Abstract: A suction head sucks up conductive balls to its suction holes, and mounts them on pads of said workpiece. That is, the suction head is lowered so as to land the conductive balls onto the pads, and then is raised, and a positive pressure is applied in a space defined in the suction head and communicated with the suction holes and thereafter, the positive pressure is released so as to effect the atmospheric pressure in the space. As a result, the conductive balls are smoothly and surely separated from the suction holes and mounted onto the pads of the workpiece. Thereby it is possible to rapidly mount the conductive balls sucked at the lower surface of the suction head onto the pads of the workpiece.

Abstract: A suction head has a plurality of suction units. The respective suction units have spaces each connected with a vacuum pump through a first valve. A sensor observes works on a substrate to inspect whether or not a bad mark is marked on the works. The spaces are separated from one another so that only the spaces corresponding to works of good quality with no bad mark are vacuum-evacuated so as to vacuum-suck conductive balls, while preventing the space corresponding to defective work or works with the bad mark from being vacuum-evacuated by closing a first valve so as to cancel the mounting of the conductive balls.

Abstract: Nickel films 22, 25 are formed on copper pads 21, 24 on a substrate 11, and gold layers 23, 26 are further formed on the nickel films 22, 25. To suppress formation of compound of gold and tin which spoils reliability of soldering, formation of gold layers 23, 26 on the nickel films 22, 25 is effected by very thin substitutional plating method. As a result, a solder bump 17 is formed favorably. Besides, an nickel oxide film 32 formed on the surface of the gold layer 23 is removed by plasma etching. As a result, bonding of wire 15 is also excellent.

Abstract: An improved structure of an electronic part with solder bumps is provided. The electronic part includes, for example, an IC chip and a board. The solder bumps are disposed on the bottom surface of the board and have a melting point greater than a thermal deformation temperature of the board. With this arrangement, if the curved board is bonded to a substrate in a soldering process, the solder bumps are solidified at a higher temperature than the thermal deformation temperature of the board during a cooling process, thereby preventing the curved board which has been straightened once above the thermal deformation temperature from being returned to its original shape. Several modifications are disclosed.

Abstract: An apparatus for mounting electrically conductive balls includes a mounting head which has an attracting tool with a number of attracting holes in its lower surface and attracts electrically conductive balls through a vacuum. The attracting tool is resiliently supported by the mounting head through springs. A flux is stored in a container at a predetermined depth. The electrically conductive balls attracted to the attracting tool project from its lower surface by a length larger than the depth of the flux. When the attracting tool is lowered, the electrically conductive balls contact a bottom surface of the container in a resilient manner due to spring tension of the springs. Then, by raising the attracting tool, the flux adheres to lower surfaces of the electrically conductive balls. With the flux kept at a proper depth, it can be made adhere in appropriate amount to all the electrically conductive balls at one time.

Abstract: It is intended to provide method for bonding a bump formed on an electronic component to a circuit pattern on a substrate, the method being capable of preventing defective connection due to breakage of the conductive adhesives. The method interposes the conductive adhesives between the bump and the circuit pattern, injects the insulating adhesives between the electronic component and the substrate while the temperature is raised to a temperature for curing the conductive adhesives, and lowered to the room temperature, and cures the insulating adhesives, whereby the electronic component is firmly attached to the substrate still at a high temperature and the substrate subsequently cooled to the room temperature cannot be substantially deformed.

Abstract: An electronic device includes a substrate, a chip attached thereon, and a molded body formed on the substrate for sealing the chip on the substrate. The electronic device further includes bumps formed at the underside of the substrate for connection to electrodes of a printed board. In an electronic device mounting method, a first correlation between a magnitude of warp of the electronic device and a heating temperature of the electronic device is derived. The warp is caused by a difference in thermal expansion coefficient between the molded body and the substrate. In the method, a second correlation between the magnitude of warp of the electronic device and a failure rate of coupling between the bumps and the electrodes is further derived. The method further derives, based on the first and second correlations, a heating temperature which causes no coupling failure between the bumps and the electrodes.

Abstract: An absorber head picks up a plurality of soldering balls from a container, and is shifted horizontally toward a substrate. In the midway of this shift movement, the absorber head is stopped just above a flux storage and then lowered to soak the soldering ball in the flux stored in the flux storage, thereby applying each soldering ball with an adequate amount of flux. Thereafter, the absorber head is again shifted horizontally until it reaches the substrate. Then, the absorber head lowers the soldering ball applied with flux, so that each soldering ball is mounted on a corresponding electrode provided on the substrate. If any soldering balls are left in the flux storage due to failure of the pickup operation by the absorber head, such soldering balls are surely collected in a groove by wiping movement of a squeegee which is associated with the flux storage.

Abstract: A connector 1 has a connector main body 2, and a plurality of leads 3--3 protruding forward from a front surface of the connector main body 2. Each lead 3 is formed with an edge portion 3a. A plurality of terminals 6--6 are formed on an end of a printed circuit board 5. Each terminal 6 is formed with a slit 7 extending in a longitudinal direction thereof. The slit 7 is engageable with the edge portion 3a of its corresponding lead 3. A precoat solder portion 8 is formed on each terminal 6. The edge portion 3a is coupled with its corresponding slit 7. And, the leads 3--3 are soldered onto their corresponding terminals 6--6 by melting the precoat solder portion 8, thereby firmly mounting the connector 2 on the end of the printed circuit board 5 without causing the dislocation of leads in a lateral direction with respect to their corresponding terminals.

Abstract: An absorber head 10 picks up a plurality of soldering balls 1 from a container 2, and is shifted horizontally toward a substrate 31. In the midway of this shift movement, the absorber head 10 is stopped just above a flux storage 32 and then lowered to soak the soldering ball 1 in the flux 34 stored in the flux storage 32, thereby applying each soldering ball 1 with an adequate amount of flux. Thereafter, the absorber head 10 is again shifted horizontally until it reaches the substrate 31. Then, the absorber head 10 lowers the soldering ball 1 applied with flux, so that each soldering ball 1 is mounted on a corresponding electrode 31a provided on the substrate 31. If any soldering balls 1 are left in the flux storage 32 due to failure of the pickup operation by the absorber head 10, such soldering balls 1 are surely collected in a groove 36 by a wiping movement of a squeegee 37 which is associated with the flux storage 32.

Abstract: A lead 20 protrudes from a main body 19a of a connector 18. A connector electrode 13 extends along a surface 10a of a printed circuit board 10. A solder paste 26, applied onto the connector electrode 13, is offset a predetermined distance inward from the edge of the printed circuit board 10. The lead 20 is shifted along the surface of connector electrode 13 inwardly from the edge of the printed circuit board 10 until a distal end 20a of the lead 20 is brought into contact with the solder paste 26. Then, the solder paste 26 is melted under the condition where the distal end 20a is brought into contact with the solder paste 26, thereby soldering the connector 18 on the printed circuit board 10.

Abstract: A suction head is introduced into a ball reservoir holding conductive balls, such as solder balls, and a plurality of suction holes formed in a suction surface of the suction head, hold the conductive balls by suction, respectively. Then, the suction head is moved into a position above a workpiece placed in position, and the suction is released from the conductive balls held on the suction head, thereby placing these conductive balls onto the workpiece. The suction head is vibrated or moved within the ball reservoir so that each of the suction holes can positively hold one conductive ball, thus preventing extra conductive balls from sticking to the suction head.

Abstract: A soldering ball mounting apparatus comprises a workpiece positioning mechanism "A" for positioning a workpiece 2 at a predetermined position. The workpiece 2 has an upper face formed with a plurality of electrodes 2a on which soldering balls 3 are mounted. A template 4, provided with a plurality of through holes 4a corresponding to the electrodes 2a in a one-to-one relationship, is supportable in such a manner that their through holes 4a are positioned just above the corresponding electrodes 2a of the workpiece 2. A soldering ball container 12 is provided on the template 4 for accommodating soldering balls 3 therein. The soldering ball container 12 has an open bottom allowing the soldering balls 3 to fall below the template 4 via the through holes 4a. A pair of X and Y motors shifts the soldering ball container 12 along the upper surface of the template 4 disposed in a horizontal direction.

Abstract: A connector 1 is provided with first leads 3--3 protruding forward from a front surface of a connector main body 2 so as to constitute a longer lead row, and second leads 4--4 shorter than the first leads 3--3 and protruding forward from the front surface of the connector main body 2 so as to constitute a shorter lead row. The longer lead row is parallel to and spaced in a vertical direction from the shorter lead row. The connector 1 is held with an installation head 6. The connector 1 is horizontally transported until the protruding distal ends of the first leads 3--3 are positioned just above an end (i.e. terminals 14--14) of a printed circuit board 11 while the protruding distal ends of the second leads 4--4 are offset from the end (i.e. terminals 15--15) of the printed circuit board 11.

Abstract: The invention relates to a method for forming bump electrodes on an electronic part such as a chip or a substrate. Conventional methods for forming bump electrode had a factor causing high cost, but with the invention, instead of solder balls, low cost solder wires are used, that is, solder wires are cut in a predetermined length, the cut solder wires are vacuum-attracted to the lower face of a pick up head and transferred onto a chip, then the solder pieces transferred are heated to melt, then cooled to solidify and results in forming bump electrodes of hemisphere shape.

Abstract: A method of mounting an electronic part with bumps on a circuit board is disclosed which enables bumps to be bonded to electrodes of the circuit board with certainty and which enables the judgement of the quality of bonding with precision. By making an area of the electrodes of the circuit board larger than those of the electrodes of the electronic part, the bumps heated and molten in the reflow soldering are spread over the electrodes of the circuit board to make its vertical cross-sectional configuration in a trapezoidal form. Therefore, the height dispersion of the bumps and the curvature of the circuit board are effectively absorbed whereby all the bumps can be bonded to the electrodes of the circuit board. Further, by measuring the planar area of the bumps, the judgement of the quality of bonding can be made with precision.