Abstract: A front end module comprises a diplexer, a first duplexer, and a second duplexer. The first duplexer is connected to the diplexer through a first high frequency switch and separates transmission signals and reception signals of the N-CDMA from each other. The second duplexer is connected to the diplexer through a second high frequency switch and separates transmission signals and reception signals of the W-CDMA from each other. Each of the duplexers includes acoustic wave elements. A single multi-layer substrate for integration is used to integrate the components of the front end module. The diplexer is made up of a conductor layer located inside or on the surface of the multi-layer substrate.

Abstract: A front end module (2) comprises: a triplexer (11) for separating the AMPS band, the PCS band and the GPS band from one another; a duplexer (12) for separating transmission signals and reception signals in the AMPS band from each other; and a duplexer (13) for separating transmission signals and reception signals in the PCS band from each other. The duplexers (12, 13) each include an acoustic wave element that functions as a filter. A single multilayer substrate is used to integrate the triplexer (11) and the duplexers (12, 13). The triplexer (11) is made up of conductor layers located inside or on the surface of the multilayer substrate.

Abstract: A high frequency module comprises a layered substrate. Inside the layered substrate, a reception diplexer for processing reception signals and a transmission diplexer for processing transmission signals are provided. The reception diplexer and the transmission diplexer are located in two different regions inside the layered substrate. A conductor portion that is connected to the ground and that electromagnetically separates the reception diplexer and the transmission diplexer from each other is provided between the two regions inside the layered substrate. The conductor portion is formed by using a plurality of through holes.

Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered. The high-frequency module according to the present invention includes a main module including a first high-frequency circuit at least a part of which is constituted by a conductive pattern built in a multi-layered substrate and a sub-module including a second high-frequency circuit, and the sub-module is inserted into a cavity formed in the main module. According to the present invention, the main module including the first high-frequency circuit and the sub-module including the second high-frequency circuit are constituted as separate components and the main module and the sub-module are integrated by inserting the sub-module into the cavity formed in the main module. Therefore, it is possible to use only a main module and sub-module that have been inspected after manufacture and found to be non-defective.

Abstract: A front end module comprises a diplexer, a high frequency switch and a duplexer. The diplexer has a first port connected to an antenna, a second port for receiving and outputting GSM signals, and a third port for receiving and outputting W-CDMA signals. The high frequency switch is connected to the second port and separates GSM transmission signals and reception signals from each other. The duplexer is connected to the third port and separates W-CDMA transmission signals and reception signals from each other. The duplexer includes two acoustic wave elements. A single multi-layer substrate for integration is used to integrate the diplexer, the high frequency switch and the duplexer.

Abstract: A front end module comprises a diplexer, a first duplexer, and a second duplexer. The first duplexer is connected to the diplexer through a first high frequency switch and separates transmission signals and reception signals of the N-CDMA from each other. The second duplexer is connected to the diplexer through a second high frequency switch and separates transmission signals and reception signals of the W-CDMA from each other. Each of the duplexers includes acoustic wave elements. A single multi-layer substrate for integration is used to integrate the components of the front end module. The diplexer is made up of a conductor layer located inside or on the surface of the multi-layer substrate.

Abstract: It is an object of the present invention to provide a high-frequency module whose production yield as a complete module can be prevented from being lowered.

Abstract: A radio frequency signal output module having a power amplifier and an isolator element is provided in which a radio-frequency output stage can be largely reduced in size and thickness. The radio frequency signal output module comprises a dielectric multilayer substrate; a radio-frequency power amplifier circuit; an isolator element; an impedance matching circuit which is inserted and connected between the radio-frequency power amplifier circuit and the isolator element; and a feedback loop for controlling the gain of the radio-frequency power amplifier circuit. The radio-frequency power amplifier circuit, the isolator element, the impedance matching circuit, and the feedback loop are integrally mounted on the dielectric multilayer substrate, and the feedback loop is branched from the impedance matching circuit, and connected to the radio-frequency power amplifier circuit.

Abstract: An isolator device with a built-in power amplifier includes a single dielectric multi-layered substrate, a high frequency power amplifier circuit, an isolator element, and circuit elements provided to the dielectric multi-layered substrate. The high frequency power amplifier circuit and the isolator element are connected with each other through the circuit elements and united with the single dielectric multi-layered substrate.

Abstract: A radio frequency signal output module having a power amplifier and an isolator element is provided in which a radio-frequency output stage can be largely reduced in size and thickness. The radio frequency signal output module comprises a dielectric multilayer substrate; a radio-frequency power amplifier circuit; an isolator element; an impedance matching circuit which is inserted and connected between the radio-frequency power amplifier circuit and the isolator element; and a feedback loop for controlling the gain of the radio-frequency power amplifier circuit. The radio-frequency power amplifier circuit, the isolator element, the impedance matching circuit, and the feedback loop are integrally mounted on the dielectric multilayer substrate, and the feedback loop is branched from the impedance matching circuit, and connected to the radio-frequency power amplifier circuit.

Abstract: To provide a mobile communications device power amplifier module, mobile communications device terminal equipment and mobile communications device base station structured in such a manner that the mounting area of mounted parts on a mother substrate can be reduced. By the elements mounted on the multilayer substrate 56 or housed in it, the transmission voltage controlled oscillator 2B and the power amplifier 17 are structured and integrated on the same substrate.

Abstract: An isolator device with a built-in power amplifier includes a single dielectric multi-layered substrate, a high frequency power amplifier circuit, an isolator element, and circuit elements provided to the dielectric multi-layered substrate. The high frequency power amplifier circuit and the isolator element are connected with each other through the circuit elements and united with the single dielectric multi-layered substrate.

Abstract: A voltage controlled oscillator including a resonator which generates an oscillation signal, a frequency of which is in response to a control signal, and an amplifier which amplifies the oscillation signal. Also included is a frequency adjusting mechanism, as well as a voltage control sensitivity mechanism. In one example, the resonator includes an input terminal to which the control signal is applied, a variable capacitance diode and a main inductor. The oscillation frequency adjusting mechanism includes a first variable capacitor, arranged in parallel with the main inductor of the resonator. In addition, the voltage control sensitivity adjusting mechanism includes a second variable capacitor arranged between the input terminal and the amplifying mechanism, and also arranged between a hot terminal of the variable capacitance diode and a hot terminal of the main inductor.

Abstract: An object is to densify an internal conductor of a multilayer ceramic part to thereby reduce a line loss, improve operating properties such as Q value, and reduce a variation thereof. To this end, an internal conductor paste which is composed of conductor powder, preferably silver or copper powder and optionally, a glass frit is stacked with dielectric ceramic material layers and co-fired at or above the melting point of the conductor.

Abstract: A multilayer band pass filter includes a zero point forming capacitor formed by a plurality of capacitors connected in series between first and second extension electrodes, and intermediate capacitors connected between each pair of adjacent series capacitors and the open end of a core conductor. Therefore, zero points can be formed at the lower and upper limits of a given band. The capacity of these capacitors is adjustable via extension electrodes which extend outside the baked ceramic casing, thereby allowing adjustment to be made to the zero point.

Abstract: A tri-plate line is constructed from a resonance element formed by intervening dielectrics between one pair of ground conductors (6). The length of the line is adjusted to about 1/4 wave-length. Then, a bandpass filter is formed by combining a plurality of resonators (5) of which one end is grounded. Each of the resonators (5) is separated by separators (9) so that waveguide mode propagation in the tri-plate line is prevented from occurring. A plurality of the tri-plate lines are piled up. The electromagnetic coupling of the resonators in different layers with each other are conducted by means of coupling means (7) formed in the dielectric and the ground conductor. The resonators disposed at both ends are coupled with input/output terminals (1,2), respectively.