Patents by Inventor Shogo Ogawa

Shogo Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Packing box for lead terminal type semiconductor product
    Patent number: 5477966
    Abstract: A packing device for semiconductor devices with lead terminals includes a packing box, partitions for separating a space in the packing box, and a cover. A conductive sponge used as a cushioned packing material is attached to the back surface of the cover. The semiconductor devices are placed in the packing box 3 with the lead terminals 2 facing upwardly. In this packed state, the conductive sponge is pressed against the lead terminals to collectively hold the semiconductor devices securely in the box. Thus, short-circuitting of the lead terminals is made to prevent gate of the semiconductor devices from breaking down as a result of electrostatic voltage.
    Type: Grant
    Filed: June 21, 1994
    Date of Patent: December 26, 1995
    Assignee: Fuji Electric Co., Ltd.
    Inventor: Shogo Ogawa