Abstract: A power module of the invention includes a power semiconductor element mounted on a circuit board, and an adapter connected to a front-surface main electrode of the element, wherein the adapter includes a main-electrode wiring member which is connected to the front-surface main electrode of the element; and wherein the main-electrode wiring member includes: an element connection portion connected to the front-surface main electrode of the element; a board connection portion which is placed outside the element connection portion and connected to the circuit board; and a connector connection portion which is placed outside the element connection portion and connected to an external electrode through a connector.

Abstract: In a method for manufacturing a semiconductor device, a plurality of first provisional fixing portions are supplied on a front surface of a substrate such that the plurality of first provisional fixing portions are spaced from each other and thus dispersed. A first solder layer processed into a plate to be a first soldering portion is disposed in contact with the plurality of first provisional fixing portions. A semiconductor chip is disposed on the first solder layer. In addition a conductive member in the form of a flat plate is disposed thereon via a second provisional fixing portion and a second solder layer. A reflow process is performed to solder the substrate, the semiconductor chip and the conductive member together.

Abstract: A semiconductor device includes a semiconductor element having a front electrode, an electrode plate having an area larger than the front electrode of the semiconductor element in a two-dimensional view and made of aluminum or aluminum alloy, and a metal member having a joint surface joined to the front electrode of the semiconductor element with solder, having an area smaller than the front electrode of the semiconductor element in a two-dimensional view, made of a metal different from the electrode plate, and fastened to the electrode plate to electrically connect the front electrode of the semiconductor element to the electrode plate.

Abstract: Downlink is achieved by point-to-multipoint communication. There is provided a radio communication system 1 that provides information to a mobile terminal 3 via a radio communication device 2 that performs radio communication with the mobile terminal 3. The mobile terminal 3 is capable of receiving first downlink information that has been transmitted by point-to-multipoint radio communication receivable by a plurality of the mobile terminals 3, and capable of receiving second downlink information that has been transmitted by point-to-point communication. The mobile terminal 3 is capable of transmitting uplink information by point-to-point radio communication. The first downlink information and the second downlink information are formed such that information to be used in the mobile terminal 3 is obtained when the mobile terminal 3 performs information processing by using both the first downlink information and the second downlink information.

Abstract: In a power semiconductor device, a front-surface electrode of a power semiconductor element is formed in such a manner that, on a first Cu layer consisting mainly of Cu, formed by non-electrolytic plating and having a Vickers hardness of 200 to 350 Hv, a second Cu layer consisting mainly of Cu, formed by non-electrolytic plating and having a Vickers hardness of 70 to 150 Hv and thus being softer than the first Cu layer, is laminated. The second Cu layer and a wire made of Cu are wire-bonded together.

Abstract: An electrode terminal includes: a first drawn-out part to be bonded to a main electrode; and a second drawn-out part that is formed of a plate member in a continuous fashion from one end portion to be positioned opposite to the main electrode with a gap therebetween until another end portion to be connected to an external circuit, so that a portion in the first drawn-out part that is adjacent to a portion therein to be bonded to the main electrode, is bonded to an opposing surface to the main electrode in said one end portion; wherein the first drawn-out part is formed so that the portion to be bonded to the main electrode is away from the opposing surface; and wherein an opening portion corresponding to the main electrode is formed in the second drawn-out part.

Abstract: A power module of the invention includes a power semiconductor element mounted on a circuit board, and an adapter connected to a front-surface main electrode of the element, wherein the adapter includes a main-electrode wiring member which is connected to the front-surface main electrode of the element; and wherein the main-electrode wiring member includes: an element connection portion connected to the front-surface main electrode of the element; a board connection portion which is placed outside the element connection portion and connected to the circuit board; and a connector connection portion which is placed outside the element connection portion and connected to an external electrode through a connector.

Abstract: A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

Abstract: A power module is fabricated, employing a clad metal that is formed by pressure-laminating aluminum and copper, in such a manner that the aluminum layer of the clad metal is bonded such as by ultrasonic bonding to the surface electrode of the power semiconductor chip and a wire is bonded to the copper layer thereof to establish electrical circuit. The clad metal is thermally treated in advance at a temperature higher than the operating temperature of the power semiconductor chip to sufficiently form intermetallic compounds at the interface between the aluminum layer and the copper layer for the intermetallic compounds so as not to grow in thickness after the bonding processes.

Abstract: A print sheet creation method, including a first transfer step of forming a laminated film by transferring a first toner layer including achromatic toner and a second toner layer including chromatic toner and formed on the first toner layer to a first transfer target medium, a second transfer step of transferring the formed laminated film to a second transfer target medium from the first transfer target medium such that the first toner layer is an uppermost layer, a first fixing step of fixing the laminated film transferred to the second transfer target medium to the second transfer target medium, and a third transfer step of transferring a third toner layer which includes achromatic toner and is thicker than the first toner layer to the laminated film fixed to the second transfer target medium and having the first toner layer as the uppermost layer.

Abstract: An electrophotographic image forming apparatus including an absolute humidity derivation section which derives absolute humidity inside the apparatus, and a control section which, when the absolute humidity inside the apparatus derived by the absolute humidity derivation section is smaller than a predetermined first threshold value, sets a dither pattern density based on an original image to be smaller compared to when the absolute humidity inside the apparatus is larger than the predetermined first threshold value, and forms a latent image on a photosensitive drum.

Abstract: An electrode terminal includes: a first drawn-out part to be bonded to a main electrode; and a second drawn-out part that is formed of a plate member in a continuous fashion from one end portion to be positioned opposite to the main electrode with a gap therebetween until another end portion to be connected to an external circuit, so that a portion in the first drawn-out part that is adjacent to a portion therein to be bonded to the main electrode, is bonded to an opposing surface to the main electrode in said one end portion; wherein the first drawn-out part is formed so that the portion to be bonded to the main electrode is away from the opposing surface; and wherein an opening portion corresponding to the main electrode is formed in the second drawn-out part.

Abstract: The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray.

Abstract: The present invention has a tray corresponding to a heat sink, a circuit part is accommodated in an accommodating part of the tray, and the circuit part is potting-sealed with a sealing resin such that external electrodes are exposed. The sealing resin covers and seals a top part of the tray.

Abstract: Downlink is achieved by point-to-multipoint communication. There is provided a radio communication system 1 that provides information to a mobile terminal 3 via a radio communication device 2 that performs radio communication with the mobile terminal 3. The mobile terminal 3 is capable of receiving first downlink information that has been transmitted by point-to-multipoint radio communication receivable by a plurality of the mobile terminals 3, and capable of receiving second downlink information that has been transmitted by point-to-point communication. The mobile terminal 3 is capable of transmitting uplink information by point-to-point radio communication. The first downlink information and the second downlink information are formed such that information to be used in the mobile terminal 3 is obtained when the mobile terminal 3 performs information processing by using both the first downlink information and the second downlink information.