Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].

Abstract: It is an object of the present invention to improve drawbacks in conventional technology and provide a fiber-reinforced composite material having both an excellent static strength property and impact resistance, and an epoxy resin composition for obtaining the fiber-reinforced composite material. More particularly, it is the object of the present invention to provide the epoxy resin composition that gives a cured material having a high elastic modulus, a high heat resistance, a high plastic deformation capacity and a high toughness. The epoxy resin composition containing following [A] to [D], a prepreg obtained by impregnating a fiber substrate with the epoxy resin composition, a fiber-reinforced composite material obtained by curing the prepreg and a tubular body thereof.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

Abstract: Provided are a carbon fiber reinforced composite material which exhibits excellent flame retardance, fast curing properties, heat resistance, and mechanical characteristics. Also provided are an epoxy resin composition suitable for use in producing said carbon fiber reinforced composite material as well as a prepreg and housing for electronic/electrical components. The epoxy resin composition is characterized by comprising: [A] an epoxy resin containing at least 50 mass % of a compound as represented by general formula (I), [B] an organic nitrogen compound based curing agent, [C] a phosphoric acid ester, and [D] a phosphazene compound. In general formula (I), R1, R2, and R3 are either a hydrogen atom or a methyl group, and n is an integer of 1 or higher.

Abstract: A method of producing an aromatic polyethersulfone (PES) having hydroxyphenyl end groups suitable as an alloying agent includes heating an aromatic polyester sulfone obtained beforehand by polymerization and a dihydric phenol compound and/or water and a basic compound in an aprotic polar solvent. According to this method, a PES having reactive hydroxyphenyl end groups, which can be suitably finely dispersed into a matrix resin when a thermoplastic resin or thermosetting resin and the PES are alloyed with each other, can be produced efficiently in a short time by an economical and simple method.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and an epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B], [C], [D], and [E]: [A] epoxy resin, [B] amine curing agent, [C] phosphorus compound, [D] curing accelerator, and [E] thermoplastic resin, wherein the resin composition has a phosphorus atom concentration of 0.2 to 15% by weight.

Abstract: An epoxy resin composition comprising an epoxy resin [A], an amine-based curing agent [B] and a block copolymer [C] as components, wherein the epoxy resin [A] contains [Aa] an epoxy resin having at least one structure selected from a condensed polycyclic structure, biphenyl structure and oxazolidone ring structure; [Ab] an epoxy resin selected from a polyfunctional amine type epoxy resin [Ab1] and a liquid bisphenol type epoxy resin [Ab2], and the block copolymer [C] is at least one block copolymer selected from the group consisting of S-B-M, B-M and M-B-M. The present invention provides an epoxy resin composition that can be cured to form a cured product excellent in heat resistance, elastic modulus and toughness.

Abstract: It is an object of the present invention to provide a fiber reinforced composite material combining good properties such as toughness and impact resistance and to provide an epoxy resin composition to obtain this. This object is achieved by the an epoxy resin composition comprising the following [A], [B], [C], and [D]: [A] a diglycidyl ether-type epoxy resin having a molecular weight of 1,500 or more; [B] an epoxy resin in which an SP value of a structural unit thereof is greater by 1.5 to 6.5 than an SP value of a structural unit of [A]; [C] a diglycidyl ether-type epoxy resin having a molecular weight of 500 to 1,200; and [D] an epoxy resin curing agent, in a ratio that satisfies the following formulas (1) to (4): 0.2?A/(A+B+C+E)?0.6;??(1), 0.2?B/(A+B+C+E)?0.6;??(2), 0.15?C/(A+B+C+E)?0.4; and??(3), 0?E/(A+B+C+E)?0.2,??(4) wherein A, B, and C represent weights of [A], [B], and [C], respectively, and E represents a weight of an epoxy resin other than [A], [B], and [C].

Abstract: This invention relates to: a molding material comprising a bundle of continuous reinforcing fibers (A), a polyarylene sulfide prepolymer (B) comprising at least 50% by weight of cyclic polyarylene sulfide and having the weight average molecular weight of less than 10,000 or polyarylene sulfide (B?) having the weight average molecular weight of 10,000 or greater and the degree of dispersion of 2.

Abstract: It is an object of the present invention to improve drawbacks in conventional technology and provide a fiber-reinforced composite material having both an excellent static strength property and impact resistance, and an epoxy resin composition for obtaining the fiber-reinforced composite material. More particularly, it is the object of the present invention to provide the epoxy resin composition that gives a cured material having a high elastic modulus, a high heat resistance, a high plastic deformation capacity and a high toughness. The epoxy resin composition containing following [A] to [D], a prepreg obtained by impregnating a fiber substrate with the epoxy resin composition, a fiber-reinforced composite material obtained by curing the prepreg and a tubular body thereof.

Abstract: This invention relates to: a molding material comprising a bundle of continuous reinforcing fibers (A), a polyarylene sulfide prepolymer (B) comprising at least 50% by weight of cyclic polyarylene sulfide and having the weight average molecular weight of less than 10,000 or polyarylene sulfide (B?) having the weight average molecular weight of 10,000 or greater and the degree of dispersion of 2.

Abstract: The present invention relates to an epoxy resin composition comprising the following [A], [A?], [B], and [C]: [A] a bisphenol-type epoxy resin having a glass transition temperature or melting point of 50° C. or higher; [A?] an epoxy resin which is in a liquid state at 25° C.; [B] an epoxy resin curing agent; and [C] at least one block copolymer selected from the group consisting of S-B-M, B-M, and M-B-M, wherein the blocks are linked to each other by a covalent bond or by an intermediate molecule bound to one of the blocks via one covalent bond formation and to the other block via another covalent bond formation; the block M is a methyl methacrylate homopolymer or a copolymer comprising at least 50% by weight of methyl methacrylate; the block B is incompatible with the block M and has a glass transition temperature of 20° C.

Abstract: It is an object of the present invention to provide an epoxy resin composition in which a ratio of the time between the beginning of injection and the vitrification of the epoxy resin composition to the time during which a state of liquid having such a viscosity that the epoxy resin composition can be injected is held after the beginning of injection is small, and a material in which a resin cured product has less-coloring and the appearance and the surface smoothness of the fiber-reinforced composite materials are excellent in order to enable to mold fiber-reinforced composite materials having high fiber volume fraction (Vf) and excellent mechanical properties or fiber-reinforced composite materials having a large size in a short time. The above problem can be achieved by an epoxy resin composition for a fiber-reinforced composite material comprising an epoxy resin, an acid anhydride curing agent and an organic phosphorus compound, wherein the organic phosphorus compound is contained in an amount of 0.

Abstract: The present invention provides a light-weight fiber-reinforced composite material that has excellent flame retardance and mechanical properties and never emits a halogen gas. The present invention also provides a prepreg and en epoxy resin composition suited to obtain the above described fiber-reinforced composite material. The present invention also provides an integrated molding which is produced using the above described fiber-reinforced composite material, thereby suitable for use in electric/electronic casings. The epoxy resin composition is such that it contains the following components [A], [B] and [C]: [A] epoxy resin, [B] amine curing agent, and [C] phosphorus compound, wherein the concentration of the component [C] is 0.2 to 15% by weight in terms of phosphorus atom concentration.

Abstract: Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.

Abstract: An activated sludge treatment process for waste water characterized in that, in the waste water treatment where waste water containing organic matter is introduced into an activated sludge reaction tank and the excess sludge formed in the reaction tank is introduced into a sludge digestion tank to effect the digestion of said excess sludge by intermittent aeration with air, a part of the digestion tank liquid is passed through a filtration apparatus having an ultrafiltration membrane, the filtrate passed therethrough is withdrawn outside the system, the remainder is circulated to the digestion tank to maintain the liquid volume of the digestion tank at a definite level, and when the amount of the reaction tank liquid introduced from the reaction tank into the digestion tank is taken as W.sub.1, the digestion tank liquid is returned in an amount of (0.2-0.8)W.sub.1 to the reaction tank, and thus the amount of excess sludge to be treated outside the system can be reduced or can be completely eliminated.