Abstract: A flexible printed circuit (FPC) board having reinforcing pattern against bending is disclosed. The FPC board provides an RF interconnection extending from an RF electrode. Two ground electrodes are formed in respective sides of the RF electrode. The ground electrodes extend respective extended portions along the RF interconnection to protect the RF interconnection from breakage due to bending of the FPC board. The extended portion provides an end portion bent toward the RF interconnection to compensate for impedance mismatching of the RF interconnection.

Abstract: A flexible printed circuit (FPC) board having reinforcing pattern against bending is disclosed. The FPC board provides an RF interconnection extending from an RF electrode. Two ground electrodes are formed in respective sides of the RF electrode. The ground electrodes extend respective extended portions along the RF interconnection to protect the RF interconnection from breakage due to bending of the FPC board. The extended portion provides an end portion bent toward the RF interconnection to compensate for impedance mismatching of the RF interconnection.

Abstract: A flexible printed circuit (FPC) board having reinforcing pattern against bending is disclosed. The FPC board provides an RF interconnection extending from an RF electrode. Two ground electrodes are formed in respective sides of the RF electrode. The ground electrodes extend respective extended portions along the RF interconnection to protect the RF interconnection from breakage due to bending of the FPC board. The extended portion provides an end portion bent toward the RF interconnection to compensate for impedance mismatching of the RF interconnection.

Abstract: A flexible printed circuit board includes: a substrate having a first edge and a second edge; a first wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a second wiring pattern disposed on the substrate and having a lead connection portion at a side of the first edge of the substrate; a first solder pattern disposed on the lead connection portion of the first wiring pattern; and a second solder pattern disposed on the lead connection portion of the second wiring pattern and having a length longer than the first solder pattern.

Abstract: An optical pickup device includes an optical system unit, a circuit board to control the optical system unit, and send and receive signals, a housing to place the optical system unit and the circuit board, and a flexible printed circuit board to connect electrically with the circuit board, extend to an outside from the housing, and fold back an extended portion, an extended direction of which is changed, in which the flexible printed circuit board is folded back so as to be faced to a side surface of the housing positioned at an extended proximal portion of the flexible printed circuit board, and a dead space of an optical disc apparatus to be mounted with the optical pickup device can be effectively used without making the apparatus large and thick, taking an inner space widely.