Abstract: An insulated electric wire includes a linear conductor and one or more of insulating layers formed on an outer peripheral surface of the conductor. In the insulated electric wire, at least one of the one or more of insulating layers has a plurality of pores, outer shells are disposed on peripheries of the pores, and each of the outer shells has a plurality of projections on an outer surface thereof.

Abstract: An insulated electric wire includes a linear conductor and one or more of insulating layers formed on an outer peripheral surface of the conductor. In the insulated electric wire, at least one of the one or more of insulating layers has a plurality of pores, outer shells are disposed on peripheries of the pores, and each of the outer shells has a plurality of projections on an outer surface thereof.

Abstract: The present invention relates to a chemically strengthened glass having a first principal surface and a second principal surface facing the first principal surface, at least a portion of the first principal surface being chemically strengthened, wherein the depth of a compressive stress layer in at least a portion of the first principal surface continuously changes. This chemically strengthened glass can be suitably used in an application in which chemical strengthening characteristics that differ among different regions in the same plane are desired in a chemically strengthened glass.

Abstract: An insulated electric wire includes a linear conductor and one or a plurality of insulating layers formed on an outer peripheral surface of the conductor. At least one of the one or plurality of insulating layers contains a plurality of pores, outer shells are disposed on peripheries of the pores, and the outer shells are derived from shells of hollow-forming particles having a core-shell structure. A varnish for forming an insulating layer contains a resin composition forming a matrix and hollow-forming particles having a core-shell structure and dispersed in the resin composition. In the varnish, cores of the hollow-forming particles contain a thermally decomposable resin as a main component, and shells of the hollow-forming particles contain a main component having a higher thermal decomposition temperature than the thermally decomposable resin.

Abstract: A glass sheet is a single glass sheet having a first surface and a second surface facing the first surface. The glass sheet has a curvature part curved in a first direction and a second direction orthogonal to the first direction. A radius of curvature in the first direction of the curvature part is 8,500 mm or less. At least a part of the first surface has been chemically strengthened in the curvature part. In the first direction within the chemically strengthened region in the curvature part, an Na amount in the first surface is smaller than the Na amount in the second surface.

Abstract: A transparent plate for a vehicle, provided with a first surface and a second surface, includes a light-shielding region and a light-transmitting region, in a planar view; and a light-shielding layer in the light-shielding region on the first surface side. A color of the light-shielding layer is a color other than black, and is a same or similar color to a color of an interior or an exterior of the vehicle or a same or similar color to a complementary color of the color of the interior or the exterior of the vehicle.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Abstract: A method of manufacturing tempered glass is provided that involves bending a glass plate into a desired shape by holding the glass plate that has been heated to a predetermined temperature between a lower mold ring and an upper mold. The method includes a press-molding step of press-molding the glass plate while having a buffer member interposed between the lower mold ring and the upper mold, wherein the glass plate comes into contact with the buffer member; and a cooling step of cooling the glass plate that has been press-molded in the press-molding step, wherein the glass plate is cooled on the lower mold ring without coming into contact with the buffer member.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Abstract: A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Abstract: An air-cooling/tempering apparatus and method, which can properly temper a glass sheet bent to have a complexly curved surface, without increasing the heating temperature of the glass sheet or increasing a wind pressure from air-blowing openings. A lower blowing member of the air-cooling/tempering apparatus includes a plurality of blade-shaped members arranged into a combtooth shape each having a front end face provided with a plurality of arranged air-blowing openings. Each blade-shaped member has a front end face with a concave curve so that a gap from the plurality of airblowing openings to the bent glass sheet becomes substantially uniform. The arrangement of air-blowing openings provided on the front end face of each blade-shaped member is turned with a predetermined angle and extends in one direction in each side portion in plan view.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a specific release agent.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device, including the following ingredients (A) to (E): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; (D) an inorganic filler; and (E) a silane coupling agent, in which a total content of the ingredient (C) and the ingredient (D) is from 69 to 94% by weight of the whole of the epoxy resin composition, and the ingredient (E) is contained in an amount satisfying the specific conditions.

Abstract: The present invention relates to an epoxy resin composition for an optical semiconductor device having an optical semiconductor element mounting region and having a reflector that surrounds at least a part of the region, the epoxy resin composition being an epoxy resin composition for forming the reflector, the epoxy resin composition including the following ingredients (A) to (D): (A) an epoxy resin; (B) a curing agent; (C) a white pigment; and (D) at least one antioxidant selected from the group consisting of hindered-phenol antioxidants, sulfide antioxidants and hindered-amine antioxidants.

Abstract: A phosphor layer is composed of a resin in which phosphor particles and light scattering particles are dispersed.

Abstract: The present invention relates to an epoxy resin composition for optical-semiconductor element encapsulation, including the following ingredients (A), (B) and (C): (A) an epoxy resin; (B) a curing agent including a phenol resin (b1) represented by the following general formula (1), and an acid anhydride (b2) in which R represents -phenyl- or -biphenyl-, and n is 0 or a positive integer; and (C) a curing accelerator, in which a ratio between the number of hydroxyl groups of the ingredient (b1) and the number of hydroxyl groups of the ingredient (b2), in the ingredient (B) is 99.99/0.01 to 50/50 in terms of b1/b2.

Abstract: The present invention relates to an epoxy resin composition for optical-semiconductor encapsulation which comprises the following ingredients (A) to (C): (A) an epoxy resin; (B) a curing agent; and (C) a naphthalocyanine colorant. The epoxy resin composition of the invention transmits visible rays and shields near infrared rays while retaining properties inherent in the epoxy resin.