Abstract: A method of making a semiconductor film on a substrate having a non-flat surface, by placing the substrate in a reaction chamber including at least a pair of discharge electrodes, an inlet of a reaction gas for producing a desired semiconductor film, and an outlet for reduced pressure, and performing a discharge in the presence of said reacrion gas for producing said semiconductor film, while arranging said non-flat surface of said substrate outside a plasma region formed between said discharge electrodes and further locating said non-flat surface substantially in a vertical direction with respect to electrode surfaces of said discharge electrodes, thereby semiconductor film being directly and uniformly deposited on said non-flat surface of said substrate, which is of worth in the production of, e.g., roofing tile-shaped photovoltaic devices.

Abstract: A semiconductor optical logical device comprises two light-emitting elements (2a, 2b) formed on one main surface of a transparent substrate (1), and two light sensitive elements (3a, 3b) formed on the other main surface faced to the light emitting elements (2a, 2b), respectively. The two light sensitive elements (3a, 3b) are comprised of amorphous semiconductor and are electrically connected in series. On the other hand, the light-emitting elements (2a, 2b) are driven responsive to individual input signals, respectively. If and when two input signals are applied simultaneously, the two light-emitting elements (2a, 2b) emit light simultaneously, so that an output is obtained from the two light sensitive elements connected in series. If and when only one input signal is applied, no output is obtained. Thus, an optical logical product circuit is provided.

Abstract: A light sensitive apparatus includes a light sensitive body and at least two leads electrically connected thereto so that the light sensitive body can be mechanically supported by the leads. The light sensitive body includes a light transmissible substrate, a transparent electrode formed on the substrate, a thin film of non-single crystal semiconductor layer deposited on the transparent electrode, a first electrode disposed on the non-single crystal semiconductor, and the second electrode disposed on an exposed portion of the transparent electrode. The first lead is connected to the first electrode and the second lead is connected to the second electrode.

Abstract: An infrared ray detector comprising an infrared ray detecting body, a pair of opposing portions, a bimorph vibrator connected to the pair of opposing portions for intermitting infrared rays incident upon the detector, and a housing containing these elements, the housing being provided with an opening for incidence of infrared rays. The pair of opposing portions comprise infrared ray transmitting portions and infrared ray non-transmitting portions. The infrared ray transmitting portions in one of opposing portions is periodically overlapped by the bimorph vibrator with the infrared ray transmitting portions or infrared ray non-transmitting portions in the other opposing portion, so that incident infrared rays are intermitted.

Abstract: A pyroelectric pellet made of a Z cut plane of lithium tantalate, for example, is fixed onto an electrically conductive supporting base made of copper, for example, by means of an adhesive agent layer. One embodiment of the adhesive agent layer interposed between the pyroelectric pellet and the electrically conductive supporting base comprises a mixture of an electrically conductive adhesive agent, such as a silver paste, admixed with heat insulating grains made of glass, ceramic, or the like, whereby thermal dissipation from the pyroelectric pellet to the electrically conductive supporting base is decreased. Another embodiment of the adhesive agent layer comprises an electrically conductive adhesive agent layer in which is embedded a thin sheet made of synthetic resin having apertures. The electrically conductive adhesive agent extends through the apertures of the sheet so as to fix the pyroelectric pellet to the electrically conductive supporting base.