Abstract: An active matrix substrate includes an insulating substrate 100 in which light-transmitting areas and a light-shielding area are formed. The active matrix substrate further includes: a light-shielding film 201 formed in the light-shielding area on the insulating substrate 100, with a transparent base material containing carbon particles, the light shielding film being colored with the carbon particles; an inorganic film 202 formed on the light-shielding film; light-transmitting films 204 formed in the light-transmitting areas on the insulating substrate, with a transparent base material containing transparent oxidized carbon particles; gate lines 111 provided on the inorganic film; a gate insulating film 101 provided on the gate lines; thin film transistors 300 provided in matrix on the gate insulating film; and data lines provided on the light-shielding film to intersect with the gate lines. The data lines are electrically connected with the thin film transistors 300.

Abstract: An active matrix substrate includes an insulating substrate (100); a surface coating film (110) that covers at least a part of a surface of the insulating substrate; an insulating light-transmitting film (204) provided on the insulating substrate including the surface coating film; gate lines; a gate insulating film; thin film transistors; data lines; and lead-out lines (115). In a peripheral portion of the insulating substrate, an area where the insulating light-transmitting film is not provided is formed. The lead-out line is provided so as to intersect with an outer circumference end of the insulating light-transmitting film, when viewed in a direction vertical to the insulating substrate. In the area where the insulating light-transmitting film is not provided, the surface coating film is also provided on a part in contact with the outer circumference end of the insulating light-transmitting film.

Abstract: This semiconductor device is provided with: a semiconductor film that comprises an oxide semiconductor, and includes a channel region; a first inorganic insulating film formed on the semiconductor film; a first organic insulating film formed on the first inorganic insulating film; and an inorganic film group. The inorganic film group has: a first electrode comprising an inorganic conductive film formed on the first organic insulating film; a second inorganic insulating film formed on the first electrode; and a second electrode that comprises an inorganic conductive film formed on the second inorganic insulating film, and is electrically connected to the semiconductor film via openings formed in such a manner as to penetrate the first inorganic insulating film, the first organic insulating film, the first electrode and the second inorganic insulating film. The first organic insulating film is disposed between the first inorganic insulating film and the inorganic film group.

Abstract: This semiconductor device is provided with: a semiconductor film that comprises an oxide semiconductor, and includes a channel region; a first inorganic insulating film formed on the semiconductor film; a first organic insulating film formed on the first inorganic insulating film; and an inorganic film group. The inorganic film group has: a first electrode comprising an inorganic conductive film formed on the first organic insulating film; a second inorganic insulating film formed on the first electrode; and a second electrode that comprises an inorganic conductive film formed on the second inorganic insulating film, and is electrically connected to the semiconductor film via openings formed in such a manner as to penetrate the first inorganic insulating film, the first organic insulating film, the first electrode and the second inorganic insulating film. The first organic insulating film is disposed between the first inorganic insulating film and the inorganic film group.

Abstract: The present invention suppresses electrochemical corrosion in a TFT between an oxide conductor and a source/drain wiring line containing aluminum. In this semiconductor device, a gate layer containing a gate line and a gate electrode is formed on a substrate, and a semiconductor layer made of an oxide semiconductor is formed so as to overlap the gate electrode of the gate layer, with a gate insulating film therebetween. A source electrode and a drain electrode are formed by spacing apart a source wiring layer on the semiconductor layer. The source wiring layer is configured by laminating first conductive layers made of Al and a second conductive layer constituted by a metal film made of a metal other than an amphoteric metal. The drain electrode and a pixel electrode are electrically connected to each other via a contact hole in protective layers formed on the source wiring layer.

Abstract: This semiconductor device is provided with: a semiconductor film made of an oxide semiconductor film and having a channel region; a first insulating film that is formed on the semiconductor film in a form that covers the channel region; and a first electrode that is electrically connected to the semiconductor film via an opening formed in a location that does not overlap with the channel region in the first insulating film, and has an overlapping portion that overlaps with at least the semiconductor film on the first insulating film.

Abstract: This semiconductor device is provided with: a semiconductor film that comprises an oxide semiconductor film, and has a channel region; a protective film that is formed on the semiconductor film in a form that covers the channel region; a first inorganic insulating film that is formed on the protective film in a form having an area that overlaps with the channel region; and an organic insulating film that comprises a resin film formed on the first inorganic insulating film, and has a first opening that exposes the first inorganic insulating film in the area that overlaps with the channel region.