Abstract: A crystal growth apparatus includes: a chamber including a gas inlet, a gas outlet, a welded portion, and a water-cooling portion configured to water-cool a portion at least including the welded portion; an exhaust pump connected to the gas outlet; a dew point instrument disposed between the gas outlet and the exhaust pump, the dew point instrument being configured to measure a dew point of gas passing through the gas outlet.

Abstract: A crucible having a tubular inner surface is prepared. A source material is arranged so as to make contact with the inner surface, and a seed crystal is arranged in the crucible so as to face the source material. A silicon carbide single crystal grows on the seed crystal by sublimation of the source material. The inner surface is formed of a first region surrounding the source material and a second region other than the first region. In the growing a silicon carbide single crystal, an amount of heat per unit area in the first region is smaller than an amount of heat per unit area in the second region.

Abstract: After growing a silicon carbide single crystal, silicon carbide single crystal is cooled. The step of growing silicon carbide single crystal includes a step of growing silicon carbide single crystal while maintaining the temperature of a second main surface of a base opposite to a first main surface to be lower than the temperature of a surface of silicon carbide single crystal facing a silicon carbide source material. In the step of cooling silicon carbide single crystal, silicon carbide single crystal is cooled while maintaining the temperature of second main surface of base to be not less than the temperature of surface of silicon carbide single crystal.

Abstract: A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.

Abstract: A sensor package has a semiconductor sensor chip, and a package body that has a semiconductor sensor chip mounting region on which the semiconductor sensor chip is mounted. The package body being a resin injection molded product. A groove is formed in a rear surface on an opposite side to a surface, on which the semiconductor sensor chip is mounted, so as to surround the semiconductor sensor chip mounting region. A coupling section is formed in the rear surface to couple a resin portion inside the groove and a resin portion outside the groove.

Abstract: The present invention provides an infrared sensor and an infrared sensor module having reduced noise, improved detection precision, and reduced manufacture cost. The infrared sensor includes a first substrate transmitting infrared light including at least one reduced-pressure and sealed cavity, at least one infrared sensing unit provided on the side of the first substrate, and at least one infrared sensing unit generating an output change. The infrared sensor includes a second substrate stacked on the first substrate with a recess, a reflection face capable of reflecting the infrared light, and at least one arithmetic circuit for amplifying or integrating an output, arranged in such a manner that the reflection face is sandwiched between the at least one sensing unit and the least one arithmetic circuit.

Abstract: The present invention provides an infrared sensor and an infrared sensor module having reduced noise, improved detection precision, and reduced manufacture cost. The infrared sensor includes a first substrate transmitting infrared light including at least one reduced-pressure and sealed cavity, at least one infrared sensing unit provided on the side of the first substrate, and at least one infrared sensing unit generating an output change. The infrared sensor includes a second substrate stacked on the first substrate with a recess, a reflection face capable of reflecting the infrared light, and at least one arithmetic circuit for amplifying or integrating an output, arranged in such a manner that the reflection face is sandwiched between the at least one sensing unit and the least one arithmetic circuit.

Abstract: An antenna device and non-contact transmitter/receiver device constituting at least the same includes a first conductor unit; a second conductor unit that is electrically connected to the first conductor unit; and a third conductor unit that is electrically connected to the first conductor unit and the second conductor unit. The first conductor is placed along a first virtual plane, the second conductor unit is placed along a second virtual plane, and the third conductor is placed along a third virtual plane. In this antenna, the plane that includes the first conductor unit, the plane that includes the second conductor unit, and the plane that includes the third conductor unit are perpendicular to one another.

Abstract: A flow sensor and a flow rate measuring method are disclosed, in which an error caused by dust attached to the flow sensor is accurately corrected taking advantage of the fact that the output characteristic of the flow sensor representing the relation between the temperature measured by a temperature measuring unit and the flow rate of the fluid undergoes a change with the dust attached. The flow sensor includes a thin-film bridge unit formed on a substrate, a heater arranged on the bridge unit, and a temperature measuring unit arranged on the bridge unit.

Abstract: A flow sensor and a flow rate measuring method are disclosed, in which an error caused by dust attached to the flow sensor is accurately corrected taking advantage of the fact that the output characteristic of the flow sensor representing the relation between the temperature measured by a temperature measuring unit and the flow rate of the fluid undergoes a change with the dust attached. A thin-film bridge unit is formed on the surface of a substrate and supported in the air above a space portion of the substrate. A heater for heat generation and the temperature measuring unit are arranged on the surface of the bridge unit. The relation (output characteristic) between the temperature measured by the temperature measuring unit in the initial state and the flow rate of the fluid to be measured is stored in the memory of an operation processing unit.

Abstract: A circuit substrate 8 mounting a flow sensor 6 thereto is stored into a concave portion 7 formed on the lower face of a mouse case 2. When a mouse 1 is moved, a flow of the air is relatively caused by inertia of the air, etc. The movement of the mouse 1 is detected by detecting the flow velocity of this air by the flow sensor 6.