Patents by Inventor Shotaro Masuda

Shotaro Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11185782
    Abstract: The game system comprises: a first selection unit that performs a first selection in which a game character is selected; a strengthening unit that raises the skill level of the game character on condition that the game character selected in the first selection is already possessed by the user; an effect-enabling unit that enables the game character to be changed in appearance on condition that the game character selected in the first selection is an appearance changing character; an effect applying unit that changes the appearance of the game character that is enabled to be changed in appearance; and a second selection unit that performs a second selection in which an appearance changing ticket applicable to any game character possessed by the user can be selected when the skill level of all types of the game character reaches an upper limit.
    Type: Grant
    Filed: June 11, 2020
    Date of Patent: November 30, 2021
    Assignee: Nintendo Co., Ltd.
    Inventors: Norihito Ito, Tomoya Masuda, Shotaro Ito
  • Patent number: 11006530
    Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: May 11, 2021
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keisuke Okumura, Eiji Toyoda, Shotaro Masuda
  • Publication number: 20210055249
    Abstract: The present invention provides an electrode material for a sensor, the material includes a sheet-like carbon nanotube assembly including a plurality of carbon nanotubes, wherein a length of each carbon nanotube extends from one surface of the carbon nanotube assembly toward the other surface thereof, and the carbon nanotube assembly includes a low orientation portion of the carbon nanotubes.
    Type: Application
    Filed: January 21, 2019
    Publication date: February 25, 2021
    Inventors: Takashi ODA, Shotaro MASUDA
  • Publication number: 20210032106
    Abstract: The present invention has an object to provide a carbon nanotube aggregate exhibiting excellent grip force in room temperature and high temperature environments. The present invention relates to a carbon nanotube aggregate comprising a plurality of carbon nanotubes aggregated in a sheet form, wherein a degree of orientation in a middle part is less than 84%, and a degree of orientation in at least one surface part is 15% or more.
    Type: Application
    Filed: January 29, 2019
    Publication date: February 4, 2021
    Inventor: Shotaro MASUDA
  • Patent number: 10879103
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: December 29, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Patent number: 10796941
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: October 6, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Patent number: 10777446
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 ?m or more transferred onto the silicon wafer is 100 particles/cm2 or less.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: September 15, 2020
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Tomoaki Ichikawa, Yohei Maeno
  • Publication number: 20200048093
    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force in a wide temperature range including high-temperature conditions. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate satisfies the following condition for FFM differential voltages when a frictional curve is obtained by scanning a front surface and/or a back surface of the carbon nanotube aggregate with a probe of a scanning probe microscope under a state in which the probe is brought into contact therewith: a ratio of an FFM differential voltage at 210° C. to an FFM differential voltage at 25° C. is from 0.3 to 5.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 13, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Publication number: 20200039826
    Abstract: Provided is a carbon nanotube aggregate excellent in gripping force. The carbon nanotube aggregate of the present invention is a carbon nanotube aggregate of a sheet shape, including a plurality of carbon nanotubes, wherein the carbon nanotube aggregate has a cohesive strength N of 3 nJ or more on a front surface and/or a back surface thereof, which is measured by a nanoindentation method with an indentation load of 500 ?N.
    Type: Application
    Filed: August 14, 2017
    Publication date: February 6, 2020
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Patent number: 10418161
    Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: September 17, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Hirofumi Ebe, Takashi Habu, Akihito Matsutomi
  • Patent number: 10373749
    Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.
    Type: Grant
    Filed: September 18, 2014
    Date of Patent: August 6, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shotaro Masuda, Hirofumi Ebe, Takashi Habu, Akihito Matsutomi
  • Publication number: 20190218426
    Abstract: Provided is a pressure-sensitive adhesive structure including a carbon nanotube aggregate formed on a base material in which carbon nanotubes forming the carbon nanotube aggregate are hardly detached. The pressure-sensitive adhesive structure of the present invention includes: a base material; an intermediate layer; and a carbon nanotube aggregate layer, wherein the carbon nanotube aggregate layer includes a plurality of carbon nanotube aggregates, wherein the intermediate layer includes a layer containing the carbon nanotubes and a fixing agent, and wherein the intermediate layer has a thickness of 100 nm or more.
    Type: Application
    Filed: August 2, 2017
    Publication date: July 18, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Publication number: 20190177165
    Abstract: Provided is a carbon nanotube aggregate that can maintain a sheet shape. The carbon nanotube aggregate of the present invention includes a plurality of carbon nanotubes, the carbon nanotube aggregate being formed into a sheet shape, wherein the carbon nanotube aggregate includes a non-aligned portion of the carbon nanotubes. In one embodiment, the carbon nanotube aggregate further includes an aligned portion of the carbon nanotubes. In one embodiment, the non-aligned portion is present at an end portion in a lengthwise direction of the carbon nanotube aggregate.
    Type: Application
    Filed: July 28, 2017
    Publication date: June 13, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yoshiharu HATAKEYAMA, Tomoaki ICHIKAWA, Shotaro MASUDA, Yohei MAENO
  • Publication number: 20190071265
    Abstract: Provided is a transport fixing jig that has a high gripping force, hardly contaminates an object to be processed (object to be transported), and is excellent in heat resistance. The transport fixing jig of the present invention includes: a first base material; a carbon nanotube aggregate; and an adhesive layer arranged between the first base material and the carbon nanotube aggregate, wherein the first base material and the carbon nanotube aggregate are bonded to each other via the adhesive layer, and wherein a ratio (adhesive layer/base material) between a linear expansion coefficient of the first base material and a linear expansion coefficient of the adhesive layer is from 0.7 to 1.8.
    Type: Application
    Filed: March 14, 2017
    Publication date: March 7, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO, Yoshiharu HATAKEYAMA
  • Publication number: 20190051550
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein a ratio of a plan view area of recessed portions occurring in a carbon nanotube aggregate-side surface of the mounting member to a total area of the carbon nanotube aggregate-side surface is 5% or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: February 14, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Patent number: 10194861
    Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: February 5, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Keisuke Okumura, Eiji Toyoda, Shotaro Masuda
  • Publication number: 20190035672
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming amounting surface, wherein a standard deviation of diameters of the carbon nanotubes is 3 nm or less. In one embodiment of the present invention, the mounting member includes an aggregate of carbon nanotubes for forming a mounting surface, wherein the aggregate of the carbon nanotubes includes carbon nanotubes each having a multi-walled structure, and wherein a standard deviation of wall numbers of the carbon nanotubes is 3 or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: January 31, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Publication number: 20190027395
    Abstract: Provided is a mounting member that is excellent in low dusting property and hardly contaminates an object to be mounted while being excellent in gripping force and heat resistance. The mounting member of the present invention includes an aggregate of carbon nanotubes for forming a mounting surface, wherein when the mounting member is placed on a silicon wafer so that a carbon nanotube aggregate-side surface thereof is brought into contact with the silicon wafer, and the resultant is left to stand for 30 seconds while a load of 100 g is applied from above the mounting member, a number of particles each having a diameter of 0.2 ?m or more transferred onto the silicon wafer is 100 particles/cm2 or less.
    Type: Application
    Filed: January 10, 2017
    Publication date: January 24, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shotaro MASUDA, Tomoaki ICHIKAWA, Yohei MAENO
  • Patent number: 10120146
    Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 6, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
  • Publication number: 20180192948
    Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.
    Type: Application
    Filed: June 1, 2016
    Publication date: July 12, 2018
    Applicant: NITTO DENKO CORPORATION
    Inventors: Keisuke OKUMURA, Eiji TOYODA, Shotaro MASUDA