation frequency and an electrical length of 45 degrees at a second operation frequency which is half of the first operation frequency.

Abstract: In a case where the power of a signal to be amplified is greater than or equal to a threshold value, a signal distributor (2) outputs one of signals to a carrier amplifier (6), outputs another signal, a phase of which is 90 degrees behind that of the one of the signals, to a peak amplifier (8), and adjusts a phase shift amount of a signal shifted by a phase shifter (7) depending on the frequency of the signal to be amplified. In a case where the power of the signal to be amplified is less than the threshold value, the signal distributor (2) outputs the one of the signals to the carrier amplifier (6) without outputting the other signal to the peak amplifier (8).

Abstract: A semiconductor package includes a package main body. The package main body includes: a lead frame that includes first terminals and a die pad; two or more integrated circuit chips that are disposed on the die pad; one or more electrically conductive members that are disposed on the die pad; wires that connect the first terminals and the integrated circuit chips electrically; and a molded member that seals the lead frame, the integrated circuit chips, the electrically conductive member, and the wires. An upper surface, a bottom surface, and side surfaces of the package main body are formed by the molded member. The electrically conductive member is exposed through the upper surface of the package main body, and the die pad is exposed through the bottom surface of the package main body.

Abstract: In a Doherty amplifier including a carrier amplifier (6) and a peaking amplifier (8) connected in parallel with each other, a compensation circuit (9) for causing an impedance seen from an output end (9a) of the compensation circuit (9) toward the peaking amplifier (8) to be open within a used frequency range and compensating for frequency dependence of an impedance seen from an output of a combiner (10) toward the combiner (10) in a state in which the peaking amplifier (8) is not operating is arranged between the peaking amplifier (8) and the combiner (10). This achieves a wider bandwidth without making the circuit larger in size and more complicated.

Abstract: A Doherty amplifier includes a carrier amplifier, a peaking amplifier, and a phase compensation circuit. The carrier amplifier 11 includes a main amplifying element and a parasitic element, and the peaking amplifier includes an auxiliary amplifying element and a parasitic element. The phase compensation circuit has a negative electrical length that allows a total electrical length of a signal transmission path starting from an output source of the main amplifying element to a power combiner to become 180°×N?90° where N is a positive integer. In addition, a signal transmission path starting from an output source of the auxiliary amplifying element to the power combiner has an electrical length of 180°×M?180° where M is a positive integer.

Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.

Abstract: Provided is a load modulation amplifier including: a high frequency circuit board; and on the board, an input distribution circuit unit (DC) including: a distributor for dividing one input signal into two signals IS1 and IS2; and a phase delay circuit formed on a signal line for the divided IS2; a carrier amplifier (CA) including a first high frequency transistor for amplifying the IS1; a peak amplifier (PA) including a second high frequency transistor and for amplifying the IS2; and an output combination circuit (OCCU) including: a 90-degree phase delay circuit (90DC) formed on a signal line for output of the CA; a combiner for combining output of the 90DC and output of the PA; and an impedance conversion circuit for converting an output impedance of the combiner. The CA and the PA are directly connected to the OCCU without converting an output impedance.

Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.

Abstract: Parallel inductors include a first metal wire (8a or 8b) for connecting a drain terminal (2) and a first metal pattern (7a or 7b), and a second metal wire (10a or 10b) for connecting the first metal pattern (7a or 7b) and a second metal pattern (9a or 9b). The second metal wires (10a and 10b) are each positioned between the corresponding first metal wire (8a or 8b) and a corresponding third metal wire (12a or 12b) for connecting the drain terminal (2) and a third metal pattern (11). The direction of current through the second metal wires (10a and 10b) is opposite to the direction of current through each of the first metal wire (8a or 8b) and the third metal wire (12a or 12b).

Abstract: In a Doherty amplifier including a carrier amplifier (6) and a peaking amplifier (8) connected in parallel with each other, a compensation circuit (9) for causing an impedance seen from an output end (9a) of the compensation circuit (9) toward the peaking amplifier (8) to be open within a used frequency range and compensating for frequency dependence of an impedance seen from an output of a combiner (10) toward the combiner (10) in a state in which the peaking amplifier (8) is not operating is arranged between the peaking amplifier (8) and the combiner (10). This achieves a wider bandwidth without making the circuit larger in size and more complicated.

Abstract: Provided is a load modulation amplifier including: a high frequency circuit board; and on the board, an input distribution circuit unit (DC) including: a distributor for dividing one input signal into two signals IS1 and IS2; and a phase delay circuit formed on a signal line for the divided IS2; a carrier amplifier (CA) including a first high frequency transistor for amplifying the IS1; a peak amplifier (PA) including a second high frequency transistor and for amplifying the IS2; and an output combination circuit (OCCU) including: a 90-degree phase delay circuit (90DC) formed on a signal line for output of the CA; a combiner for combining output of the 90DC and output of the PA; and an impedance conversion circuit for converting an output impedance of the combiner. The CA and the PA are directly connected to the OCCU without converting an output impedance.

Abstract: A first stabilizing circuit (7a) is disposed between a first transistor (5a) and a first output matching circuit (10a) in a first stage. A second stabilizing circuit (7b) is disposed between a second transistor (5b) and a second output matching circuit (10b) in a second stage. The first stabilizing circuit (7a) includes a first band-pass filter and a first resistor (103a) connected in parallel. The first band-pass filter allows a signal of a frequency f1 lower than a central frequency fc of the operation frequencies as an amplifier to pass through. The second stabilizing circuit (7b) includes a second band-pass filter and a second resistor (103b) connected in parallel. The second band-pass filter allows a signal of a frequency f2 higher than the central frequency fc to pass through.

Abstract: A Wilkinson power divider includes: ?-type LPFs connected to an input terminal; a T-type HPF having one end connected to one of the ?-type LPFs and having another end connected to a carrier amplifier; another T-type HPF having one end connected to another one of the ?-type LPFs and having another end connected to a ?/4 line; and an isolation resistor connected to connection points.

Abstract: A high-power amplifier changes matching conditions of an output matching circuit 5 connected between a final stage amplifying element 3 and an output terminal 8 in response to the output power of the amplifying element 3. Thus, the efficiency at low output power can be greatly improved without reducing the efficiency at the maximum output. Besides, since it is not necessary to load a DC-DC converter, an increase in size or cost can be prevented.