Patents by Inventor Shotaro Masuda
Shotaro Masuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10120146Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.Type: GrantFiled: March 7, 2014Date of Patent: November 6, 2018Assignee: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
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Publication number: 20180199443Abstract: A method for producing a wired circuit board includes a step (1) of forming a seed layer on one surface in a thickness direction of a peeling layer, a step (2) of forming a conductive pattern on one surface in the thickness direction of the seed layer, a step (3) of covering the seed layer and the conductive pattern with an insulating layer, a step (4) of peeling the peeling layer from the seed layer, and a step (5) of removing the seed layer. The insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: ApplicationFiled: June 1, 2016Publication date: July 12, 2018Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Eiji TOYODA, Shotaro MASUDA
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Publication number: 20180192948Abstract: A wired circuit board includes an insulating layer and a conductive pattern embedded in the insulating layer. The conductive pattern has an exposed surface exposed from one surface in a thickness direction of the insulating layer and the insulating layer has the number of times of folding endurance measured in conformity with JIS P8115 (2001) of 10 times or more.Type: ApplicationFiled: June 1, 2016Publication date: July 12, 2018Applicant: NITTO DENKO CORPORATIONInventors: Keisuke OKUMURA, Eiji TOYODA, Shotaro MASUDA
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Patent number: 9843216Abstract: A first coil portion is formed in a first coil region of an upper surface of an insulating layer, and a second coil portion is formed on a lower surface of the insulating layer. A second terminal is formed at a position outside the first coil region. One or more intersection regions, in which a path, extending from an inner end of the first coil portion to the second terminal, intersects the first coil portion, are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one portion and another portion of the first coil portion parted in said each intersection region and extends from the inner end of the first coil portion to the second terminal. The first coil portion and the second coil portion are connected together in parallel via through holes formed in the insulating layer.Type: GrantFiled: April 3, 2014Date of Patent: December 12, 2017Assignee: NITTO DENKO CORPORATIONInventors: Tadao Ookawa, Emiko Tani, Akihito Matsutomi, Shotaro Masuda
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Publication number: 20160247612Abstract: A soft magnetic resin composition contains flat soft magnetic particles and a resin component, and the soft magnetic particles have a tap density of 1.1 g/cm3 or less.Type: ApplicationFiled: September 18, 2014Publication date: August 25, 2016Applicant: NITTO DENKO CORPORATIONInventors: Hirofumi EBE, Takashi HABU, Akihito MATSUTOMI, Shotaro MASUDA
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Publication number: 20160211061Abstract: Soft magnetic particle powder is soft magnetic particle powder composed of flat soft magnetic particles, and the soft magnetic particle powder has a particle size D10 and a particle size D50 measured with a laser diffraction particle size distribution analyzer satisfying formula below: D10/D50>0.30.Type: ApplicationFiled: September 18, 2014Publication date: July 21, 2016Applicant: NITTO DENKO CORPORATIONInventors: Shotaro MASUDA, Hirofumi EBE, Takashi HABU, Akihito MATSUTOMI
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Patent number: 9395505Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.Type: GrantFiled: December 11, 2013Date of Patent: July 19, 2016Assignee: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita, Naoyuki Tanaka, Shotaro Masuda
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Publication number: 20160116690Abstract: An opto-electric hybrid module is provided, which is configured so that no air bubbles are present in a sealing resin which seals a space defined between an optical waveguide and an optical element. In the opto-electric hybrid module, an electric circuit is provided directly on an over-cladding layer of the optical waveguide, and the optical element is provided on predetermined portions (mounting pads) of the electric circuit. The over-cladding layer has a projection which covers a core, and a center portion of the optical element is positioned above the projection with the intervention of a sealing resin.Type: ApplicationFiled: March 31, 2014Publication date: April 28, 2016Applicant: NITTO DENKO CORPORATIONInventors: Naoyuki Tanaka, Naoki Shibata, Yuichi Tsujita, Shotaro Masuda
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Publication number: 20160094082Abstract: A first coil portion is formed on a first coil region of an upper surface, and a second coil portion is formed on a lower surface, of an insulating layer. A second terminal is formed at a position outside of the first coil region. One or plurality of intersection regions in which a path extending from an inner end of the first coil portion to the second terminal intersects with the first coil portion are provided on the upper surface. The first coil portion is parted in each intersection region. A second lead portion passes between one and the other portions of the first coil portion parted in each intersection region and extends from the inner end of the first coil portion to the second terminal. The first and second coil portions are connected in parallel to each other via a plurality of through holes formed in the insulating layer.Type: ApplicationFiled: April 3, 2014Publication date: March 31, 2016Inventors: Tadao OOKAWA, Emiko TANI, Akihito MATSUTOMI, Shotaro MASUDA
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Patent number: 9297958Abstract: An opto-electric hybrid board includes: an electric circuit board including an insulative layer, and an element mounting electrode formed on the front surface of the insulative layer; an optical element mounted on the element mounting electrode by contact frictional heat; and an optical waveguide including a first cladding layer in contact with the back surface of the insulative layer of the electric circuit board. Between the insulative layer and the first cladding layer, a reinforcing layer is provided at the portion corresponding to the element mounting electrode. A reinforcing layer is provided at the portion corresponding to the element mounting electrode, in the surface of the first cladding layer, which is on the side opposite to the insulative layer. The resin-made reinforcing layer is greater than the first cladding layer in storage modulus at the temperature of the board when the element is being mounted.Type: GrantFiled: October 3, 2013Date of Patent: March 29, 2016Assignee: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Toshikazu Baba, Shotaro Masuda
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Publication number: 20160070075Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. This opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit 2 includes recesses for fitting engagement with the aligning protrusion, the recesses being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide.Type: ApplicationFiled: March 7, 2014Publication date: March 10, 2016Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Naoki Shibata, Naoyuki Tanaka, Shotaro Masuda
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Patent number: 9274273Abstract: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.Type: GrantFiled: July 26, 2013Date of Patent: March 1, 2016Assignee: NITTO DENKO CORPORATIONInventors: Shotaro Masuda, Toshikazu Baba, Yasuto Ishimaru
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Publication number: 20150355422Abstract: There is provided an opto-electric hybrid module in which an optical element of an optical element unit and a core of an optical waveguide of an opto-electric hybrid unit are aligned with each other simply and precisely. The opto-electric hybrid module includes: a connector including an optical element; and an opto-electric hybrid unit including an electric circuit board and an optical waveguide which are stacked together. The connector includes aligning protrusions positioned and formed in a predetermined position with respect to the optical element. The opto-electric hybrid unit includes fitting holes for fitting engagement with the aligning protrusion, the fitting holes being positioned and formed in a predetermined position with respect to an end surface of a core of the optical waveguide. The connector and the opto-electric hybrid unit are coupled together.Type: ApplicationFiled: December 11, 2013Publication date: December 10, 2015Applicant: NITTO DENKO CORPORATIONInventors: Naoki Shibata, Yuichi Tsujita, Naoyuki Tanaka, Shotaro Masuda
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Patent number: 8837874Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.Type: GrantFiled: April 19, 2013Date of Patent: September 16, 2014Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Yasuto Ishimaru, Hiroyuki Hanazono, Naoyuki Tanaka, Yasufumi Yamamoto, Shotaro Masuda, Mayu Ozaki
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Patent number: 8768114Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.Type: GrantFiled: February 25, 2013Date of Patent: July 1, 2014Assignee: Nitto Denko CorporationInventors: Yuichi Tsujita, Yasuto Ishimura, Hiroyuki Hanazono, Naoyuki Tanaka, Yasufumi Yamamoto, Shotaro Masuda, Mayu Ozaki
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Publication number: 20140147076Abstract: An opto-electric hybrid board includes: an electric circuit board including an insulative layer, and an element mounting electrode formed on the front surface of the insulative layer; an optical element mounted on the element mounting electrode by contact frictional heat; and an optical waveguide including a first cladding layer in contact with the back surface of the insulative layer of the electric circuit board. Between the insulative layer and the first cladding layer, a reinforcing layer is provided at the portion corresponding to the element mounting electrode. A reinforcing layer is provided at the portion corresponding to the element mounting electrode, in the surface of the first cladding layer, which is on the side opposite to the insulative layer. The resin-made reinforcing layer is greater than the first cladding layer in storage modulus at the temperature of the board when the element is being mounted.Type: ApplicationFiled: October 3, 2013Publication date: May 29, 2014Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Toshikazu Baba, Shotaro Masuda
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Publication number: 20140126857Abstract: An opto-electric hybrid board which is capable of significantly reducing stresses applied to a bent portion thereof is provided. The opto-electric hybrid board includes a stacked electric circuit board and an optical waveguide. The electric circuit board includes an insulative layer having front and back surfaces, electrical interconnect lines formed on the front surface of the insulative layer, and an insulative coverlay formed on the front surface of the insulative layer and for covering and protecting the electrical interconnect lines. The optical waveguide includes a first cladding layer having a front surface, cores formed in a pattern on the front surface of the first cladding layer, and a second cladding layer covering the cores. Part of the opto-electric hybrid board is defined as a to-be-bent portion in which the coverlay and the optical waveguide are disposed in non-overlapping relation.Type: ApplicationFiled: July 26, 2013Publication date: May 8, 2014Applicant: NITTO DENKO CORPORATIONInventors: Shotaro Masuda, Toshikazu Baba, Yasuto Ishimaru
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Publication number: 20130301980Abstract: An opto-electric hybrid board capable of suppressing the increase in light propagation losses and excellent in flexibility, and a method of manufacturing the same, are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer. The metal layer is formed between the cladding layer and the insulative layer. At least part of the metal layer is formed in one of first and second patterns. The first pattern includes a distribution of dot-shaped protrusions, and the second pattern includes a distribution of dot-shaped recesses. A first cladding layer fills a site where the metal layer is removed by the patterning.Type: ApplicationFiled: April 19, 2013Publication date: November 14, 2013Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Yasuto Ishimaru, Hiroyuki Hanazono, Naoyuki Tanaka, Yasufumi Yamamoto, Shotaro Masuda, Mayu Ozaki
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Publication number: 20130243370Abstract: An opto-electric hybrid board which is capable of suppressing the increase in light propagation losses and which is excellent in flexibility, and a method of manufacturing the same are provided. The opto-electric hybrid board includes an electric circuit board, an optical waveguide, and a metal layer. The electric circuit board includes an insulative layer having front and back surfaces, and electrical interconnect lines formed on the front surface of the insulative layer. The optical waveguide is formed on the back surface of the insulative layer of the electric circuit board. The metal layer is formed between the optical waveguide and the back surface of the insulative layer of the electric circuit board. The metal layer is patterned to have a plurality of strips. Cores of the optical waveguide are disposed in a position corresponding to a site where the metal layer is removed by the patterning.Type: ApplicationFiled: February 25, 2013Publication date: September 19, 2013Applicant: NITTO DENKO CORPORATIONInventors: Yuichi Tsujita, Yasuto Ishimaru, Hiroyuki Hanazono, Naoyuki Tanaka, Yasufumi Yamamoto, Shotaro Masuda, Mayu Ozaki