Abstract: Provided are a solid-state imaging device and an electronic device in which the influence of dark current is reduced. The solid-state imaging device includes a plurality of first pixel units arranged in a matrix, each first pixel unit having one pixel and one on-chip lens, at least one second pixel unit having two pixels and one on-chip lens provided across the two pixels, a pixel separation layer, and at least one contact that exists within a region of the second pixel unit or is provided under the pixel separation layer adjacent to the region of the second pixel unit, and connects the pixel separation layer to a reference potential wiring, in which the second pixel units are arranged at predetermined intervals at least in a row extending in a first direction of the matrix of the first pixel units.

Abstract: The present technology relates to a solid-state imaging device and an electronic apparatus capable of improving the accuracy of phase difference detection while suppressing degradation of a picked-up image. There is provided a solid-state imaging device including: a pixel array unit, a plurality of pixels being two-dimensionally arranged in the pixel array unit, a plurality of photoelectric conversion devices being formed with respect to one on-chip lens in each of the plurality of pixels, a part of at least one of an inter-pixel separation unit formed between the plurality of pixels and an inter-pixel light blocking unit formed between the plurality of pixels protruding toward a center of the corresponding pixel in a projecting shape to form a projection portion. The present technology is applicable to, for example, a CMOS image sensor including a pixel for detecting the phase difference.

Abstract: The present technology relates to a solid-state imaging device, a driving method therefor, and an electronic apparatus capable of acquiring a signal to detect phase difference and a signal to generate a high dynamic range image at the same time. The solid-state imaging device includes a pixel array unit in which a plurality of pixels that receives light of a same color is arranged under one on-chip lens. The plurality of pixels uses at least one pixel transistor in a sharing manner, some pixels out of the plurality of pixels are set to have a first exposure time, and other pixels are set to have a second exposure time shorter than the first exposure time. The present technology can be applied to, for example, a solid-state imaging device or the like.

Abstract: A honeycomb structured body includes a plurality of pillar-shaped honeycomb fired bodies and adhesive layers. The plurality of pillar-shaped honeycomb fired bodies each include cell walls provided along a longitudinal direction of the plurality of pillar-shaped honeycomb fired bodies to define cells. Each of the cells has a first end and a second end opposite to the first end along the longitudinal direction. Either the first end or the second end is sealed. The adhesive layers are provided between the plurality of pillar-shaped honeycomb fired bodies to bond the plurality of pillar-shaped honeycomb fired bodies. The adhesive layers include alumina fibers and inorganic balloons. The alumina fibers have an average length of about 25 ?m to about 100 ?m. The inorganic balloons have an average particle size of about 150 ?m to about 250 ?m.

Abstract: A honeycomb structured body includes a plurality of silicon carbide-based honeycomb fired bodies and adhesive layers. The plurality of silicon carbide-based honeycomb fired bodies each include silicon carbide particles and cell walls. The silicon carbide particles have a surface coated with a silicon-containing oxide layer. The cell walls are provided along a longitudinal direction of the plurality of silicon carbide-based honeycomb fired bodies to define cells. Each of the cells has a first end and a second end opposite to the first end along the longitudinal direction. Either the first end or the second end is sealed. The adhesive layers are provided between the plurality of silicon carbide-based honeycomb fired bodies to bond the plurality of silicon carbide-based honeycomb fired bodies. The adhesive layers include alumina fibers and inorganic balloons.