Patents by Inventor Shosuke Endoh

Shosuke Endoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040058070
    Abstract: A coating method for a internal member having holes in a vacuum processing apparatus is provided.
    Type: Application
    Filed: September 17, 2003
    Publication date: March 25, 2004
    Inventors: Jun Takeuchi, Masaaki Kishida, Tadakazu Matsunaga, Shosuke Endoh
  • Patent number: 5961361
    Abstract: A method manufactures an electrode plate for a plasma processing device in which a semiconductor wafer is processed to form a highly integrated circuit. The method includes a curing step of heat-curing a liquid thermosetting resin to prepare a resin forming material one or two backing steps of carbonizing the heat-cured resin forming material by heating under a non-oxidizing atmosphere to prepare a baking material composed of glass-like carbon and a polishing step of polishing one face of the baking material, which is exposed to plasma, to a depth of 20 .mu.m to 1.25 mm.
    Type: Grant
    Filed: September 22, 1997
    Date of Patent: October 5, 1999
    Assignees: Tokyo Electron Limited, Tokai Carbon Co., Ltd
    Inventors: Shosuke Endoh, Masaaki Mitsuno