Patents by Inventor Shmuel Ravid

Shmuel Ravid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wireless communication technology, apparatuses, and methods
    Patent number: 11955732
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • INTEGRATED CIRCUIT AND SYSTEM WITH TRACKING
    Publication number: 20240088555
    Abstract: A beamforming IC operates in a transmit mode or a receive mode to respectively transmit and receive signals at different times. To that end, the beamforming IC has an element interface, a transmit branch configured to produce an output transmit signal through the element interface when in the transmit mode, and a receive branch configured to receive an input signal through the element interface when in the receive mode. The beamforming circuit also has a sampling circuit with an electrical coupling with the transmit branch. The sampling circuit is configured to sample the output transmit signal with the electrical coupling to produce a sample signal. The sampling circuit also is configured to direct the sample signal through the receive branch, which is configured to modify the phase of the sample signal to produce a modified sample signal. This modified sample signal can be used to manage the IC transmission.
    Type: Application
    Filed: May 5, 2023
    Publication date: March 14, 2024
    Inventors: Saeed Farsi, Vipul Jain, Zarion Jacobs, Jonathan P. Comeau, Shmuel Ravid, Hakan Coskun
  • Phased array architecture with distributed temperature compensation and integrated up/down conversion
    Patent number: 11652267
    Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: May 16, 2023
    Assignee: Anokiwave, Inc.
    Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20230145401
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 27, 2022
    Publication date: May 11, 2023
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20220384956
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: May 2, 2022
    Publication date: December 1, 2022
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asi, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Wireless communication technology, apparatuses, and methods
    Patent number: 11424539
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: August 23, 2022
    Assignee: Intel Corporation
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • PHASED ARRAY ARCHITECTURE WITH DISTRIBUTED TEMPERATURE COMPENSATION AND INTEGRATED UP/DOWN CONVERSION
    Publication number: 20210344099
    Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.
    Type: Application
    Filed: July 7, 2021
    Publication date: November 4, 2021
    Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
  • Spur mitigation in a heterodyne upconversion system
    Patent number: 11082079
    Abstract: Exemplary embodiments dynamically select the LO frequency and mixer mode (i.e., low-side LO injection or high-side LO injection) for upconversion based on the desired RF output frequency in order to mitigate the effects of spurious and LO leakage signals that could violate radiation emission limits, e.g., in the case where the IF signal frequency is smaller than the RF operating band. By dynamically switching the LO frequency and mixer mode as a function of the requested operating RF channel, low-level emissions and spurious signal compliance with restricted bands can be achieved.
    Type: Grant
    Filed: August 6, 2020
    Date of Patent: August 3, 2021
    Assignee: ANOKIWAVE, INC.
    Inventors: Robert Ian Gresham, Shmuel Ravid, Kristian N. Madsen, Tissana T. Kijsanayotin
  • Phased array architecture with distributed temperature compensation and integrated up/down conversion
    Patent number: 11063336
    Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.
    Type: Grant
    Filed: April 4, 2019
    Date of Patent: July 13, 2021
    Assignee: Anokiwave, Inc.
    Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
  • INTEGRATED CIRCUIT AND SYSTEM WITH TRACKING
    Publication number: 20210151876
    Abstract: A beamforming IC operates in a transmit mode or a receive mode to respectively transmit and receive signals at different times. To that end, the beamforming IC has an element interface, a transmit branch configured to produce an output transmit signal through the element interface when in the transmit mode, and a receive branch configured to receive an input signal through the element interface when in the receive mode. The beamforming circuit also has a sampling circuit with an electrical coupling with the transmit branch. The sampling circuit is configured to sample the output transmit signal with the electrical coupling to produce a sample signal. The sampling circuit also is configured to direct the sample signal through the receive branch, which is configured to modify the phase of the sample signal to produce a modified sample signal. This modified sample signal can be used to manage the IC transmission.
    Type: Application
    Filed: November 13, 2020
    Publication date: May 20, 2021
    Inventors: Saeed Farsi, Vipul Jain, Zarion Jacobs, Jonathan P. Comeau, Shmuel Ravid, Hakan Coskun
  • SPUR MITIGATION IN A HETERODYNE UPCONVERSION SYSTEM
    Publication number: 20210044316
    Abstract: Exemplary embodiments dynamically select the LO frequency and mixer mode (i.e., low-side LO injection or high-side LO injection) for upconversion based on the desired RF output frequency in order to mitigate the effects of spurious and LO leakage signals that could violate radiation emission limits, e.g., in the case where the IF signal frequency is smaller than the RF operating band. By dynamically switching the LO frequency and mixer mode as a function of the requested operating RF channel, low-level emissions and spurious signal compliance with restricted bands can be achieved.
    Type: Application
    Filed: August 6, 2020
    Publication date: February 11, 2021
    Inventors: Robert Ian Gresham, Shmuel Ravid, Kristian N. Madsen, Tissana T. Kijsanayotin
  • Method and apparatus for proximity radar in phased array communications
    Patent number: 10698079
    Abstract: Embodiments relate to systems methods and computer readable media to enable a wireless communication device are described. In one embodiment a wireless communication device is configured for phased array communications. The wireless communication device comprises radar circuitry to detect objects that scatter a transmit radiated signal from the wireless communication device. Control circuitry is used to adjust the transmit radiated power of the phased array communications based on information provided by the radar circuitry.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: June 30, 2020
    Assignee: Intel IP Corporation
    Inventors: Igal Kushnir, Shmuel Ravid, Raanan Sover
  • WIRELESS COMMUNICATION TECHNOLOGY, APPARATUSES, AND METHODS
    Publication number: 20200091608
    Abstract: Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.
    Type: Application
    Filed: December 20, 2017
    Publication date: March 19, 2020
    Inventors: Erkan Alpman, Arnaud Lucres Amadjikpe, Omer Asaf, Kameran Azadet, Rotem Banin, Miroslav Baryakh, Anat Bazov, Stefano Brenna, Bryan K. Casper, Anandaroop Chakrabarti, Gregory Chance, Debabani Choudhury, Emanuel Cohen, Claudio Da Silva, Sidharth Dalmia, Saeid Daneshgar Asl, Kaushik Dasgupta, Kunal Datta, Brandon Davis, Ofir Degani, Amr M. Fahim, Amit Freiman, Michael Genossar, Eran Gerson, Eyal Goldberger, Eshel Gordon, Meir Gordon, Josef Hagn, Shinwon Kang, Te Yu Kao, Noam Kogan, Mikko S. Komulainen, Igal Yehuda Kushnir, Saku Lahti, Mikko M. Lampinen, Naftali Landsberg, Wook Bong Lee, Run Levinger, Albert Molina, Resti Montoya Moreno, Tawfiq Musah, Nathan G. Narevsky, Hosein Nikopour, Oner Orhan, Georgios Palaskas, Stefano Pellerano, Ron Pongratz, Ashoke Ravi, Shmuel Ravid, Peter Andrew Sagazio, Eren Sasoglu, Lior Shakedd, Gadi Shor, Baljit Singh, Menashe Soffer, Ra'anan Sover, Shilpa Talwar, Nebil Tanzi, Moshe Teplitsky, Chintan S. Thakkar, Jayprakash Thakur, Avi Tsarfati, Yossi Tsfati, Marian Verhelst, Nir Weisman, Shuhei Yamada, Ana M. Yepes, Duncan Kitchin
  • Phased Array Architecture with Distributed Temperature Compensation and Integrated Up/Down Conversion
    Publication number: 20190312330
    Abstract: A conditioning integrated circuit (CDIC) chip can be used to aggregate signals to/from a number of beam forming integrated circuit (BFIC) chips, and signals to/from a number of CDIC chips can be aggregated by an interface integrated circuit (IFIC) chip. The CDIC chip includes temperature compensation circuitry to adjust the gain of the transmit and receive signals as a function of temperature based on inputs from a temperature sensor. The CDIC may include a plurality of beam forming channels each having a transmit circuit and a receive circuit, a common port coupled to the beam forming channels for selectively providing a common transmit signal to the beam forming channels and receiving a common receive signal from the beam forming channels, and a temperature compensation circuit configured to provide variable attenuation to the common transmit signal and the common receive signal based on a temperature sense signal.
    Type: Application
    Filed: April 4, 2019
    Publication date: October 10, 2019
    Inventors: Kristian N. Madsen, Robert J. McMorrow, David W. Corman, Nitin Jain, Robert Ian Gresham, Gaurav Menon, Vipul Jain, Jonathan P. Comeau, Shmuel Ravid
  • METHOD AND APPARATUS FOR PROXIMITY RADAR IN PHASED ARRAY COMMUNICATIONS
    Publication number: 20170290011
    Abstract: Embodiments relate to systems methods and computer readable media to enable a wireless communication device are described. In one embodiment a wireless communication device is configured for phased array communications. The wireless communication device comprises radar circuitry to detect objects that scatter a transmit radiated signal from the wireless communication device. Control circuitry is used to adjust the transmit radiated power of the phased array communications based on information provided by the radar circuitry.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 5, 2017
    Inventors: Igal KUSHNIR, Shmuel Ravid, Raanan Sover
  • CONFORMAL PHASED ARRAY ANTENNA WITH INTEGRATED TRANSCEIVER
    Publication number: 20140225805
    Abstract: A system according to one embodiment includes a plurality of antennas configured on a conformal material, the conformal material capable of conforming to a contour of a platform; and driver circuitry coupled to each of the plurality of antennas, wherein the driver circuitry comprises a plurality of transceivers, the plurality of transceivers configured to provide independently adjustable phase delay in the coupling to each of the plurality of antennas.
    Type: Application
    Filed: October 1, 2011
    Publication date: August 14, 2014
    Inventors: Helen K. Pan, Mark Ruberto, Bryce D. Horine, Shmuel Ravid
  • MM-WAVE PHASED ARRAY ANTENNA AND SYSTEM INTEGRATION ON SEMI-FLEX PACKAGING
    Publication number: 20120235881
    Abstract: Embodiments of wireless antenna array systems to achieve three-dimensional beam coverage are described herein. Disclosed is an integrated multiple phased antenna array on a flexible substrate with one RFIC. In this way the module can be molded onto the contour of a platform such as a notebook or a hub of the personal area network or local area network. The multiple phased array can be 3D bent in a compact size to fit into thin mobile platforms. Different array antennas or antennas radiate in different spherical directions with beam scanning capabilities while driven simultaneously by one RFIC chip.
    Type: Application
    Filed: March 15, 2012
    Publication date: September 20, 2012
    Inventors: Helen K. Pan, Mark Ruberto, Bryce Horine, Shmuel Ravid
  • Device, system and method of processing received wireless signals
    Patent number: 7565140
    Abstract: Embodiments of the present invention provide a method, apparatus and system of processing received wireless signals. The apparatus, according to some demonstrative embodiments of the invention, may include a network interface configured to convert the received wireless signals into output signals to be provided to a host processor, the network interface having a first mode of operation, in which the output signals have base-band values corresponding to base-band values of the received signals, and a second mode of operation, in which the output signals have values representing a data frame of the received signals. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: July 21, 2009
    Assignee: Intel Corporation
    Inventors: Shmuel Levy, Shmuel Ravid, Gal Basson
  • Device, system and method of processing received wireless signals
    Publication number: 20070155429
    Abstract: Embodiments of the present invention provide a method, apparatus and system of processing received wireless signals. The apparatus, according to some demonstrative embodiments of the invention, may include a network interface configured to convert the received wireless signals into output signals to be provided to a host processor, the network interface having a first mode of operation, in which the output signals have base-band values corresponding to base-band values of the received signals, and a second mode of operation, in which the output signals have values representing a data frame of the received signals. Other embodiments are described and claimed.
    Type: Application
    Filed: December 29, 2005
    Publication date: July 5, 2007
    Inventors: Shmuel Levy, Shmuel Ravid, Gal Basson
  • Multi-path dynamic routing algorithm
    Patent number: 7233574
    Abstract: Disclosed is a routing algorithm that uses a new concept of node metric system for optimizing the throughput of a network, in particular, a shared medium network. The measure of congestion of a path in the network is represented by a path metric which is computed by summing the node metrics of the intermediate nodes on the path. Factors used in computing node metrics include the following: 1. future traffic load from neighboring nodes to the node; and 2. future traffic load from the node to the neighboring nodes.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: June 19, 2007
    Assignee: Intel Corporation
    Inventors: Patrick A. Worfolk, Serge Plotkin, Shmuel Ravid-Rabinovitz, Itai Aaronson