Patents by Inventor Shintaro Yasuda

Shintaro Yasuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting module and method for manufacturing the same
    Patent number: 8148745
    Abstract: A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first direction contained in the plane of the first die bonding pad. The second lead includes a wire bonding pad connected to the light source via a wire. The module also includes a case formed with a space elongated in the first direction for accommodating the light source. The first lead includes an extension extending from the first die bonding pad, and a mounting terminal connected to the extension. The extension extends in a second direction that is perpendicular to the first direction and contained in the plane of the first die bonding pad. The mounting terminal extends perpendicularly to the second direction. The extension overlaps the light source in the first direction.
    Type: Grant
    Filed: March 27, 2009
    Date of Patent: April 3, 2012
    Assignee: Rohm Co., Ltd.
    Inventors: Masahiko Kobayakawa, Shintaro Yasuda
  • SEMICONDUCTOR LIGHT EMITTING MODULE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090242927
    Abstract: A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first direction contained in the plane of the first die bonding pad. The second lead includes a wire bonding pad connected to the light source via a wire. The module also includes a case formed with a space elongated in the first direction for accommodating the light source. The first lead includes an extension extending from the first die bonding pad, and a mounting terminal connected to the extension. The extension extends in a second direction that is perpendicular to the first direction and contained in the plane of the first die bonding pad. The mounting terminal extends perpendicularly to the second direction. The extension overlaps the light source in the first direction.
    Type: Application
    Filed: March 27, 2009
    Publication date: October 1, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Masahiko KOBAYAKAWA, Shintaro YASUDA
  • SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20090230413
    Abstract: A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
    Type: Application
    Filed: March 11, 2009
    Publication date: September 17, 2009
    Applicant: ROHM CO., LTD.
    Inventors: Masahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA