Patents by Inventor Shintaro Yasuda

Shintaro Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20230411581
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: September 1, 2023
    Publication date: December 21, 2023
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 11777068
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: October 3, 2023
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20220384699
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 11444008
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: September 13, 2022
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20210057312
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: November 6, 2020
    Publication date: February 25, 2021
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 10861778
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: December 8, 2020
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Vehicle rear seat frame and vehicle
    Patent number: 10604042
    Abstract: An object is to provide a vehicle rear seat frame wherein impact caused by a housed seat toward the vehicle front is mitigated in a case of rear-end collision. Seat cushion side frames are disposed on both ends, with respect to the vehicle lateral direction, of a seat cushion frame, and include first weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state. Seat back side frames disposed on both ends, with respect to the vehicle lateral direction, of a seat back frame include second weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: March 31, 2020
    Assignee: MITSUBISHI JIDOSHA KOGYO KABUSHIKI KAISHA
    Inventors: Shintaro Yasuda, Kenji Hayashi, Mafuyu Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20190393139
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: September 5, 2019
    Publication date: December 26, 2019
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 10446475
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: October 15, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 10305009
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: May 28, 2019
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180218967
    Abstract: A semiconductor light emitting device includes semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: March 28, 2018
    Publication date: August 2, 2018
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • VEHICLE REAR SEAT FRAME AND VEHICLE
    Publication number: 20180162247
    Abstract: An object is to provide a vehicle rear seat frame wherein impact caused by a housed seat toward the vehicle front is mitigated in a case of rear-end collision. Seat cushion side frames are disposed on both ends, with respect to the vehicle lateral direction, of a seat cushion frame, and include first weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state. Seat back side frames disposed on both ends, with respect to the vehicle lateral direction, of a seat back frame include second weak portions having less strength than other portions in the vehicle longitudinal direction in a folded state.
    Type: Application
    Filed: December 5, 2017
    Publication date: June 14, 2018
    Applicant: Mitsubishi Jidosha Kogyo Kabushiki Kaisha
    Inventors: Shintaro Yasuda, Kenji Hayashi, Mafuyu Okada
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 9953901
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 13, 2017
    Date of Patent: April 24, 2018
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20180076371
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad. The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: November 20, 2017
    Publication date: March 15, 2018
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20170186930
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: March 13, 2017
    Publication date: June 29, 2017
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 9634212
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: December 8, 2014
    Date of Patent: April 25, 2017
    Assignee: ROHM CO., LTD.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20150091044
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: December 8, 2014
    Publication date: April 2, 2015
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8921874
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: December 17, 2013
    Date of Patent: December 30, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140103375
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: December 17, 2013
    Publication date: April 17, 2014
    Applicant: ROHM CO., LTD.
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
  • Semiconductor light emitting device and method for manufacturing the same
    Patent number: 8633506
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Grant
    Filed: March 11, 2009
    Date of Patent: January 21, 2014
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Kazuhiro Mireba, Shintaro Yasuda, Junichi Itai, Taisuke Okada